Selective deposition process for physical vapor deposition
    10.
    发明授权
    Selective deposition process for physical vapor deposition 失效
    物理气相沉积的选择性沉积工艺

    公开(公告)号:US5064681A

    公开(公告)日:1991-11-12

    申请号:US364071

    申请日:1989-06-08

    摘要: The invention relates to a dry method for depositing a material on a substrate having nucleating sites for the material which includes deposition of a material in the vapor phase on the substrate and simultaneous ablation of the substrate by ablation methods for controlled removal of the nucleating sites from the substrate. The removal of the nucleating sites is controlled to minimize or selectively prevent coating of the substrate by the material. The method can be used to form material patterns on the substrate such as electrical circuits or for adhering material to a substrate that is difficult to metallize such as organic polymers or ceramics.

    摘要翻译: 本发明涉及一种用于在材料上沉积材料的干法,该材料具有用于材料的成核位置,该材料包括在衬底上沉积气相中的材料,并通过消融方法同时消除基底,从而控制将成核位点从 底物。 控制成核部位的去除以最小化或选择性地防止材料对基材的涂覆。 该方法可以用于在诸如电路的基板上形成材料图案,或用于将材料粘附到难以金属化的基板上,例如有机聚合物或陶瓷。