公开(公告)号：US4556797A

公开(公告)日：1985-12-03

申请号：US530044

申请日：1983-09-07

申请人： Asahiro Kuni ,  Toshimitsu Hamada ,  Hiroshi Makihira ,  Kazushi Yoshimura

发明人： Asahiro Kuni ,  Toshimitsu Hamada ,  Hiroshi Makihira ,  Kazushi Yoshimura

IPC分类号： H01L21/66 ,  G01B7/00 ,  G01B15/04 ,  H01J37/28 ,  H01L21/027 ,  H01J37/00

CPC分类号： G01B15/04 ,  H01J37/28

摘要： In a method and apparatus for detecting the edge of a fine pattern formed on a specimen such as a fine circuit pattern formed on a semiconductor element or the like, there is prepared a predetermined model waveform based on theoretical secondary electron emission from the edge portion. Secondary electrons emitted from successive scanning points across the pattern edge portion through the irradiation of a scanning electron beam thereonto are detected to produce an actual signal waveform reflecting the secondary electron emission from the pattern edge portion. The actual signal waveform is compared with the model waveform, and one of the scanning points at which the highest coincidence exists between both the actual and model waveforms, is determined as a position of the pattern edge.

摘要翻译： 在形成在半导体元件等上形成的精细电路图案的试样上形成的精细图案的边缘的方法和装置中，根据来自边缘部分的理论二次电子发射，制备预定的模型波形。 检测从连续的扫描点通过扫描电子束照射到图案边缘部分的二次电子，以产生反映来自图案边缘部分的二次电子发射的实际信号波形。 将实际信号波形与模型波形进行比较，确定实际波形和模型波形之间存在最高一致性的扫描点之一，作为图形边缘的位置。

公开(公告)号：US4213117A

公开(公告)日：1980-07-15

申请号：US964353

申请日：1978-11-28

申请人： Yukio Kembo ,  Asahiro Kuni ,  Hiroshi Makihira

发明人： Yukio Kembo ,  Asahiro Kuni ,  Hiroshi Makihira

IPC分类号： H01L23/544 ,  G06K9/04

CPC分类号： H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002

摘要： A method and apparatus for detecting positions of chips on a semiconductor wafer. The method comprises an illuminating step for illuminating obliquely the semiconductor wafer from above including at least a position detecting direction; a totalizing step for optically totalizing, when the irregular reflecting rays reflecting at the semiconductor wafer illuminated at the illuminating step are photographed by an image pickup element or device, the irregular reflecting rays in the direction normal to the position detecting direction or for electrically totalizing the levels of a video signal produced by the image pickup element or device in the same direction; a video signal detecting step for producing a video signal with coordinates lying in the position detecting direction by photographing an image resulting from optical totalization at the totalizing step by the image pickup element or device or electrically totalizing the image; and a street position detecting step for detecting a street position between chips by extracting a specific coordinate with a wide width and a low level corresponding to dark from the video signal produced at the video signal detecting step. The apparatus executes the above-mentioned method.

摘要翻译： 一种用于检测半导体晶片上的芯片位置的方法和装置。 该方法包括用于从至少位置检测方向从上方倾斜地照射半导体晶片的照明步骤; 当在照明步骤照射的半导体晶片处反射的不规则反射光线被图像拾取元件或器件拍摄时，在垂直于位置检测方向的方向上的不规则反射光线或用于电气地将 由图像拾取元件或装置在相同方向上产生的视频信号的电平; 视频信号检测步骤，用于通过拍摄由图像拾取元件或装置的累积步骤产生的由光学累积得到的图像，或者电子地对图像进行电积分，产生具有处于位置检测方向的坐标的视频信号; 以及街道位置检测步骤，用于通过从视频信号检测步骤中产生的视频信号提取具有与深度对应的宽宽度和低电平的特定坐标来检测码片之间的街道位置。 该装置执行上述方法。

公开(公告)号：US4226539A

公开(公告)日：1980-10-07

申请号：US863345

申请日：1977-12-22

申请人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Toshimitsu Hamada

发明人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Toshimitsu Hamada

IPC分类号： G01N21/952 ,  G06G7/186 ,  G06G7/48 ,  G01N21/48

CPC分类号： G01N21/952 ,  G06G7/1865 ,  G06G7/48

摘要： An automatic cylindrical body appearance inspection apparatus comprises a cylindrical body appearance detecting device including rotating means for rotating the cylindrical body around its axis at a constant speed and detecting means for optically picking up an image of a cylindrical surface of the cylindrical body rotated by the rotating means and one-dimensionally scanning the image on a plane of real image thereof in a predetermined direction to extract a base line of the cylindrical surface of the cylindrical body as an image signal, an end surface appearance detecting device including a pair of detecting means each for optically picking up an image of each of opposite end surfaces of the cylindrical body and one-dimensionally scanning the image on a plane of real image thereof in a direction transverse to the predetermined direction to extract an image signal, transporting means for transporting the cylindrical body while it is positioned, from the cylindrical surface appearance detecting means to the end surface appearance detecting means and determining means for determining pass or fail or grade of a defect pattern on the surfaces of the cylindrical body based on the image signals derived from the cylindrical surface appearance detecting device and the end surface appearance detecting device, whereby the appearance of the cylindrical surface and the end surfaces of the cylindrical body under test is automatically inspected.

摘要翻译： 一种自动圆柱体外观检查装置，包括：圆筒体外观检测装置，包括用于以恒定速度旋转圆筒体绕其轴线的旋转装置;以及检测装置，用于光学地拾取由旋转的旋转体旋转的圆筒体的圆柱形表面的图像 在预定方向上对其图像的平面进行一维扫描，提取圆筒体的圆筒形表面的基线作为图像信号;端面外观检测装置，其包括一对检测装置 用于光学拾取圆柱体的每个相对端面的图像，并在垂直于预定方向的方向上在其实像平面上一维扫描图像以提取图像信号;传送装置，用于传送圆柱形 身体定位时，从圆柱形表面外观d 基于来自圆筒形外观检测装置和端面外观检测装置的图像信号，确定装置，用于确定圆筒体的表面上的缺陷图形的通过或失败或等级 由此自动检查圆柱形表面和待测筒状体的端面的外观。

公开(公告)号：US4403294A

公开(公告)日：1983-09-06

申请号：US211113

申请日：1980-11-28

申请人： Toshimitsu Hamada ,  Hiroshi Makihira ,  Yasuo Nakagawa ,  Makoto Udaka

发明人： Toshimitsu Hamada ,  Hiroshi Makihira ,  Yasuo Nakagawa ,  Makoto Udaka

IPC分类号： G01B11/00 ,  G01B11/24 ,  G01B11/30 ,  G01N21/88 ,  G06T1/00 ,  G06T7/00 ,  G01N21/48

CPC分类号： G01N21/88 ,  G06T7/001 ,  G06T2207/30164

摘要： A surface defect inspection system comprises an image pick-up device for picking up an image by sequentially scanning the surface of an object two-dimensionally, a threshold circuit for quantizing the image signal produced from the image pick-up device as a binary code, a pattern feature extracting device for making calculations for extracting the features of image patterns from the quantized signal in synchronism with the scanning, and for temporarily storing the result of the calculations, a pattern region end decision device for deciding that individual pattern regions have ended in one direction, and a defect decision device for reading out from the pattern feature extracting device the result of the calculations on the pattern features corresponding to the positions each of the patterns in the direction perpendicular to the one direction each time of the decision that each pattern region has ended, so that the feature of each pattern scanned is compared with a predetermined reference, thus deciding and an indication of producing the presence or absence of a defect.

摘要翻译： 表面缺陷检查系统包括用于通过二维顺序地扫描对象的表面来拾取图像的图像拾取装置，用于量化由图像拾取装置产生的图像信号作为二进制代码的阈值电路， 图案特征提取装置，用于进行与扫描同步地从量化信号中提取图像图案的特征的计算，并且用于临时存储计算结果;图案区域结束判定装置，用于决定各个图案区域已经结束 一个方向，以及缺陷判定装置，用于从每个图案特征提取装置的每个图案每次都从与图形特征相对应的图案特征相对应的图案特征提取装置读出与每个方向垂直的方向上的位置的计算结果 区域已经结束，使得所扫描的每个图案的特征与预定的裁剪进行比较 因此，决定和产生缺陷的存在或缺失的指示。

公开(公告)号：US4410278A

公开(公告)日：1983-10-18

申请号：US170181

申请日：1980-07-18

申请人： Hiroshi Makihira ,  Yasuo Nakagawa ,  Toshimitsu Hamada ,  Makoto Udaka

发明人： Hiroshi Makihira ,  Yasuo Nakagawa ,  Toshimitsu Hamada ,  Makoto Udaka

IPC分类号： G01N21/952 ,  G01N21/55 ,  G01N21/88

CPC分类号： G01N21/952

摘要： An apparatus for inspecting the outer peripheral surface of a cylindrical object is disclosed, in which the light in slit form is radiated on the surface of an object such as a nuclear fuel pellet at an angle thereto, the light regularly reflected on the surface is detected by a detector, the detected image signal is quantized at threshold values higher and lower than an average level, and the binary signals are used to detect surface losses separately from an unground part and a metal inclusion as a first detection process. The diffused light is radiated onto the surface of the nuclear fuel pellet at an angle thereto, parallel light rays are radiated onto the surface from the direction perpendicular thereto, the light reflected from the surface of the object is detected by a detector from the direction perpendicular to the surface, the detected image signal is quantized at a threshold level lower than an average level of the image signal for the normal surface, and the binary signal is used to detect, as a second detection process, a crack and a pit separately from a chip, said crack, pit or chip included in surface missing defects detected in said first detection process. The surface defects of the nuclear fuel pellet or the like are thus detected by separating them into at least three types including a chip, an unground part and a metal inclusion, and a crack and a pit.

摘要翻译： 公开了一种用于检查圆柱形物体的外周表面的装置，其中狭缝形式的光以与其成角度的核燃料芯片的物体的表面上辐射，检测到表面上规则反射的光 通过检测器，检测到的图像信号在高于和低于平均电平的阈值处被量化，并且二进制信号用于与未接地部分和金属夹杂物分开地检测表面损耗作为第一检测处理。 散射光与核燃料芯块的表面成角度地辐射，平行的光线从与其垂直的方向辐射到表面上，从物体的表面反射的光由检测器从垂直的方向 检测到的图像信号在比正常表面的图像信号的平均电平低的阈值处被量化，并且二进制信号用于作为第二检测处理分别检测裂纹和凹坑 在所述第一检测过程中检测到的表面缺失缺陷中包含的裂纹，凹坑或芯片的芯片。 因此，通过将核燃料粒子等的表面缺陷分离为包括芯片，未研磨部分和金属夹杂物以及裂纹和凹坑中的至少三种类型来检测。

公开(公告)号：US4791586A

公开(公告)日：1988-12-13

申请号：US812928

申请日：1985-12-23

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： H01L21/66 ,  G06T7/00 ,  G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

摘要： Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.

摘要翻译： 用于检查具有相同功能的IC结构的多层图案的几何形状的方法和装置，每个多层图案包括布置在不同层级中的层图案，其中对应于多层图案中的任何两个的电图像信号 并且具有两个以上的级别彼此登记，然后进行比较以确定不匹配和匹配的部分。 登记的电图像信号的比较可以相对于它们的振幅或梯度进行。 对于所有的层图案，可以对匹配的部分不再进行注册和比较来重复两个电图像信号的配准和比较。 如果有的话，经过所述登记和比较的电子图像信号的最终不匹配的部分产生缺陷检测信号。

公开(公告)号：US4343553A

公开(公告)日：1982-08-10

申请号：US181768

申请日：1980-08-27

申请人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Yoshitada Oshida ,  Nobuyuki Akiyama

发明人： Yasuo Nakagawa ,  Hiroshi Makihira ,  Yoshitada Oshida ,  Nobuyuki Akiyama

IPC分类号： G01B11/25 ,  G01B11/00

CPC分类号： G01B11/2545

摘要： A shape detecting apparatus comprises a slit projecting means for projecting a slit image on a three-dimensional object such as a soldered area, a positioning means for positioning the three-dimensional object relative to the slit projecting means, an image pickup means for two-dimensionally scanning the slit image projected by the slit projecting means to pickup the image, a light segment extracting circuit including a center position extracting means for extracting a mean position (Z.sub.1 +Z.sub.2)/2 of two position signals Z.sub.1 and Z.sub.2 at which a video signal derived by transversely scanning the slit image by the image pickup means corresponds, to a first higher reference V.sub.1 when the video signal exceeds the first higher reference V.sub.1, a maximum value position extracting circuit for extracting a position Z corresponding to a maximum value of the video signal when the maximum value of the video signal is no higher than the first higher reference V.sub.1 and exceeds a second lower reference V.sub.2 and an erasing means for erasing the position signal when the maximum value of the video signal is no higher than the second lower reference V.sub.2, and a detecting means for detecting undersoldered condition and oversoldered condition by analyzing and evaluating the three-dimensional object based on the light segment position information derived from the light segment extracting circuit.

摘要翻译： 一种形状检测装置，包括：狭缝突出装置，用于将缝合图像投射在诸如焊接区域的三维物体上;定位装置，用于相对于狭缝突出装置定位三维物体;图像拾取装置， 对由狭缝投影装置投影的狭缝图像进行二维扫描以拾取图像;光段提取电路，包括中心位置提取装置，用于提取两个位置信号Z1和Z2的平均位置（Z1 + Z2）/ 2， 通过图像拾取装置横向扫描狭缝图像导出的信号对应于当视频信号超过第一较高参考值V1时的第一较高参考V1，最大值位置提取电路，用于提取对应于最大值的位置Z 当视频信号的最大值不高于第一较高参考V1并且超过第二较低参考值V2和呃时，视频信号 当视频信号的最大值不高于第二较低参考值V2时，用于擦除位置信号的灰度装置;以及检测装置，用于通过基于光段对三维物体进行分析和评估来检测底部状态和过弯状态 从光段提取电路得到的位置信息。

公开(公告)号：US06674890B2

公开(公告)日：2004-01-06

申请号：US09733092

申请日：2000-12-11

申请人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

发明人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

IPC分类号： G06K900

CPC分类号： G06T7/001 ,  G01R31/308 ,  G01R31/311 ,  G03F7/7065 ,  G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30121 ,  G06T2207/30148

摘要： A pattern inspection method and apparatus in which an image of a first pattern formed on a sample and an image of a second pattern formed on the sample is detected. At least one of the first pattern image and the second pattern image is converted to a gray level so as to be substantially the same with each other by linear combination including a gain and offset. A defect of the sample is detected by using the first pattern image and the second pattern image at least one of which has been converted to the gray level and a result of the detection is outputted to an external storage or processor by a communication arrangement.

摘要翻译： 检测形成在样本上的第一图案的图像和形成在样本上的第二图案的图像的图案检查方法和装置。 第一图案图像和第二图案图像中的至少一个被转换为灰度级，以便通过包括增益和偏移的线性组合彼此基本相同。 通过使用第一图案图像和其中至少一个已经被转换为灰度级的第二图案图像和通过通信装置将检测结果输出到外部存储器或处理器来检测样本的缺陷。

公开(公告)号：US07221486B2

公开(公告)日：2007-05-22

申请号：US10265659

申请日：2002-10-08

申请人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

发明人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

IPC分类号： H04N1/04

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： A method and apparatus for sensing by a linear image sensor a two-dimensional image of an object to be sensed includes detecting a position of the object by a position sensor having a first resolution, picking up an image of the object being projected in a direction (V-scan direction) generally perpendicular to an internal scan (H-scan) direction of the linear image sensor in synchronism with relative movement between the object and the linear image sensor, periodically switching a pixel size along the V-scan direction between a plurality of predefined pixel sizes during the relative movement between the object and the linear image sensor in accordance with information of the relative movement detected by the position sensor, and producing from an output of the linear image sensor a two-dimensional image of the projected image having a second resolution of the object to be sensed. The second resolution is a higher resolution than the first resolution.

摘要翻译： 一种用于通过线性图像传感器检测待检测物体的二维图像的方法和装置包括通过具有第一分辨率的位置传感器检测物体的位置，拾取沿着方向投影的物体的图像 （V扫描方向），与物体和线性图像传感器之间的相对运动同步地与线性图像传感器的内部扫描（H扫描）方向大致垂直，周期性地沿着V扫描方向切换像素尺寸， 根据由位置传感器检测到的相对运动的信息，在物体和线性图像传感器之间的相对运动期间的多个预定像素尺寸，并且从线性图像传感器的输出产生投影图像的二维图像 具有要被感测的物体的第二分辨率。 第二项决议是比第一项决议更高的决议。

公开(公告)号：US06317512B1

公开(公告)日：2001-11-13

申请号：US08753011

申请日：1996-11-19

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Hiroshi Makihira ,  Takashi Hiroi

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Hiroshi Makihira ,  Takashi Hiroi

IPC分类号： G06K900

CPC分类号： G06T7/001 ,  G06T7/74 ,  G06T2207/30148

摘要： A pattern checking method wherein an image of a certain position of one pattern is detected; the detected image is positioned with respect to an image of a position corresponding to the certain position, in a reference pattern image; and the positioned images are compared with each other, whereby a discrepant place among these positioned images is judged as a defect the positioning operations of the images of the detected patterns are controlled based upon either pattern information such as density of the images of the detected patterns, or information obtained from the positioning operations for images of other positions in the patterns. An image sensor unit for detecting images of patterns is constructed which has such a structure that a plurality of one-dimensional image sensors functioning as a pattern detector are arranged in a two-dimensional form, and an output of a certain one-dimensional image sensor for imaging a certain position of one pattern is delayed for a predetermined time period, and also both of an output of an one-dimensional image sensor adjoining the first-mentioned one-dimensional image sensor, which images the same position of the same pattern, and the delayed output of the certain one-dimensional image sensor are sequentially added to derive a summation output. The image sensor unit is inclined at a predetermined angle with respect to a plane perpendicular to the reflection light from the patterns, and the reflection light from the patterns is focused via a confocal focusing optical system onto this image sensor unit.

摘要翻译： 一种图案检查方法，其中检测到一个图案的某个位置的图像; 检测图像相对于与特定位置对应的位置的图像在参考图案图像中定位; 并且定位的图像彼此进行比较，由此将这些定位的图像中的不一致的位置判断为检测图案的图像的定位操作的缺陷，基于诸如检测图案的图像的密度的图案信息 或者从图案中的其他位置的图像的定位操作获得的信息。 用于检测图案的图像的图像传感器单元被构造成具有以二维形式配置作为图案检测器的多个一维图像传感器的结构，以及某一个一维图像传感器的输出 对于一个图案的某个位置的成像被延迟预定的时间段，并且与相同图案的相同位置成像的第一个提到的一维图像传感器邻接的一维图像传感器的输出， 并且依次添加特定一维图像传感器的延迟输出以导出求和输出。 图像传感器单元相对于与图案的反射光垂直的平面以预定角度倾斜，并且来自图案的反射光经由共聚焦聚焦光学系统聚焦到该图像传感器单元上​​。