摘要:
A surface defect inspection system comprises an image pick-up device for picking up an image by sequentially scanning the surface of an object two-dimensionally, a threshold circuit for quantizing the image signal produced from the image pick-up device as a binary code, a pattern feature extracting device for making calculations for extracting the features of image patterns from the quantized signal in synchronism with the scanning, and for temporarily storing the result of the calculations, a pattern region end decision device for deciding that individual pattern regions have ended in one direction, and a defect decision device for reading out from the pattern feature extracting device the result of the calculations on the pattern features corresponding to the positions each of the patterns in the direction perpendicular to the one direction each time of the decision that each pattern region has ended, so that the feature of each pattern scanned is compared with a predetermined reference, thus deciding and an indication of producing the presence or absence of a defect.
摘要:
An apparatus for inspecting the outer peripheral surface of a cylindrical object is disclosed, in which the light in slit form is radiated on the surface of an object such as a nuclear fuel pellet at an angle thereto, the light regularly reflected on the surface is detected by a detector, the detected image signal is quantized at threshold values higher and lower than an average level, and the binary signals are used to detect surface losses separately from an unground part and a metal inclusion as a first detection process. The diffused light is radiated onto the surface of the nuclear fuel pellet at an angle thereto, parallel light rays are radiated onto the surface from the direction perpendicular thereto, the light reflected from the surface of the object is detected by a detector from the direction perpendicular to the surface, the detected image signal is quantized at a threshold level lower than an average level of the image signal for the normal surface, and the binary signal is used to detect, as a second detection process, a crack and a pit separately from a chip, said crack, pit or chip included in surface missing defects detected in said first detection process. The surface defects of the nuclear fuel pellet or the like are thus detected by separating them into at least three types including a chip, an unground part and a metal inclusion, and a crack and a pit.
摘要:
An automatic cylindrical body appearance inspection apparatus comprises a cylindrical body appearance detecting device including rotating means for rotating the cylindrical body around its axis at a constant speed and detecting means for optically picking up an image of a cylindrical surface of the cylindrical body rotated by the rotating means and one-dimensionally scanning the image on a plane of real image thereof in a predetermined direction to extract a base line of the cylindrical surface of the cylindrical body as an image signal, an end surface appearance detecting device including a pair of detecting means each for optically picking up an image of each of opposite end surfaces of the cylindrical body and one-dimensionally scanning the image on a plane of real image thereof in a direction transverse to the predetermined direction to extract an image signal, transporting means for transporting the cylindrical body while it is positioned, from the cylindrical surface appearance detecting means to the end surface appearance detecting means and determining means for determining pass or fail or grade of a defect pattern on the surfaces of the cylindrical body based on the image signals derived from the cylindrical surface appearance detecting device and the end surface appearance detecting device, whereby the appearance of the cylindrical surface and the end surfaces of the cylindrical body under test is automatically inspected.
摘要:
Disclosed is a shape detecting apparatus comprising a slit projector for projecting a slit bright line on a number of objects arrayed in a line, an image forming lens for forming the bright line image, an image scanning mechanism for the bright line image formed through the image forming lens in a height direction of the object and a one-dimensional image sensing device for self-scanning the bright line image formed therein with an array of image sensing elements orthogonal to the scanning direction by the image scanning mechanism.
摘要:
Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.
摘要:
A shape detecting apparatus comprises a slit projecting means for projecting a slit image on a three-dimensional object such as a soldered area, a positioning means for positioning the three-dimensional object relative to the slit projecting means, an image pickup means for two-dimensionally scanning the slit image projected by the slit projecting means to pickup the image, a light segment extracting circuit including a center position extracting means for extracting a mean position (Z.sub.1 +Z.sub.2)/2 of two position signals Z.sub.1 and Z.sub.2 at which a video signal derived by transversely scanning the slit image by the image pickup means corresponds, to a first higher reference V.sub.1 when the video signal exceeds the first higher reference V.sub.1, a maximum value position extracting circuit for extracting a position Z corresponding to a maximum value of the video signal when the maximum value of the video signal is no higher than the first higher reference V.sub.1 and exceeds a second lower reference V.sub.2 and an erasing means for erasing the position signal when the maximum value of the video signal is no higher than the second lower reference V.sub.2, and a detecting means for detecting undersoldered condition and oversoldered condition by analyzing and evaluating the three-dimensional object based on the light segment position information derived from the light segment extracting circuit.
摘要:
The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要:
In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.
摘要:
A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要:
An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.