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1.发明授权Method of inspecting articles using imaging inspection apparatus with directional cooling 有权使用具有定向冷却的成像检查装置检查物品的方法公开(公告)号：US07510324B2
公开(公告)日：2009-03-31
申请号：US11882473
申请日：2007-08-02
IPC分类号： H01J35/12
CPC分类号： G01N23/046 , G01N2223/419
摘要： A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
摘要翻译： 使用成像检查装置检查制品的方法，所述成像检查装置利用多个单独的成像装置将光束引导到其上具有物体的物品上，以根据建立的标准检测物体。 该方法涉及对发热成像装置进行增强的冷却，其中风扇将冷却流体引导到多个偏转器上，反过来将导流体引导到所选择的成像装置上。
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公开(公告)号：US07354197B2
公开(公告)日：2008-04-08
申请号：US11141494
申请日：2005-06-01
IPC分类号： H01J35/10 , H01J35/12 , H05G1/02 , G01N23/083
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.
摘要翻译： 一种成像检查装置，其利用位于框架上的多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。 该装置利用冷却结构为成像装置提供冷却。
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3.发明申请公开(公告)号：US20080144768A1
公开(公告)日：2008-06-19
申请号：US12071537
申请日：2008-02-22
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
摘要翻译： 一种制造成像检查装置的方法，其包括将多个单独的成像装置（例如，X射线计算机断层摄影扫描装置）定位在框架上，用于将束指向具有其中的物体的物品，以基于建立的标准检测物体。 该方法还包括以这样的方式提供冷却结构，以便在设备操作期间将冷却流体引导到成像装置上以冷却它们。
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4.发明授权公开(公告)号：US07490984B2
公开(公告)日：2009-02-17
申请号：US12071537
申请日：2008-02-22
IPC分类号： H01J35/10 , H01J35/12 , H05G1/02 , G01N23/083
CPC分类号： G01N23/046 , G01N2223/3103 , G01N2223/419 , G01N2223/643 , H01J2235/1262
摘要： A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.
摘要翻译： 一种制造成像检查装置的方法，其包括将多个单独的成像装置（例如，X射线计算机断层摄影扫描装置）定位在框架上，用于将束指向具有其中的物体的物品，以基于建立的标准检测物体。 该方法还包括以这样的方式提供冷却结构，以便在设备操作期间将冷却流体引导到成像装置上以冷却它们。
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5.发明申请Method of inspecting articles using imaging inspection apparatus with directional cooling 有权使用具有定向冷却的成像检查装置检查物品的方法公开(公告)号：US20080170670A1
公开(公告)日：2008-07-17
申请号：US11882473
申请日：2007-08-02
IPC分类号： H01J35/12
CPC分类号： G01N23/046 , G01N2223/419
摘要： A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.
摘要翻译： 使用成像检查装置检查制品的方法，所述成像检查装置利用多个单独的成像装置将光束引导到其上具有物体的物品上，以根据建立的标准检测物体。 该方法涉及对发热成像装置进行增强的冷却，其中风扇将冷却流体引导到多个偏转器上，反过来将导流体引导到所选择的成像装置上。
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公开(公告)号：US07261466B2
公开(公告)日：2007-08-28
申请号：US11141349
申请日：2005-06-01
CPC分类号： G01N23/046 , G01N2223/419
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.
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7.发明授权Method of making wirebond electronic package with enhanced chip pad design 失效制造具有增强的芯片焊盘设计的引线键合电子封装的方法公开(公告)号：US07510912B2
公开(公告)日：2009-03-31
申请号：US11822573
申请日：2007-07-09
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
摘要翻译： 一种制造引线键合电子封装的方法，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。 这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。 同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。
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8.发明授权Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same 失效具有增强的芯片焊盘设计的Wirebond电子封装，其制造方法以及利用它的信息处理系统公开(公告)号：US07253518B2
公开(公告)日：2007-08-07
申请号：US11152048
申请日：2005-06-15
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.
摘要翻译： 一种引线键合电子封装，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。 这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。 同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。 还提供了制造包装的方法，以及适于利用这种包装的信息处理系统（例如，计算机）。
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9.发明申请Method of making wirebond electronic package with enhanced chip pad design 失效制造具有增强的芯片焊盘设计的引线键合电子封装的方法公开(公告)号：US20070254408A1
公开(公告)日：2007-11-01
申请号：US11822573
申请日：2007-07-09
申请人： David Caletka , Varaprasad Calmidi , Sanjeev Sathe
发明人： David Caletka , Varaprasad Calmidi , Sanjeev Sathe
IPC分类号： H01L21/50
CPC分类号： H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/73265 , H01L2224/83385 , H01L2224/8385 , H01L2224/85447 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/0203 , H05K3/3436 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.
摘要翻译： 一种制造引线键合电子封装的方法，其包括结合到有机层叠基板的上表面的半导体芯片，该半导体芯片包括位于基板上并由多个导热同心线组成的热材料。 这些线在其操作期间形成芯片的热逸出路径，并且可以与其它元件结合操作以延伸热路径。 同心线还确保了衬底上足够的结合面积，以防止芯片与衬底分层，这可能与随后的处理（例如焊球重新流动）相关的高温期间可能发生。
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公开(公告)号：US20070009084A1
公开(公告)日：2007-01-11
申请号：US11141349
申请日：2005-06-01
IPC分类号： G01N23/04
CPC分类号： G01N23/046 , G01N2223/419
摘要： An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.
摘要翻译： 一种成像检查装置，其利用多个单独的成像装置（例如，X射线计算机断层摄影扫描装置），用于将光束引导到具有其中的物体的物品上，以根据建立的标准检测物体。 该装置利用冷却结构来引导冷却流体（例如空气）朝向和穿过该装置，该结构包括用于沿第一方向引导冷却流体的风扇和多个流体偏转器，用于使至少部分流体朝向相应的 一些设备。
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