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公开(公告)号：US09078376B2
公开(公告)日：2015-07-07
申请号：US13811497
申请日：2011-07-25
IPC分类号： H05K7/20 , H01L23/367 , H02M7/00 , H01L23/473 , H01L23/552 , H01L25/07 , H02M7/48
CPC分类号： H05K7/20 , H01L23/367 , H01L23/473 , H01L23/552 , H01L25/072 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H02M7/48 , H01L2924/00
摘要： A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.
摘要翻译： 电力转换装置包括：冷却基座5，其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部圆筒部13a，其中容纳有功率半导体元件，并且通过开口部50插入到流路51中;凸缘部13b，形成在圆筒部13a的开口上，并且是 固定在冷却基座5上，以封闭开口部分50;以及一组散热器散热片144，其安装在圆筒部分13a的外圆周表面上，具有形成在凸缘部分13b和 一组散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中，并且将冷却介质引入散热片144的一组中，同时防止冷却介质流动 进入间隙51c。
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公开(公告)号：US20130128646A1
公开(公告)日：2013-05-23
申请号：US13811497
申请日：2011-07-25
IPC分类号： H05K7/20
CPC分类号： H05K7/20 , H01L23/367 , H01L23/473 , H01L23/552 , H01L25/072 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H02M7/48 , H01L2924/00
摘要： A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.
摘要翻译： 电力转换装置包括：冷却基座5，其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部的圆筒部13a，其中容纳有功率半导体元件，并且通过开口部50插入到流路51中;凸缘部13b，形成在圆筒部13a的开口上，并且是 固定在冷却基座5上，以封闭开口部分50;以及一组散热器散热片144，其安装在圆筒部分13a的外圆周表面上，具有形成在凸缘部分13b和 一组散热器散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中，并将冷却介质引入散热片144的一组中，同时防止冷却介质流动 进入间隙51c。
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公开(公告)号：US20110049976A1
公开(公告)日：2011-03-03
申请号：US12858208
申请日：2010-08-17
IPC分类号： B60L1/00
CPC分类号： H05K7/20936 , H05K7/203
摘要： An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.
摘要翻译： 一种用于车辆的电力转换器，包括输出电动机驱动电流的半导体元件，驱动半导体元件的驱动电路，控制驱动电路的控制电路，使要输入的直流电流平滑的电容器 半导体元件，容纳半导体元件的容器，驱动电路，控制电路和电容器，在容器内以气液两相平衡状态保持的制冷剂，以及将制冷剂冷凝的热交换器单元 作为液相的气相并与外部进行热交换，其中半导体元件，驱动电路，控制电路和电容器以将离开半导体元件，驱动电路，控制电路和 将电力转换器安装在车辆中时，将电容器浸入制冷剂中，将热交换器单元配置在a 容器的壁的一侧形成气相空间。
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4.发明申请SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE 有权半导体功率模块，逆变器和制造功率模块的方法公开(公告)号：US20100208427A1
公开(公告)日：2010-08-19
申请号：US12707207
申请日：2010-02-17
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.
摘要翻译： 半导体功率模块包括安装有多个功率半导体器件的绝缘衬底和用于辐射由多个功率半导体器件产生的热量的散热器，其中散热器与多个功率半导体器件的一个表面上的多个辐射翅片一体地模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且散热器和绝缘基板以与一个相反的另一表面的金属接合 辐射翅片与散热片的底部形成的表面。
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5.发明授权Semiconductor power module, inverter, and method of manufacturing a power module 有权半导体功率模块，逆变器及制造电源模块的方法公开(公告)号：US08472188B2
公开(公告)日：2013-06-25
申请号：US12707207
申请日：2010-02-17
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.
摘要翻译： 半导体功率模块包括其上安装有多个功率半导体器件的绝缘衬底和用于散发由多个功率半导体器件产生的热量的散热器，其中散热器与多个辐射翅片在一个表面上整体模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且绝缘基板通过金属接合粘结到散热片的基部的另一个表面 与其上形成有辐射翅片的散热器的基部的一个表面相对。
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6.发明申请公开(公告)号：US20120050993A1
公开(公告)日：2012-03-01
申请号：US13213181
申请日：2011-08-19
申请人： Osamu SUZUKI , Yosuke Yasuda , Keisuke Horiuchi , Tomoo Hayashi , Atsuo Nishihara , Sunao Funakoshi
发明人： Osamu SUZUKI , Yosuke Yasuda , Keisuke Horiuchi , Tomoo Hayashi , Atsuo Nishihara , Sunao Funakoshi
CPC分类号： H05K7/20936 , B61C5/02 , B61C17/04 , F28D15/0233 , F28D15/0266 , F28F1/34 , F28F13/06 , H01L23/427 , H01L2924/0002 , H05K7/20927 , Y02T30/10 , H01L2924/00
摘要： A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.
摘要翻译： 一种用于车载电力转换器的冷却系统，其中散热表面平行于冷却风通风流动延伸，包括：包含冷却剂的冷却剂箱，冷却剂箱包括与散热表面热接触的底表面; 连接到所述冷却剂罐的上表面的第一管道，所述冷却剂流入所述第一管道; 热交换器，其包括与上表面相对布置的第二导管，并将冷却剂导向上游; 以及将冷却剂返回到冷却剂箱的返回单元; 其中所述热交换器包括散热翅片，所述冷却空气通道从第一侧向第二侧通过，所述散热翅片设置在所述第二导管的表面上，所述第一侧不面向所述冷却剂箱，所述第二侧面向所述第二侧 冷却液箱。
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7.发明授权公开(公告)号：US08879259B2
公开(公告)日：2014-11-04
申请号：US13213181
申请日：2011-08-19
申请人： Osamu Suzuki , Yosuke Yasuda , Keisuke Horiuchi , Tomoo Hayashi , Atsuo Nishihara , Sunao Funakoshi
发明人： Osamu Suzuki , Yosuke Yasuda , Keisuke Horiuchi , Tomoo Hayashi , Atsuo Nishihara , Sunao Funakoshi
CPC分类号： H05K7/20936 , B61C5/02 , B61C17/04 , F28D15/0233 , F28D15/0266 , F28F1/34 , F28F13/06 , H01L23/427 , H01L2924/0002 , H05K7/20927 , Y02T30/10 , H01L2924/00
摘要： A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.
摘要翻译： 一种用于车载电力转换器的冷却系统，其中散热表面平行于冷却风通风流动延伸，包括：包含冷却剂的冷却剂箱，冷却剂箱包括与散热表面热接触的底表面; 连接到所述冷却剂罐的上表面的第一管道，所述冷却剂流入所述第一管道; 热交换器，其包括与上表面相对布置的第二导管，并将冷却剂导向上游; 以及将冷却剂返回到冷却剂箱的返回单元; 其中所述热交换器包括散热翅片，所述冷却空气通道从第一侧向第二侧通过，所述散热翅片设置在所述第二导管的表面上，所述第一侧不面向所述冷却剂箱，所述第二侧面向所述第二侧 冷却液箱。
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公开(公告)号：US07957145B2
公开(公告)日：2011-06-07
申请号：US12858208
申请日：2010-08-17
IPC分类号： H05K7/20
CPC分类号： H05K7/20936 , H05K7/203
摘要： An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.
摘要翻译： 一种用于车辆的电力转换器，包括输出电动机驱动电流的半导体元件，驱动半导体元件的驱动电路，控制驱动电路的控制电路，使要输入的直流电流平滑的电容器 半导体元件，容纳半导体元件的容器，驱动电路，控制电路和电容器，在容器内以气液两相平衡状态保持的制冷剂，以及将制冷剂冷凝的热交换器单元 作为液相的气相并与外部进行热交换，其中半导体元件，驱动电路，控制电路和电容器以将离开半导体元件，驱动电路，控制电路和 将电力转换器安装在车辆中时，将电容器浸入制冷剂中，将热交换器单元配置在a 容器的壁的一侧形成气相空间。
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公开(公告)号：US20110032676A1
公开(公告)日：2011-02-10
申请号：US12759824
申请日：2010-04-14
申请人： Takeshi MATSUO , Haruki Hamada , Atsuo Nishihara , Masanori Musou
发明人： Takeshi MATSUO , Haruki Hamada , Atsuo Nishihara , Masanori Musou
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.
摘要翻译： 用于通过安装在汽车上的动力转换器供给冷却水的水路平行布置，在水路上分别形成开口，散热片从开口突出，开口由电源模块的底板 。 此外，功率模块的基板除了铜之外还包括金属以增加基板的硬度，从而抑制了用钎焊固定散热片时的平坦度的劣化。
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公开(公告)号：US06292365B1
公开(公告)日：2001-09-18
申请号：US09398036
申请日：1999-09-17
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L2224/73204 , H01L2924/09701
摘要： It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.
摘要翻译： 本发明的目的是提供一种电子设备的冷却器，其能够将半导体芯片保持在低温而不用冷凝，并且其紧凑性优异。 为了实现上述目的，本发明提出了一种电子设备，其中在靠近输入/输出引脚，半导体封装或模块和冷却器的一侧的半导体封装或模块的多层布线基板中内置加热区域 安装在包装或模块上的防潮壳体放置在防潮壳体，半导体封装件或模块与冷却器之间的间隙中，隔热材料填充在隔热材料的外周上， 。
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