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    Cooling System for Onboard Electrical Power Converter, and Electrical Power Converter for Railway Vehicle
    2.
    发明申请
    Cooling System for Onboard Electrical Power Converter, and Electrical Power Converter for Railway Vehicle 有权
    车载电力转换器冷却系统及铁路车辆电力转换器

    公开(公告)号：US20120050993A1

    公开(公告)日：2012-03-01

    申请号：US13213181

    申请日：2011-08-19

    申请人： Osamu SUZUKI ,  Yosuke Yasuda ,  Keisuke Horiuchi ,  Tomoo Hayashi ,  Atsuo Nishihara ,  Sunao Funakoshi

    发明人： Osamu SUZUKI ,  Yosuke Yasuda ,  Keisuke Horiuchi ,  Tomoo Hayashi ,  Atsuo Nishihara ,  Sunao Funakoshi

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/20936 ,  B61C5/02 ,  B61C17/04 ,  F28D15/0233 ,  F28D15/0266 ,  F28F1/34 ,  F28F13/06 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20927 ,  Y02T30/10 ,  H01L2924/00

    摘要： A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.

    摘要翻译： 一种用于车载电力转换器的冷却系统，其中散热表面平行于冷却风通风流动延伸，包括：包含冷却剂的冷却剂箱，冷却剂箱包括与散热表面热接触的底表面; 连接到所述冷却剂罐的上表面的第一管道，所述冷却剂流入所述第一管道; 热交换器，其包括与上表面相对布置的第二导管，并将冷却剂导向上游; 以及将冷却剂返回到冷却剂箱的返回单元; 其中所述热交换器包括散热翅片，所述冷却空气通道从第一侧向第二侧通过，所述散热翅片设置在所述第二导管的表面上，所述第一侧不面向所述冷却剂箱，所述第二侧面向所述第二侧 冷却液箱。

    Electric Power Converter
    3.
    发明申请
    Electric Power Converter 有权
    电力转换器

    公开(公告)号：US20110049976A1

    公开(公告)日：2011-03-03

    申请号：US12858208

    申请日：2010-08-17

    申请人： Osamu SUZUKI ,  Sunao Funakoshi ,  Keisuke Horiuchi ,  Atsuo Nishihara ,  Yosuke Yasuda

    发明人： Osamu SUZUKI ,  Sunao Funakoshi ,  Keisuke Horiuchi ,  Atsuo Nishihara ,  Yosuke Yasuda

    IPC分类号： B60L1/00

    CPC分类号： H05K7/20936 ,  H05K7/203

    摘要： An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.

    摘要翻译： 一种用于车辆的电力转换器，包括输出电动机驱动电流的半导体元件，驱动半导体元件的驱动电路，控制驱动电路的控制电路，使要输入的直流电流平滑的电容器 半导体元件，容纳半导体元件的容器，驱动电路，控制电路和电容器，在容器内以气液两相平衡状态保持的制冷剂，以及将制冷剂冷凝的热交换器单元 作为液相的气相并与外部进行热交换，其中半导体元件，驱动电路，控制电路和电容器以将离开半导体元件，驱动电路，控制电路和 将电力转换器安装在车辆中时，将电容器浸入制冷剂中，将热交换器单元配置在a 容器的壁的一侧形成气相空间。

    Electric power converter
    4.
    发明授权
    Electric power converter 有权
    电力转换器

    公开(公告)号：US07957145B2

    公开(公告)日：2011-06-07

    申请号：US12858208

    申请日：2010-08-17

    申请人： Osamu Suzuki ,  Sunao Funakoshi ,  Keisuke Horiuchi ,  Atsuo Nishihara ,  Yosuke Yasuda

    发明人： Osamu Suzuki ,  Sunao Funakoshi ,  Keisuke Horiuchi ,  Atsuo Nishihara ,  Yosuke Yasuda

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20936 ,  H05K7/203

    摘要： An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.

    摘要翻译： 一种用于车辆的电力转换器，包括输出电动机驱动电流的半导体元件，驱动半导体元件的驱动电路，控制驱动电路的控制电路，使要输入的直流电流平滑的电容器 半导体元件，容纳半导体元件的容器，驱动电路，控制电路和电容器，在容器内以气液两相平衡状态保持的制冷剂，以及将制冷剂冷凝的热交换器单元 作为液相的气相并与外部进行热交换，其中半导体元件，驱动电路，控制电路和电容器以将离开半导体元件，驱动电路，控制电路和 将电力转换器安装在车辆中时，将电容器浸入制冷剂中，将热交换器单元配置在a 容器的壁的一侧形成气相空间。

    SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE
    5.
    发明申请
    SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE 有权
    半导体功率模块，逆变器和制造功率模块的方法

    公开(公告)号：US20100208427A1

    公开(公告)日：2010-08-19

    申请号：US12707207

    申请日：2010-02-17

    申请人： Keisuke Horiuchi ,  Atsuo Nishihara ,  Hiroshi Hozoji ,  Michiaki Hiyoshi ,  Takehide Yokozuka

    发明人： Keisuke Horiuchi ,  Atsuo Nishihara ,  Hiroshi Hozoji ,  Michiaki Hiyoshi ,  Takehide Yokozuka

    IPC分类号： H05K7/20 ,  H01L21/00

    CPC分类号： H05K7/20927 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.

    摘要翻译： 半导体功率模块包括安装有多个功率半导体器件的绝缘衬底和用于辐射由多个功率半导体器件产生的热量的散热器，其中散热器与多个功率半导体器件的一个表面上的多个辐射翅片一体地模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且散热器和绝缘基板以与一个相反的另一表面的金属接合 辐射翅片与散热片的底部形成的表面。

    Power conversion device
    6.
    发明授权
    Power conversion device 有权
    电源转换装置

    公开(公告)号：US09078376B2

    公开(公告)日：2015-07-07

    申请号：US13811497

    申请日：2011-07-25

    申请人： Atsuo Nishihara ,  Kenichiro Nakajima ,  Keisuke Horiuchi

    发明人： Atsuo Nishihara ,  Kenichiro Nakajima ,  Keisuke Horiuchi

    IPC分类号： H05K7/20 ,  H01L23/367 ,  H02M7/00 ,  H01L23/473 ,  H01L23/552 ,  H01L25/07 ,  H02M7/48

    CPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/473 ,  H01L23/552 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H02M7/48 ,  H01L2924/00

    摘要： A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.

    摘要翻译： 电力转换装置包括：冷却基座5，其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部圆筒部13a，其中容纳有功率半导体元件，并且通过开口部50插入到流路51中;凸缘部13b，形成在圆筒部13a的开口上，并且是 固定在冷却基座5上，以封闭开口部分50;以及一组散热器散热片144，其安装在圆筒部分13a的外圆周表面上，具有形成在凸缘部分13b和 一组散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中，并且将冷却介质引入散热片144的一组中，同时防止冷却介质流动 进入间隙51c。

    Semiconductor power module, inverter, and method of manufacturing a power module
    7.
    发明授权
    Semiconductor power module, inverter, and method of manufacturing a power module 有权
    半导体功率模块，逆变器及制造电源模块的方法

    公开(公告)号：US08472188B2

    公开(公告)日：2013-06-25

    申请号：US12707207

    申请日：2010-02-17

    申请人： Keisuke Horiuchi ,  Atsuo Nishihara ,  Hiroshi Hozoji ,  Michiaki Hiyoshi ,  Takehide Yokozuka

    发明人： Keisuke Horiuchi ,  Atsuo Nishihara ,  Hiroshi Hozoji ,  Michiaki Hiyoshi ,  Takehide Yokozuka

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20927 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.

    摘要翻译： 半导体功率模块包括其上安装有多个功率半导体器件的绝缘衬底和用于散发由多个功率半导体器件产生的热量的散热器，其中散热器与多个辐射翅片在一个表面上整体模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且绝缘基板通过金属接合粘结到散热片的基部的另一个表面 与其上形成有辐射翅片的散热器的基部的一个表面相对。

    Power Conversion Device
    8.
    发明申请
    Power Conversion Device 有权
    电源转换装置

    公开(公告)号：US20130128646A1

    公开(公告)日：2013-05-23

    申请号：US13811497

    申请日：2011-07-25

    申请人： Atsuo Nishihara ,  Kenichiro Nakajima ,  Keisuke Horiuchi

    发明人： Atsuo Nishihara ,  Kenichiro Nakajima ,  Keisuke Horiuchi

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/473 ,  H01L23/552 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H02M7/48 ,  H01L2924/00

    摘要： A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.

    摘要翻译： 电力转换装置包括：冷却基座5，其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部的圆筒部13a，其中容纳有功率半导体元件，并且通过开口部50插入到流路51中;凸缘部13b，形成在圆筒部13a的开口上，并且是 固定在冷却基座5上，以封闭开口部分50;以及一组散热器散热片144，其安装在圆筒部分13a的外圆周表面上，具有形成在凸缘部分13b和 一组散热器散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中，并将冷却介质引入散热片144的一组中，同时防止冷却介质流动 进入间隙51c。