摘要:
A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.
摘要:
An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.
摘要:
Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要:
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要:
Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要:
A mask blank manufacturing department manufactures a mask blank by forming a thin film to be a mask pattern on a mask blank transparent substrate. When providing the mask blank to a mask manufacturing department, the mask blank manufacturing department provides optical characteristic information (transmittance variation) of the mask blank transparent substrate and optical characteristic information (transmittance variation and/or phase difference variation) of the mask blank to the mask manufacturing department. The optical characteristic information of the mask blank transparent substrate is provided to the mask blank manufacturing department from a materials processing department that manufactures mask blank transparent substrates.
摘要:
An image reading system includes an information processing apparatus and a scanner connected to the information processing apparatus via a network. Upon receiving input of information that specifies the number of pages to be included in a file through an input unit and a web browser, the information processing apparatus transmits the information through a first communication unit to the scanner. The scanner reads image data through a reading unit, and divides the image data into files based on the information through a data management unit. The scanner transmits the files to the information processing apparatus through a second communication unit. The information processing apparatus displays images of the files on a monitor.
摘要:
In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
摘要:
A technology for effectively preventing deformation of a light reflector plate fabricated by forming a synthetic resin reflector plate into a three-dimensional shape enabling a thinner light reflector plate, and additionally, reducing processing costs is provided. An adhesive tape for shape-retention is adhered onto a reflector plate which is fabricated by forming predetermined areas of a light-reflecting plastic film or sheet into a three-dimensional shape.
摘要:
A three-dimensional light reflection plate that can successfully prevent deformation of the light reflection plate, reduce initial cost and product cost, and facilitate increase in size and reflectance. The light reflection plate includes a bottom plate in which a plurality of mutually parallel slit holes are formed on a flat, light-reflective plate material and a mountain plate that is rectangular from a planar view of which a width direction cross-sectional shape is a mountain shape and in which insertion sections are formed in both width-direction end sections. The mountain plate is fixed to the bottom plate by the insertion sections of the mountain plate being inserted into the slit holes of the bottom plate.