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公开(公告)号：US08993648B2
公开(公告)日：2015-03-31
申请号：US12439154
申请日：2007-08-16
CPC分类号： B24B37/24 , B24B29/00 , B24D3/26 , B24D3/32 , C08G18/10 , C08G18/14 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G18/7831 , C08G18/3814 , C08G18/792
摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。
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公开(公告)号：US20100015893A1
公开(公告)日：2010-01-21
申请号：US12439135
申请日：2007-08-22
CPC分类号： B24B37/24 , B24D3/26 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G18/7621 , C08J9/30 , C08J2375/04 , C08L83/00 , C08G18/3243
摘要： An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt %).
摘要翻译： 本发明的目的是提供一种具有优异的平坦化性能和耐磨性的抛光垫，并提供其制造方法。 本发明涉及一种抛光垫，其包括具有细小细胞的聚氨酯泡沫的抛光层，其中聚氨酯泡沫是（1）能够与4反应的异氰酸酯封端的预聚物（A）的反应的固化产物 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为100℃以上的非发泡聚氨酯，（2）异氰酸酯封端的预聚物（B），其能够与4， 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为40℃以下的非发泡聚氨酯，（3）4,4'-亚甲基双（邻氯苯胺），异氰酸酯 - 封端的预聚物（A）和（B）以50/50至90/10（重量％）的（A）/（B）比混合。
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公开(公告)号：US08303372B2
公开(公告)日：2012-11-06
申请号：US12439135
申请日：2007-08-22
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24D3/26 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G18/7621 , C08J9/30 , C08J2375/04 , C08L83/00 , C08G18/3243
摘要： A polishing pad having excellent planarization performance and wear resistance includes a polishing layer including a polyurethane foam having fine cells. The polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt%). The pad so made is used in the manufacture of semiconductor devices.
摘要翻译： 具有优异的平坦化性能和耐磨性的抛光垫包括包括具有细孔的聚氨酯泡沫的抛光层。 聚氨酯泡沫体是（1）异氰酸酯封端的预聚物（A）与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ的非发泡聚氨酯的反应的固化产物 峰温度为100℃以上，（2）能与4,4'-亚甲基双（邻氯苯胺）反应形成具有tanδ峰的非发泡聚氨酯的异氰酸酯封端的预聚物（B） 温度为40℃以下，（3）4,4'-亚甲基双（邻氯苯胺）和异氰酸酯封端的预聚物（A）和（B）以（A）/（B）比 为50/50至90/10（重量％）。 如此制成的焊盘用于制造半导体器件。
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公开(公告)号：US20100003896A1
公开(公告)日：2010-01-07
申请号：US12439154
申请日：2007-08-17
CPC分类号： B24B37/24 , B24B29/00 , B24D3/26 , B24D3/32 , C08G18/10 , C08G18/14 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G18/7831 , C08G18/3814 , C08G18/792
摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。
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公开(公告)号：US20100048102A1
公开(公告)日：2010-02-25
申请号：US12593206
申请日：2008-03-13
CPC分类号： B24B37/24 , B24D3/32 , C08G18/10 , C08G18/12 , C08G18/4833 , C08G18/4854 , C08G18/6674 , C08G18/724 , C08G2101/0025 , C08G18/3802 , C08G18/792 , C08G18/3206
摘要： A polishing pad capable of maintaining a high level of dimensional stability upon moisture absorption or water absorption and providing high polishing rate includes a polishing layer of a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol, (2) an isocyanate-terminated prepolymer (B) that includes a polymerized diisocyanate and a polyethylene glycol with a number average molecular weight of 200 to 1,000, and (3) a chain extender.
摘要翻译： 能够在吸湿或吸水性上保持高水平的尺寸稳定性并提供高抛光速度的抛光垫包括具有细孔的聚氨酯泡沫的抛光层，其中聚氨酯泡沫包括（1）的反应的固化产物， 包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇的异氰酸酯封端的预聚物（A），（2）包含聚合二异氰酸酯和聚乙二醇的异氰酸酯封端的预聚物（B） 数均分子量为200〜1000，（3）扩链剂。
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公开(公告)号：US07871309B2
公开(公告)日：2011-01-18
申请号：US11720964
申请日：2005-12-08
申请人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
发明人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
CPC分类号： B24B37/205 , Y10T428/24339 , Y10T428/24992
摘要： It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).
摘要翻译： 本发明的目的是提供一种抛光垫，其能够在抛光过程中对端点进行高精度光学检测，并且即使在抛光垫之后也可防止在使用期间抛光区域和透光区域之间的浆料泄漏 已被使用了很长时间。 本发明的第二个目的是提供一种能够抑制抛光特性（例如面内均匀性）劣化的抛光垫以及由于抛光区域和透光区域的行为差异而产生的划痕 抛光。 本发明的第三个目的是提供一种具有抛光区域和特定金属浓度等于或低于特定值（阈值）的透光区域的抛光垫。
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公开(公告)号：US20090253353A1
公开(公告)日：2009-10-08
申请号：US11720964
申请日：2005-12-08
申请人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
发明人： Kazuyuki Ogawa , Tetsuo Shimomura , Atsushi Kazuno , Yoshiyuki Nakai , Masahiro Watanabe , Takatoshi Yamada , Masahiko Nakamori
CPC分类号： B24B37/205 , Y10T428/24339 , Y10T428/24992
摘要： It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).
摘要翻译： 本发明的目的是提供一种抛光垫，其能够在抛光过程中对端点进行高精度光学检测，并且即使在抛光垫之后也可防止在使用期间抛光区域和透光区域之间的浆料泄漏 已被使用了很长时间。 本发明的第二个目的是提供一种能够抑制抛光特性（例如面内均匀性）劣化的抛光垫以及由于抛光区域和透光区域的行为差异而产生的划痕 抛光。 本发明的第三个目的是提供一种具有抛光区域和特定金属浓度等于或低于特定值（阈值）的透光区域的抛光垫。
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8.发明授权公开(公告)号：US07470170B2
公开(公告)日：2008-12-30
申请号：US10590067
申请日：2005-02-22
申请人： Tetsuo Shimomura , Atsushi Kazuno , Kazuyuki Ogawa , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
发明人： Tetsuo Shimomura , Atsushi Kazuno , Kazuyuki Ogawa , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
IPC分类号： B24B1/00
摘要： The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 μm/(gf/cm2).
摘要翻译： 本发明提供了一种抛光垫，其对诸如半导体晶片的待抛光材料赋予优异的平面度和均匀性，而不会形成划痕。 本发明涉及一种包括抛光层和缓冲层的半导体晶片抛光垫，其中抛光层由发泡聚氨酯形成，其弯曲模量为250至350MPa，缓冲层由闭孔泡沫形成， 厚度为0.5〜1.0mm，应变常数为0.01〜0.08μm/（gf / cm 2）。
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公开(公告)号：US07488236B2
公开(公告)日：2009-02-10
申请号：US11466909
申请日：2006-08-24
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Shigeru Komai , Koichi Ono , Kazuyuki Ogawa , Atsushi Kazuno , Tsuyoshi Kimura
IPC分类号： B24B7/22
CPC分类号： C08G18/00 , B24B37/24 , B24D3/30 , B24D18/00 , C08G18/10 , C08G18/12 , C08G18/4211 , C08G18/4236 , C08G18/4808 , C08G18/4854 , C08G18/61 , C08G18/664 , C08G18/6674 , C08G18/724 , C08G2101/00 , C08G2101/0066 , C08J9/0061 , C08J2205/052 , C08J2375/04 , C08J2483/00 , C08L83/00 , C09D175/08 , H01L21/30625 , Y10T428/249953 , Y10T428/249976 , C08G18/3814 , C08G18/3243 , C08G18/5096
摘要： The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
摘要翻译： 本发明提供了抛光垫，通过该抛光垫，诸如透镜，反射镜等的光学材料或需要高度表面平坦度的材料，如在硅树脂晶片，玻璃基板或用于硬盘的铝基板的抛光中，或通常的金属抛光 ，可平坦化，抛光效率高。 本发明还提供一种平面化特性优异的半导体晶片用抛光垫，无磨损，可以低成本地制造。 提供了没有脱扣误差的抛光垫，从而不会损坏晶片，也不会降低工作效率。 提供了平面性良好，晶片均匀性和抛光速度均匀且抛光速度变化小的抛光垫。 提供了可以使平面性改善和划痕减少兼容的抛光垫。
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公开(公告)号：US20110053377A1
公开(公告)日：2011-03-03
申请号：US12531005
申请日：2008-03-12
IPC分类号： H01L21/306 , B24D11/00
CPC分类号： H01L21/30625 , B24B37/205
摘要： An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.
摘要翻译： 本发明的目的是提供一种抛光垫，其防止由于从该工艺的早期阶段到最终阶段的透光率的降低导致终点检测误差，并且提供一种制造方法 具有抛光垫的半导体器件。 本发明涉及一种抛光垫，其包括：抛光层，包括抛光区域和透光区域，其中对所述透光区域的抛光侧表面进行表面粗糙度处理，并且所述光透射区域 使用前在600nm的波长下的透光率为40％〜60％。
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