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    Microwell Array Chip and Its Manufacturing Method
    2.
    发明申请
    Microwell Array Chip and Its Manufacturing Method 审中-公开
    微孔阵列芯片及其制造方法

    公开(公告)号：US20080014631A1

    公开(公告)日：2008-01-17

    申请号：US10573289

    申请日：2004-09-22

    申请人： Atsushi Muraguchi ,  Hiroyuki Kishi ,  Yoshiharu Tokimitsu ,  Sachiko Kondo ,  Tsutomu Obata ,  Satoshi Fujiki ,  Yoshiyuki Yokoyama ,  Hirofumi Nabesawa ,  Sotohiro Takabayashi ,  Katsumi Tanino

    发明人： Atsushi Muraguchi ,  Hiroyuki Kishi ,  Yoshiharu Tokimitsu ,  Sachiko Kondo ,  Tsutomu Obata ,  Satoshi Fujiki ,  Yoshiyuki Yokoyama ,  Hirofumi Nabesawa ,  Sotohiro Takabayashi ,  Katsumi Tanino

    IPC分类号： C12M1/34

    CPC分类号： G01N33/54366 ,  A61K35/12 ,  A61K48/00 ,  B01J19/0046 ,  B01J2219/00659 ,  C12M23/12

    摘要： A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein microwell markers are present on the same substrate surface as the openings of the microwells. A microwell array chip having multiple microwells on a principal surface of a substrate, said microwells being of a shape and size permitting the storage of only a single organic cell in each microwell, wherein protrusions are present in the openings of said microwells so as to narrow said openings. A method for manufacturing the microwell array chip. The method comprises the steps of: forming a film on at least one principal surface of a substrate; applying a resist coating on the film that has been formed; exposing the resist surface through a mask having a microwell pattern and removing uncured portions of resist; etching the exposed portions of said film and substrate to fabricate wells in the form of a microwell array; and removing the resist. A microwell array chip made of silicon and having multiple microwells, each microwell being used to store a single specimen organic cell, wherein each microwell is of a size and shape holding just one organic cell.

    摘要翻译： 一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中微孔标记物存在于与基底表面的开口相同的基底表面上 微孔。 一种微孔阵列芯片，其在基底的主表面上具有多个微孔，所述微孔具有允许在每个微孔中仅存储单个有机细胞的形状和尺寸，其中突起存在于所述微孔的开口中以使其变窄 说开口 一种微孔阵列芯片的制造方法。 该方法包括以下步骤：在衬底的至少一个主表面上形成膜; 在已经形成的膜上施加抗蚀剂涂层; 通过具有微孔图案的掩模曝光抗蚀剂表面并除去未固化的抗蚀剂部分; 蚀刻所述膜和基底的暴露部分以制造微孔阵列形式的孔; 并除去抗蚀剂。 由硅制成并具有多个微孔的微孔阵列芯片，每个微孔用于存储单个样品有机电池，其中每个微孔具有仅具有一个有机电池的尺寸和形状。

    Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same
    5.
    发明申请
    Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same 审中-公开
    带有膜的芯片具有使用热聚合物的孔图案及其制造方法

    公开(公告)号：US20090130384A1

    公开(公告)日：2009-05-21

    申请号：US11992594

    申请日：2006-09-27

    申请人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

    发明人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

    IPC分类号： B32B3/10 ,  C12N11/04 ,  B05D3/00 ,  G03F7/20

    CPC分类号： C12N5/0068 ,  C12N2533/12 ,  C12N2535/10 ,  C12N2537/10 ,  C12N2539/10 ,  Y10T428/24273 ,  Y10T436/25 ,  Y10T436/25375

    摘要： [Problems] To provide a novel chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation.[Means for Solving Problems] A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.

    摘要翻译： [问题]提供一种用于处理细胞等的新颖的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出和离开 但在洗涤或抗原刺激期间几乎不能从孔中脱出。 解决问题的手段一种芯片，其包含作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面设置有具有孔图案的膜。 一种制造芯片的方法，其包括作为构成部件的温度敏感性聚合物的交联产物，并且在基板的表面上设置有具有孔图案的膜。 该方法包括在基板的表面上涂布含有交联性温度响应性聚合物的组合物，含有交联性温度敏感性聚合物和交联剂的组合物或含有温度敏感性聚合物和交联剂的组合物，从而形成 使涂膜交联，由此形成如上所述的交联产物，然后在交联产物的涂膜上形成孔图案。

    Conductive paint
    6.
    发明授权
    Conductive paint 失效
    导电漆

    公开(公告)号：US4499010A

    公开(公告)日：1985-02-12

    申请号：US471924

    申请日：1983-03-02

    申请人： Katsumi Tanino ,  Satoshi Fujiki ,  Shinzi Okamoto

    发明人： Katsumi Tanino ,  Satoshi Fujiki ,  Shinzi Okamoto

    IPC分类号： C09D5/24 ,  H05K1/09 ,  H01B1/02

    CPC分类号： C09D5/24 ,  H05K1/095

    摘要： Conductive paint comprises an organic solvent having dissolved and dispersed therein a binder containing a thermosetting resin and a hydroquinone derivative which is a product resulting from reaction between a hydroquinone (polyhydric phenol) and a fatty acid having 10 to 20 carbon atoms, added to the thermosetting resin, metal powder as a conductive material, and preferably a fatty acid derived from natural oils and fats and having 10 to 20 carbon atoms. This conductive paint exhibits characteristics not inferior to those of the conventional Ag conductive paint, such as low specific resistance, high moisture resistance and high heat resistance, and is much less expensive than the conventional Ag conductive paint.

    摘要翻译： 导电涂料包括溶解并分散有含有热固性树脂和氢醌衍生物的粘合剂的有机溶剂，氢醌衍生物是由氢醌（多元酚）和具有10至20个碳原子的脂肪酸之间的反应产生的产物，加入到热固性 树脂，金属粉末作为导电材料，优选衍生自天然油脂的脂肪酸，并具有10〜20个碳原子。 该导电涂料具有不劣于常规Ag导电涂料的特性，例如低电阻率，高耐湿性和高耐热性，并且比常规Ag导电涂料便宜得多。

    Wood processing composition, processed wood and a method of processing wood
    8.
    发明授权
    Wood processing composition, processed wood and a method of processing wood 失效
    木材加工组合物，加工木材和木材加工方法

    公开(公告)号：US5534305A

    公开(公告)日：1996-07-09

    申请号：US299038

    申请日：1994-08-31

    申请人： Satoshi Fujiki ,  Hideo Kamata

    发明人： Satoshi Fujiki ,  Hideo Kamata

    IPC分类号： B27K3/50 ,  B27K3/52 ,  B27K5/00 ,  C08L61/20 ,  C08L77/06

    CPC分类号： B27K3/52 ,  B27K3/50 ,  C08L61/24 ,  B27K2240/30

    摘要： A wood processing composition comprising a dimensional stabilizer which penetrates wood and restrains its swelling and shrinkage to prevent cracking and to give it dimensional stability, and a hardening filler composed of synthetic resins which hardens after penetrating wood to prevent the dimensional stabilizer from flowing away from said wood, fills the cavity of the wood to restrain its shrinkage, and protects the wood against decay and damage by termites. It preferably further contains a flame retardant consisting of at least one of a phosphoric acid compound and dicyandiamide, and a water-soluble flame-retardant solution containing urea and a 37% aqueous solution of formaldehyde by weight. Wood is impregnated with the composition by appropriate means and, after drying, it may be impregnated with a surface reinforcing synthetic resin. The wood as processed is free of any unnatural color, is harmless, and retains a durable surface which is characteristic of wood.

    摘要翻译： 一种木材加工组合物，其包含穿透木材并限制其膨胀和收缩以防止开裂并赋予其尺寸稳定性的尺寸稳定剂，以及由渗透木材后硬化的合成树脂组成的硬化填料，以防止尺寸稳定剂从所述 木材填充木材的空腔以抑制其收缩，并保护木材免受白蚁的腐烂和损坏。 优选还含有由磷酸化合物和双氰胺中的至少一种组成的阻燃剂和含有尿素和37重量％的甲醛水溶液的水溶性阻燃剂溶液。 木材通过适当的方式浸渍组合物，干燥后可用表面增强合成树脂浸渍。 被加工的木材没有任何不自然的颜色，是无害的，并且保留了木材特征的耐用的表面。