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23 条记录 (耗时 0.03 秒)

    Method of producing a microproduct
    2.
    发明授权
    Method of producing a microproduct 有权
    微产品生产方法

    公开(公告)号：US08609009B2

    公开(公告)日：2013-12-17

    申请号：US12694462

    申请日：2010-01-27

    申请人： Kazuyuki Yamashita ,  Takashi Onaga ,  Satoshi Fujiki ,  Hideki Morimoto ,  Tutomu Obata ,  Masayasu Suzuki

    发明人： Kazuyuki Yamashita ,  Takashi Onaga ,  Satoshi Fujiki ,  Hideki Morimoto ,  Tutomu Obata ,  Masayasu Suzuki

    IPC分类号： B29C45/00

    CPC分类号： C08L23/12 ,  B29C45/0001 ,  B29C2045/0094 ,  C08L23/10 ,  C08L23/14 ,  C08L53/025 ,  C08L2666/24 ,  C08L2666/06

    摘要： A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by “X-Y” (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 μm deep or tall and 0.3 to 100 μm wide.

    摘要翻译： 一种生产微型产品的方法包括：提供一种树脂组合物，其包含30至90重量％的聚丙烯基树脂和10至70重量％的由“XY”表示的嵌段共聚物的氢化衍生物（X表示不混溶的聚合物嵌段 与聚丙烯类树脂相比，Y代表在氢化后与聚丙烯基树脂混溶的共轭二烯的弹性体聚合物嵌段）; 将硅压模附接到注射成型机的模腔上，所述硅压模具有通过蚀刻硅板的表面形成的微加工特征; 并且通过将树脂组合物注射到模腔中将硅压模的微加工特征精确地转移到树脂组合物中，所得到的模制表面具有深度为0.3至200μm，宽度为0.3至100μm的凹陷和/或突起。

    Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same
    4.
    发明申请
    Chip Provided with film Having Hole Pattern with the Use of Thermoresponsive Polymer and Method of Producing the Same 审中-公开
    带有膜的芯片具有使用热聚合物的孔图案及其制造方法

    公开(公告)号：US20090130384A1

    公开(公告)日：2009-05-21

    申请号：US11992594

    申请日：2006-09-27

    申请人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

    发明人： Eiichi Tamiya ,  Yoshiyuki Yokoyama ,  Satoshi Fujiki ,  Katsumi Tanino ,  Atsushi Muraguchi ,  Horoyuki Kishi ,  Yoshiharu Tokimitsu ,  Shohei Yamamura

    IPC分类号： B32B3/10 ,  C12N11/04 ,  B05D3/00 ,  G03F7/20

    CPC分类号： C12N5/0068 ,  C12N2533/12 ,  C12N2535/10 ,  C12N2537/10 ,  C12N2539/10 ,  Y10T428/24273 ,  Y10T436/25 ,  Y10T436/25375

    摘要： [Problems] To provide a novel chip useful for treating cells and the like which has a mechanism and a structure wherein the size of a hole pattern is arbitrarily changed so that cells can easily move in and get out from the hole in scattering or collecting cells but can hardly get out from the hole during washing or antigen-stimulation.[Means for Solving Problems] A chip comprising a crosslinked product of a temperature-responsive polymer as a constituting member and being provided with a film having a hole pattern on the surface of a baseboard. A method of producing a chip which comprises a crosslinked product of a temperature-responsive polymer as a constituting member and is provided with a film having a hole pattern on the surface of the baseboard. This method comprises applying a composition containing a crosslinkable temperature-responsive polymer, a composition containing a crosslinkable temperature-responsive polymer and a crosslinking agent or a composition containing a temperature-responsive polymer and a crosslinking agent on the surface of a baseboard to thereby form a coating film, crosslinking the coating film to thereby form the crosslinked product as described above and then forming a hole pattern on the coating film of the crosslinked product.

    摘要翻译： [问题]提供一种用于处理细胞等的新颖的芯片，其具有机构和结构，其中孔图案的尺寸任意改变，使得细胞可以容易地在散射或收集细胞中从孔中移出和离开 但在洗涤或抗原刺激期间几乎不能从孔中脱出。 解决问题的手段一种芯片，其包含作为构成部件的温度敏感性聚合物的交联体，并且在基板的表面设置有具有孔图案的膜。 一种制造芯片的方法，其包括作为构成部件的温度敏感性聚合物的交联产物，并且在基板的表面上设置有具有孔图案的膜。 该方法包括在基板的表面上涂布含有交联性温度响应性聚合物的组合物，含有交联性温度敏感性聚合物和交联剂的组合物或含有温度敏感性聚合物和交联剂的组合物，从而形成 使涂膜交联，由此形成如上所述的交联产物，然后在交联产物的涂膜上形成孔图案。

    Wood processing composition, processed wood and a method of processing wood
    5.
    发明授权
    Wood processing composition, processed wood and a method of processing wood 失效
    木材加工组合物，加工木材和木材加工方法

    公开(公告)号：US5534305A

    公开(公告)日：1996-07-09

    申请号：US299038

    申请日：1994-08-31

    申请人： Satoshi Fujiki ,  Hideo Kamata

    发明人： Satoshi Fujiki ,  Hideo Kamata

    IPC分类号： B27K3/50 ,  B27K3/52 ,  B27K5/00 ,  C08L61/20 ,  C08L77/06

    CPC分类号： B27K3/52 ,  B27K3/50 ,  C08L61/24 ,  B27K2240/30

    摘要： A wood processing composition comprising a dimensional stabilizer which penetrates wood and restrains its swelling and shrinkage to prevent cracking and to give it dimensional stability, and a hardening filler composed of synthetic resins which hardens after penetrating wood to prevent the dimensional stabilizer from flowing away from said wood, fills the cavity of the wood to restrain its shrinkage, and protects the wood against decay and damage by termites. It preferably further contains a flame retardant consisting of at least one of a phosphoric acid compound and dicyandiamide, and a water-soluble flame-retardant solution containing urea and a 37% aqueous solution of formaldehyde by weight. Wood is impregnated with the composition by appropriate means and, after drying, it may be impregnated with a surface reinforcing synthetic resin. The wood as processed is free of any unnatural color, is harmless, and retains a durable surface which is characteristic of wood.

    摘要翻译： 一种木材加工组合物，其包含穿透木材并限制其膨胀和收缩以防止开裂并赋予其尺寸稳定性的尺寸稳定剂，以及由渗透木材后硬化的合成树脂组成的硬化填料，以防止尺寸稳定剂从所述 木材填充木材的空腔以抑制其收缩，并保护木材免受白蚁的腐烂和损坏。 优选还含有由磷酸化合物和双氰胺中的至少一种组成的阻燃剂和含有尿素和37重量％的甲醛水溶液的水溶性阻燃剂溶液。 木材通过适当的方式浸渍组合物，干燥后可用表面增强合成树脂浸渍。 被加工的木材没有任何不自然的颜色，是无害的，并且保留了木材特征的耐用的表面。

    Conductive paint
    9.
    发明授权
    Conductive paint 失效
    导电漆

    公开(公告)号：US4499010A

    公开(公告)日：1985-02-12

    申请号：US471924

    申请日：1983-03-02

    申请人： Katsumi Tanino ,  Satoshi Fujiki ,  Shinzi Okamoto

    发明人： Katsumi Tanino ,  Satoshi Fujiki ,  Shinzi Okamoto

    IPC分类号： C09D5/24 ,  H05K1/09 ,  H01B1/02

    CPC分类号： C09D5/24 ,  H05K1/095

    摘要： Conductive paint comprises an organic solvent having dissolved and dispersed therein a binder containing a thermosetting resin and a hydroquinone derivative which is a product resulting from reaction between a hydroquinone (polyhydric phenol) and a fatty acid having 10 to 20 carbon atoms, added to the thermosetting resin, metal powder as a conductive material, and preferably a fatty acid derived from natural oils and fats and having 10 to 20 carbon atoms. This conductive paint exhibits characteristics not inferior to those of the conventional Ag conductive paint, such as low specific resistance, high moisture resistance and high heat resistance, and is much less expensive than the conventional Ag conductive paint.

    摘要翻译： 导电涂料包括溶解并分散有含有热固性树脂和氢醌衍生物的粘合剂的有机溶剂，氢醌衍生物是由氢醌（多元酚）和具有10至20个碳原子的脂肪酸之间的反应产生的产物，加入到热固性 树脂，金属粉末作为导电材料，优选衍生自天然油脂的脂肪酸，并具有10〜20个碳原子。 该导电涂料具有不劣于常规Ag导电涂料的特性，例如低电阻率，高耐湿性和高耐热性，并且比常规Ag导电涂料便宜得多。