公开(公告)号：US09769951B2

公开(公告)日：2017-09-19

申请号：US14794056

申请日：2015-07-08

Applicant: Autoliv ASP, Inc.

Inventor： Xueru Ding ,  Jeff Schaefer ,  Richard Leung

IPC: H05K7/20 ,  H01L21/67 ,  H05K5/02 ,  H05K5/00 ,  H05K5/03 ,  G01S7/02 ,  G01S13/93

CPC classification number: H05K7/20127 ,  G01S7/02 ,  G01S13/931 ,  G01S2007/027 ,  H01L21/67184 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03

Abstract: A housing for a radar sensor module has a back surface and a plurality of side surfaces connected to the back surface. A vent structure is connected to the back surface and at least one of the side surfaces. The vent structure includes an enclosure enclosing a chamber. A first opening in the vent structure penetrates the at least one of the side surfaces of the housing, such that the chamber is exposed to an exterior of the housing. A second opening in the vent structure penetrates the enclosure such that the chamber is exposed to an interior of the housing.

公开(公告)号：US20160268693A1

公开(公告)日：2016-09-15

申请号：US14645958

申请日：2015-03-12

Applicant: Autoliv ASP, Inc.

Inventor： Xueru Ding ,  Paula Arinello ,  Jonathan Williams ,  Richard Leung ,  Bernard DeMersseman ,  Arnaud Amadjikpe

IPC: H01Q17/00

CPC classification number: H01Q17/008 ,  G01S7/03 ,  G01S7/032 ,  G01S13/931 ,  G01S2007/027 ,  G01S2007/028 ,  H01Q1/3233 ,  H01Q1/42 ,  H01Q1/526 ,  H01Q13/206 ,  H01Q21/0075 ,  H01Q21/065

Abstract: A radar system and method with reduced multipath effects include a first component of a radar sensor module on which at least one antenna element is formed, the at least one antenna element having a surface at which radar radiation is received or transmitted, the at least one antenna element having a radiation aperture. A second component in proximity to the antenna element such that a portion of the radar radiation impinges on the second component comprises an angled surface forming an angle with the surface of the antenna element. The angled surface of the second component comprises a texture such that when the portion of the radiation impinges on the angled surface, the amount of multipath signal propagating through the radiation aperture of the antenna element is reduced.

Abstract translation: 具有降低的多路径效应的雷达系统和方法包括雷达传感器模块的第一部件，在其上形成至少一个天线元件，所述至少一个天线元件具有接收或发射雷达辐射的表面，所述至少一个 具有辐射孔的天线元件。 靠近天线元件的第二部件，使得雷达辐射的一部分照射在第二部件上，包括与天线元件的表面成角度的成角度的表面。 第二部件的成角度的表面包括纹理，使得当辐射的部分照射在倾斜的表面上时，通过天线元件的辐射孔径传播的多径信号的量减少。

公开(公告)号：US20160218420A1

公开(公告)日：2016-07-28

申请号：US15026405

申请日：2014-10-01

Applicant: AUTOLIV ASP, INC.

Inventor： Richard Leung ,  Bernard DeMersseman

IPC: H01Q1/32 ,  G01S13/93 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q1/42 ,  H01Q1/52

CPC classification number: H01Q1/3233 ,  G01S7/032 ,  G01S13/931 ,  G01S2007/027 ,  G01S2007/028 ,  H01Q1/42 ,  H01Q1/526 ,  H01Q21/0075 ,  H01Q21/065

Abstract: An automobile radar module and method include a PCB having a first side on which RF electronic components are mounted and a second side on which digital electronic components are mounted. An EMI shield is mounted over the first side of the PCB, and a radome is mounted over the EMI shield. The EMI shield comprises an aperture exposing RF components on the first side of the PCB. The radome comprises a protrusion which protrudes into the aperture in the EMI shield. The protrusion and sidewalls of the aperture define a shielded region above the RF components on the first side of the PCB. The sidewalls extend at an acute angle with respect to a plane of the primary surface of the EMI shield, the acute angle being selected based on operational parameters of the radar module such that a predetermined shielding performance is realized.

Abstract translation: 汽车雷达模块和方法包括具有安装有RF电子部件的第一侧的PCB以及安装数字电子部件的第二侧。 EMI屏蔽层安装在PCB的第一侧上，天线罩安装在EMI屏蔽层上。 EMI屏蔽包括暴露在PCB的第一面上的RF部件的孔。 天线罩包括突出到EMI屏蔽中的孔中的突起。 孔的突起和侧壁在PCB的第一侧上的RF部件上方限定屏蔽区域。 侧壁相对于EMI屏蔽的主表面的平面呈锐角延伸，基于雷达模块的操作参数来选择锐角，使得实现预定的屏蔽性能。

公开(公告)号：US20170013741A1

公开(公告)日：2017-01-12

申请号：US14794056

申请日：2015-07-08

Applicant: Autoliv ASP, Inc.

Inventor： Xueru Ding ,  Jeff Schaefer ,  Richard Leung

IPC: H05K7/20 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K7/20127 ,  G01S7/02 ,  G01S13/931 ,  G01S2007/027 ,  H01L21/67184 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03

Abstract: A housing for a radar sensor module has a back surface and a plurality of side surfaces connected to the back surface. A vent structure is connected to the back surface and at least one of the side surfaces. The vent structure includes an enclosure enclosing a chamber. A first opening in the vent structure penetrates the at least one of the side surfaces of the housing, such that the chamber is exposed to an exterior of the housing. A second opening in the vent structure penetrates the enclosure such that the chamber is exposed to an interior of the housing.

Abstract translation: 用于雷达传感器模块的壳体具有连接到后表面的后表面和多个侧表面。 排气结构连接到后表面和至少一个侧表面。 排气结构包括封闭室的外壳。 排气结构中的第一开口穿透壳体的至少一个侧表面，使得室暴露于外壳的外部。 排气结构中的第二个开口穿过外壳，使得室暴露在外壳的内部。

公开(公告)号：US09313934B2

公开(公告)日：2016-04-12

申请号：US13834868

申请日：2013-03-15

Applicant: Autoliv ASP Inc.

Inventor： Xueru Ding ,  Richard Leung

IPC: H05K9/00 ,  G01S7/02 ,  G01S7/03 ,  G01S13/93

CPC classification number: H05K9/0015 ,  G01S7/023 ,  G01S7/032 ,  G01S13/931 ,  Y10T29/49155

Abstract: An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions. An electrical gasket is formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.

Abstract translation: 电子模块和制造电子模块的方法包括具有表面的印刷电路板（PCB），在表面上形成至少一个导电迹线。 用于与PCB机械地配合的壳体元件包括至少一个与PCB上的导电迹线对准的配合表面，当PCB和壳体元件机械配合时，配合表面包括突起之间的多个交替突起和间隔。 电气垫圈形成在壳体元件的配合表面上，使得电垫片与壳体元件的配合表面上的突起和空间一致，并且设置在壳体元件的配合表面和表面上的导电迹线之间 当外壳元件和PCB机械地配合时，电气垫圈在壳体元件的配合表面和PCB的第一表面上的导电迹线之间提供电磁干扰（EMI）密封。

公开(公告)号：US20140266903A1

公开(公告)日：2014-09-18

申请号：US13834868

申请日：2013-03-15

Applicant: Autoliv ASP Inc.

Inventor： Xueru Ding ,  Richard Leung

IPC: H05K9/00 ,  H05K3/10 ,  G01S13/02

CPC classification number: H05K9/0015 ,  G01S7/023 ,  G01S7/032 ,  G01S13/931 ,  Y10T29/49155

Abstract: An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions. An electrical gasket is formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.

Abstract translation: 电子模块和制造电子模块的方法包括具有表面的印刷电路板（PCB），在表面上形成至少一个导电迹线。 用于与PCB机械地配合的壳体元件包括至少一个与PCB上的导电迹线对准的配合表面，当PCB和壳体元件机械配合时，配合表面包括突起之间的多个交替突起和间隔。 电气垫圈形成在壳体元件的配合表面上，使得电垫片与壳体元件的配合表面上的突起和空间一致，并且设置在壳体元件的配合表面和表面上的导电迹线之间 当外壳元件和PCB机械地配合时，电气垫圈在壳体元件的配合表面和PCB的第一表面上的导电迹线之间提供电磁干扰（EMI）密封。