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公开(公告)号：US11252818B2
公开(公告)日：2022-02-15
申请号：US16856218
申请日：2020-04-23
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
发明人： Rui-Wu Liu , Ming-Jaan Ho , Lei Zhou , Man-Zhi Peng
摘要： A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.
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公开(公告)号：US11917278B2
公开(公告)日：2024-02-27
申请号：US17717334
申请日：2022-04-11
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Man-Zhi Peng , Rui-Wu Liu , Jia-He Li
摘要： A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.
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公开(公告)号：US11483938B2
公开(公告)日：2022-10-25
申请号：US16221433
申请日：2018-12-14
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
发明人： Rui-Wu Liu , Ming-Jaan Ho , Man-Zhi Peng
摘要： A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.
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公开(公告)号：US10405431B2
公开(公告)日：2019-09-03
申请号：US16121822
申请日：2018-09-05
申请人： Avary Holding (Shenzhen) Co., Limited , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
发明人： Lei Zhou , Rui-Wu Liu , Qiong Zhou
摘要： A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.
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公开(公告)号：US10111336B1
公开(公告)日：2018-10-23
申请号：US15609131
申请日：2017-05-31
申请人： FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
发明人： Lei Zhou , Rui-Wu Liu , Qiong Zhou
CPC分类号： H05K1/189 , H05K1/032 , H05K1/09 , H05K3/064 , H05K3/188 , H05K2203/0723 , Y10T29/49155
摘要： A flexible printed circuit board with reduced ion migration from signal-carrying elements which are coated against corrosion includes an insulating layer, a wiring area, a copper electroplating layer, a nickel electroplating layer, a cover film, and a gold chemical-plating layer. The wiring area is formed on the insulating layer. The copper electroplating layer formed on the wiring area has a first portion and a second portion. The nickel electroplating layer is formed on at least the first portion and exposes sidewalls of the first portion. The cover film is formed on the second portion and fills in gaps of the copper electroplating layer. The gold chemical-plating layer is formed on top surface of the nickel electroplating layer and the sidewalls of the first portion.
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公开(公告)号：US11510319B2
公开(公告)日：2022-11-22
申请号：US17335416
申请日：2021-06-01
发明人： Rui-Wu Liu , Ming-Jaan Ho , Man-Zhi Peng
摘要： A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.
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公开(公告)号：US11665820B2
公开(公告)日：2023-05-30
申请号：US17536321
申请日：2021-11-29
发明人： Man-Zhi Peng , Rui-Wu Liu , Ming-Jaan Ho
CPC分类号： H05K1/112 , H05K3/0014 , H05K3/0052 , H05K1/119 , H05K3/0029 , H05K3/0038 , H05K2201/09118 , H05K2201/09445 , H05K2201/09609 , H05K2201/09672 , H05K2203/0169
摘要： Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.
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公开(公告)号：US11051404B2
公开(公告)日：2021-06-29
申请号：US16239577
申请日：2019-01-04
发明人： Rui-Wu Liu , Ming-Jaan Ho , Man-Zhi Peng
摘要： A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.
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公开(公告)号：US11310922B2
公开(公告)日：2022-04-19
申请号：US17027929
申请日：2020-09-22
发明人： Rui-Wu Liu , Man-Zhi Peng
摘要： A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.
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公开(公告)号：US10910300B1
公开(公告)日：2021-02-02
申请号：US16556630
申请日：2019-08-30
发明人： Man-Zhi Peng , Rui-Wu Liu , Ming-Jaan Ho
摘要： A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.
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