公开(公告)号：US10575406B1

公开(公告)日：2020-02-25

申请号：US16147485

申请日：2018-09-28

申请人： Avary Holding (Shenzhen) Co., Limited ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Fu-Yun Shen ,  Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H05K3/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

摘要： A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

公开(公告)号：US11778752B2

公开(公告)日：2023-10-03

申请号：US17418551

申请日：2020-01-21

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Hsiao-Ting Hsu ,  Ming-Jaan Ho ,  Fu-Yun Shen

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18

CPC分类号： H05K3/306 ,  H05K1/0353 ,  H05K1/092 ,  H05K1/185 ,  H05K2201/0141 ,  H05K2201/0145

摘要： A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

公开(公告)号：US11380603B2

公开(公告)日：2022-07-05

申请号：US16596250

申请日：2019-10-08

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Fu-Yun Shen ,  Cong Lei ,  Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H05K1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/06 ,  H05K7/20 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/427 ,  H01B17/54 ,  H05K3/00 ,  H01B7/42

摘要： An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

公开(公告)号：US10660210B2

公开(公告)日：2020-05-19

申请号：US16577054

申请日：2019-09-20

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Fu-Yun Shen ,  Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

摘要： A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

公开(公告)号：US10365430B2

公开(公告)日：2019-07-30

申请号：US15653543

申请日：2017-07-19

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho ,  Feng-Yuan Hu

IPC分类号： H01P3/08 ,  G02B6/036 ,  H01G4/06 ,  H01L23/522 ,  H01L21/768 ,  B32B27/38 ,  H01L23/532 ,  H01L27/146

摘要： A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.

公开(公告)号：US10278307B2

公开(公告)日：2019-04-30

申请号：US15823384

申请日：2017-11-27

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H05K7/20 ,  H01L23/473 ,  G06F1/20

摘要： A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.

公开(公告)号：US10205487B1

公开(公告)日：2019-02-12

申请号：US15870882

申请日：2018-01-13

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Ming-Jaan Ho ,  Xian-Qin Hu ,  Fu-Yun Shen

IPC分类号： H04B5/00 ,  H02J50/20

摘要： A wireless power consortium device includes a flexible substrate layer, at least one first WPC coil on the flexible substrate layer, at least one first NFC coil on the flexible substrate layer, at least one WPC module, and at least one NFC module. Each WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit. Each NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit. The first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.

公开(公告)号：US10533811B2

公开(公告)日：2020-01-14

申请号：US15990767

申请日：2018-05-28

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho

IPC分类号： F28F21/08 ,  F28F3/04 ,  F28D15/02

摘要： A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.

公开(公告)号：US10104771B1

公开(公告)日：2018-10-16

申请号：US15670044

申请日：2017-08-07

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Ming-Jaan Ho ,  Xian-Qin Hu ,  Fu-Yun Shen ,  Wen-Zhu Wei

IPC分类号： H01K3/10 ,  H05K1/11 ,  H05K3/42 ,  H05K1/09 ,  H05K3/06 ,  H05K3/02

CPC分类号： H05K1/115 ,  H05K1/09 ,  H05K3/027 ,  H05K3/067 ,  H05K3/425 ,  H05K2201/0355 ,  H05K2203/0369 ,  Y10T29/49165

摘要： A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

公开(公告)号：US09615445B2

公开(公告)日：2017-04-04

申请号：US14858652

申请日：2015-09-18

申请人： FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho ,  Yi-Qiang Zhuang

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/06

CPC分类号： H05K1/0216 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/09 ,  H05K3/06 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09618 ,  H05K2203/063

摘要： A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.