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    Clamped showerhead electrode assembly
    2.
    发明申请
    Clamped showerhead electrode assembly 有权
    夹紧淋浴头电极组件

    公开(公告)号：US20100003824A1

    公开(公告)日：2010-01-07

    申请号：US12216526

    申请日：2008-07-07

    申请人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    发明人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    IPC分类号： H01L21/3065 ,  C23C16/00 ,  B05C11/00

    CPC分类号： H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。 防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

    Clamped showerhead electrode assembly
    5.
    发明授权
    Clamped showerhead electrode assembly 有权
    夹紧淋浴头电极组件

    公开(公告)号：US08161906B2

    公开(公告)日：2012-04-24

    申请号：US12216526

    申请日：2008-07-07

    申请人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    发明人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    IPC分类号： C23C16/50 ,  C23C16/503 ,  C23C16/505 ,  C23C16/509 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

    CPC分类号： H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。 防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY
    7.
    发明申请
    CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 有权
    夹紧式淋浴电极组件

    公开(公告)号：US20120171872A1

    公开(公告)日：2012-07-05

    申请号：US13422696

    申请日：2012-03-16

    申请人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    发明人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    IPC分类号： H01L21/3065

    CPC分类号： H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。 防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

    Polishing head assembly in an apparatus for chemical mechanical planarization
    9.
    发明授权
    Polishing head assembly in an apparatus for chemical mechanical planarization 失效
    用于化学机械平面化的设备中的抛光头组件

    公开(公告)号：US06746313B1

    公开(公告)日：2004-06-08

    申请号：US09999066

    申请日：2001-10-24

    申请人： Xuyen Pham ,  Anthony de la Llera

    发明人： Xuyen Pham ,  Anthony de la Llera

    IPC分类号： B24B100

    CPC分类号： B24B37/32

    摘要： A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.

    摘要翻译： 提供了一种用于化学机械平面化装置的抛光头组件。 抛光头组件包括基本上类似于具有圆周，顶表面，底表面和外壁的盘的托架头，该外壁在其中具有槽，该槽从底表面延伸到承载头中 所述承载头和所述槽围绕所述承载头的整个圆周延伸; 以及具有内壁和外壁的保持环，所述保持环的内壁与所述承载头的外壁接触，所述内壁在其中具有槽，所述槽限定所述内壁的下部 作为柔性腿，柔性腿具有适于固定具有待抛光表面的物体的接收端，所述狭槽具有与载体头部中的凹槽相邻的第一端部端部和与第一端子相对的第二端子端部 终端，在保持环的主体中。 保持环也是一个承载头。 还提供了补偿化学机械平面化装置中的不均匀力分布的方法。

    Method and apparatus for applying downward force on wafer during CMP
    10.
    发明授权
    Method and apparatus for applying downward force on wafer during CMP 失效
    在CMP期间向晶片施加向下的力的方法和装置

    公开(公告)号：US06712670B2

    公开(公告)日：2004-03-30

    申请号：US10033671

    申请日：2001-12-27

    申请人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

    发明人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

    IPC分类号： B24B4900

    CPC分类号： B24B37/30 ,  B24B49/16

    摘要： An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

    摘要翻译： 在CMP操作期间将晶片施加到研磨带的装置包括具有上端和下端的心轴。 晶片载体联接到主轴的下端。 线轴力发生器设置在主轴的上端。 称重传感器位于线性力发生器和主轴上端之间。 控制器耦合到负载传感器，用于控制由线性力发生器施加的力。 还描述了在CMP期间在晶片上施加向下的力的方法。