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1.发明申请公开(公告)号：US20190393440A1
公开(公告)日：2019-12-26
申请号：US16465311
申请日：2018-08-31
发明人： Yanxia Xin , Zhiyong Yang , Fei Chen
摘要： The present disclosure provides a display substrate, a method for manufacturing the display substrate, a display panel, and a display device. The display substrate includes: a bonding region, and a plurality of pads disposed at intervals in the bonding region. The pads are spaced apart by an insulating layer, and a groove is set in the insulating layer between at least two adjacent pads. The groove is set in the insulating layer between at least two adjacent pads in the bonding region to enable the ACF to flow to the groove as pressed.
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公开(公告)号：US10256259B2
公开(公告)日：2019-04-09
申请号：US16002317
申请日：2018-06-07
发明人： Shihua Huang , Zhiyong Yang , Chao Fu , Wei He , Jing Wang , Dexiong Song , Liwei Huang , Wei Li , Chao Ma , Chaofan Li , Fei Chen
IPC分类号： H01L29/15 , H01L27/12 , H01L27/32 , G09G3/3291 , H01L51/52 , G09G3/3258
摘要： A display substrate, including: a display region and two non-display regions provided at two opposite sides of the display region, respectively; proximal end wiring and distal end wiring which are provided in the two non-display regions, respectively, wherein the proximal end wiring is wiring proximal to a driving chip to be employed to provide a driving voltage to the display substrate, and the distal end wiring is wiring distal to the driving chip; pixels provided within the display region; and data lines provided within the display region, wherein each data line is connected to the proximal and distal end wirings, respectively. Each of the pixels is provided with a power introduction structure, the power introduction structures of the pixels are connected to each other to form a mesh structure, and the mesh structure is connected to the proximal and distal end wiring, respectively, to form an electrically-conductive path.
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3.发明授权公开(公告)号：US11655399B2
公开(公告)日：2023-05-23
申请号：US16768033
申请日：2019-11-07
发明人： Ming Li , Kaimin Wang , Jie Xiang , Wei Li , Li Wang , Jing Wang , Zhiyong Yang , Fei Chen , Fei Li , Shuzhen Yang
CPC分类号： C09J11/08 , B32B43/006 , C08K5/16 , C08K5/20 , C09J7/10 , C09J7/30 , C09J7/40 , C09J133/24 , H10K50/80 , C08K2201/015 , C09J2301/208 , C09J2301/408 , C09J2301/412 , C09J2433/00 , C09J2463/00 , C09J2479/02
摘要： An adhesive film includes an adhesive film body, and a plurality of deformable particles dispersed in the adhesive film body. A volume of each of the plurality of deformable particles is capable of shrinking under a trigger condition.
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公开(公告)号：US11335703B2
公开(公告)日：2022-05-17
申请号：US16349367
申请日：2018-09-14
发明人： Dexiong Song , Zhiyong Yang , Liwei Huang , Shihua Huang , Xue Jiang , Shibing Yuan , Fei Chen , Wei Li , Chao Fu , Na Zhang , Yu Du , Xuemei Deng
IPC分类号： H01L27/12
摘要： The present disclosure provides a display panel, a method for manufacturing the same, and a display device. The insulation layer is provided above the first conductive electrodes in the bonding area of the display panel, the insulation layer covers the first conductive electrodes, and the insulation layer is capable of being pierced by ACF particles. When the display panel is bound to an FPC by an ACF, second conductive electrodes on the FPC can be electrically coupled to the first conductive electrodes on the display panel through the ACF particles, thereby achieving the bonding connection between the display panel and the FPC, even if a conductive foreign object falls into the area where the first conductive electrodes are located, short circuit cannot be caused, thereby improving the product yield.
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5.发明授权公开(公告)号：US10763450B2
公开(公告)日：2020-09-01
申请号：US16465311
申请日：2018-08-31
发明人： Yanxia Xin , Zhiyong Yang , Fei Chen
摘要： The present disclosure provides a display substrate, a method for manufacturing the display substrate, a display panel, and a display device. The display substrate includes: a bonding region, and a plurality of pads disposed at intervals in the bonding region. The pads are spaced apart by an insulating layer, and a groove is set in the insulating layer between at least two adjacent pads. The groove is set in the insulating layer between at least two adjacent pads in the bonding region to enable the ACF to flow to the groove as pressed.
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公开(公告)号：US10199295B2
公开(公告)日：2019-02-05
申请号：US15321172
申请日：2016-02-01
发明人： Fan Yang , Kun Guo , Yuqing Yang , Qi Liu , Bo Zhang , Fei Chen , Tianyi Cheng , Zihua Li , Yan Wu , Jin Yang , Liman Peng , Chao Kong
IPC分类号： H01L23/29 , H01L23/08 , G02F1/1339 , H01L23/053 , H01L23/13 , H01L23/15 , H01L23/24 , G02F1/1333 , G02F1/1345 , H01L51/52
摘要： A display panel and a method for forming the same are disclosed. The display panel includes a first substrate and a second substrate arranged opposite to each other. An integrated circuit (IC) is arranged at a non-display region of the first substrate, and at least one supporting component is arranged beyond a portion of the non-display region where the IC is arranged. A thickness of the at least one supporting component is larger than a thickness of the IC.
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公开(公告)号：US11036078B2
公开(公告)日：2021-06-15
申请号：US16401445
申请日：2019-05-02
发明人： Li Jiang , Tongmin Liu , Heng Zhang , Jun Xu , Fei Chen , Aoxiang Li
IPC分类号： G02F1/1335 , G02F1/13357
摘要： A display panel, a driving method thereof and a display device. The display panel includes a plurality of pixel units, the plurality of pixel units includes a first pixel unit, the first pixel unit includes a first sub-pixel, the first sub-pixel includes an infrared luminescent material on a display side, and the infrared luminescent material is capable of emitting infrared light under an irradiation of light emitted by the first sub-pixel.
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8.发明申请公开(公告)号：US20160225800A1
公开(公告)日：2016-08-04
申请号：US14743472
申请日：2015-06-18
发明人： Zhiliang Jiang , Minghua Xuan , Renrong Gai , Bo Zhang , Fei Chen
IPC分类号： H01L27/12
CPC分类号： H01L51/5246 , H01L21/02675 , H01L21/02686 , H01L21/428 , H01L21/449
摘要： The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.
摘要翻译： 本发明公开了一种使包装盖板的密封剂形成的表面平坦化的方法和系统以及包装方法，该方法包括使用具有预设频率的高频振动器来振动高温烧结包装盖板 并且通过使用具有预定功率的激光照射由包装盖板的密封剂形成的表面，使得由密封剂形成的凸部熔化并流到由高频振动器的振动下的密封剂形成的凹部， 从而使由包装盖板的密封剂形成的表面变平。
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公开(公告)号：US10211261B2
公开(公告)日：2019-02-19
申请号：US15320703
申请日：2016-03-25
发明人： Kun Guo , Yanqing Wang , Bo Zhang , Fei Chen , Jianbin Feng , Fan Yang
摘要： Embodiments of the present disclosure disclose a pixel structure, a mask plate, an organic electroluminescent display panel and a display device. The pixel structure comprises: a plurality of pixel units arranged in array, each pixel unit comprising four sub-pixels arranged diagonally and having the same shape and size; wherein colors of the four sub-pixels in each pixel unit are different from each other; colors of two adjacent sub-pixels in any two adjacent pixel units are same. The above pixel structure provided by embodiments of the present disclosure may enable the color of any sub-pixel in a pixel unit to be same as the colors of three sub-pixels that are located in other three pixel units adjacent to this pixel unit respectively and are symmetric with this sub-pixel relative to a same point.
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10.发明授权公开(公告)号：US10008690B2
公开(公告)日：2018-06-26
申请号：US14743472
申请日：2015-06-18
发明人： Zhiliang Jiang , Minghua Xuan , Renrong Gai , Bo Zhang , Fei Chen
IPC分类号： C03C25/68 , H01L51/52 , H01L21/428 , H01L21/02 , H01L21/449
CPC分类号： H01L51/5246 , H01L21/02675 , H01L21/02686 , H01L21/428 , H01L21/449
摘要： The present invention discloses a method and a system of flattening a surface formed by sealant of a packaging cover plate, as well as a packaging method, the method includes vibrating a high temperature sintered packaging cover plate by using a high frequency vibrator with a preset frequency, and irradiating the surface formed by sealant of the packaging cover plate by using a laser with preset power, so that a convex portion formed by the sealant is melted and flows to a concave portion formed by the sealant under vibration of the high frequency vibrator, thereby flattening the surface formed by sealant of the packaging cover plate.
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