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公开(公告)号：US20150311173A1
公开(公告)日：2015-10-29
申请号：US14262381
申请日：2014-04-25
IPC分类号： H01L23/00
CPC分类号： H01L24/49 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/05624 , H01L2224/431 , H01L2224/432 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45644 , H01L2224/45664 , H01L2224/45687 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48451 , H01L2224/48456 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85439 , H01L2224/85444 , H01L2224/85931 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/013 , H01L2924/01047 , H01L2924/01024 , H01L2924/01029 , H01L2924/01079 , H01L2924/01013 , H01L2924/01014 , H01L2924/00013 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.
摘要翻译： 半导体结构包括接合焊盘和耦合到接合焊盘的引线键合。 引线键合包括与接合焊盘接触的键。 引线接合包括在引线键合的表面上的涂层，以及在选定位置的引线键合的第一暴露部分。 引线接合在引线键合的选定位置上没有涂层，并且第一暴露部分的面积为至少一平方微米。
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公开(公告)号：US20150318240A1
公开(公告)日：2015-11-05
申请号：US14267378
申请日：2014-05-01
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L21/4853 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L2224/45124 , H01L2224/45139 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48091 , H01L2224/48228 , H01L2224/48465 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
摘要翻译： 一种电子部件封装，其包括具有由铝包铜结构形成的铝接合焊盘的封装基板。 铝包铜结构附着在电介质层上。 电子部件附接到基板并且包括电耦合到铝接合焊盘的导电结构。 铝合金焊盘，电子部件以及基板的至少一部分用密封剂封装。
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公开(公告)号：US20130320548A1
公开(公告)日：2013-12-05
申请号：US13485912
申请日：2012-05-31
CPC分类号： H01L23/3128 , H01L23/3135 , H01L23/367 , H01L23/42 , H01L2023/4056 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/1815 , H01L2924/3511 , H01L2224/45099
摘要： A packaged semiconductor device comprises a package substrate comprising a first package substrate contact and a second package substrate contact, and a semiconductor die over the package substrate. The semiconductor device further includes electrical connections between signal contact pads of the die and the package substrate, and a heat spreader that comprises a first heat spreader portion which is electrically connected to a first signal contact pad and the first package substrate contact and provides an electrical conduction path and a thermal conduction path. A second heat spreader portion provides an electrical conduction path between a second signal contact pad and the second package substrate contact and a thermal conduction path between the die and package substrate. An insulating layer is positioned between the first and second heat spreader portions.
摘要翻译： 封装的半导体器件包括包括第一封装衬底触点和第二封装衬底触点的封装衬底以及封装衬底上的半导体管芯。 所述半导体器件还包括在所述管芯和所述封装衬底的信号接触焊盘之间的电连接以及散热器，所述散热器包括电连接到第一信号接触焊盘的第一散热器部分和所述第一封装衬底接触并提供电 传导路径和导热路径。 第二散热器部分提供第二信号接触焊盘和第二封装衬底接触之间的导电路径以及管芯和封装衬底之间的热传导路径。 绝缘层位于第一和第二散热器部分之间。
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