公开(公告)号：US07638028B2

公开(公告)日：2009-12-29

申请号：US11196194

申请日：2005-08-03

申请人： Bahadir Tunaboylu ,  Edward L. Malantonio ,  David T. Beatson ,  Andrew Hmiel

发明人： Bahadir Tunaboylu ,  Edward L. Malantonio ,  David T. Beatson ,  Andrew Hmiel

IPC分类号： C25D5/06 ,  C25D17/00

CPC分类号： C25D5/02 ,  C25D5/022 ,  C25D7/00 ,  C25D17/00 ,  G01R1/06738 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00

摘要： A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

摘要翻译： 一种处理探针元件的方法包括（a）提供包括第一导电材料的探针元件，和（b）用第二导电材料仅涂覆探针元件的尖端部分。

公开(公告)号：US20060027747A1

公开(公告)日：2006-02-09

申请号：US11196194

申请日：2005-08-03

申请人： Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

发明人： Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

IPC分类号： C25D5/02 ,  C25D17/00 ,  H01J40/00

CPC分类号： C25D5/02 ,  C25D5/022 ,  C25D7/00 ,  C25D17/00 ,  G01R1/06738 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00

摘要： A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

公开(公告)号：US20060028220A1

公开(公告)日：2006-02-09

申请号：US11184581

申请日：2005-07-19

申请人： Edward Malantonio ,  Edward Laurent ,  Ilan Hanoon ,  Andrew Hmiel ,  Bahadir Tunaboylu ,  Anh-Tai Nguyen ,  Lich Tran

发明人： Edward Malantonio ,  Edward Laurent ,  Ilan Hanoon ,  Andrew Hmiel ,  Bahadir Tunaboylu ,  Anh-Tai Nguyen ,  Lich Tran

IPC分类号： G01R31/02

CPC分类号： B82Y30/00 ,  G01R1/0466 ,  G01R1/07307 ,  G01R1/07357 ,  G01R3/00

摘要： A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer.

摘要翻译： 提供探针卡组件。 探针卡组件包括基底和结合到基底表面的多个探针。 探针卡组件还包括设置在基板的表面上的加强层。 增强层与每个探针的下部接触，其中每个探针的剩余部分不含增强层。

公开(公告)号：US20050224930A1

公开(公告)日：2005-10-13

申请号：US11146366

申请日：2005-06-06

申请人： Rakesh Batish ,  Andrew Hmiel ,  Glenn Sandgren ,  Walt VonSeggern ,  C. Kulicke

发明人： Rakesh Batish ,  Andrew Hmiel ,  Glenn Sandgren ,  Walt VonSeggern ,  C. Kulicke

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/603 ,  H01L21/607 ,  H01L23/49 ,  H01L23/495

CPC分类号： H01L23/4952 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4899 ,  H01L2224/49171 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

摘要翻译： 提供包装半导体器件。 半导体器件包括多个半导体元件; 多个导体，提供所述多个半导体元件之间的互连; 以及仅跨越所述多个导体中的至少两个的一部分施加的绝缘材料。

公开(公告)号：US06847122B1

公开(公告)日：2005-01-25

申请号：US10686892

申请日：2003-10-16

申请人： Rakesh Batish ,  C. Scott Kulicke ,  Andrew Hmiel ,  Walt VonSeggern

发明人： Rakesh Batish ,  C. Scott Kulicke ,  Andrew Hmiel ,  Walt VonSeggern

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/48 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3157 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49176 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.

摘要翻译： 提供了包括多个元件的半导体器件的封装方法。 该方法包括将绝缘材料施加到半导体器件的至少一部分，其中绝缘材料包括直径小于相邻导体之间的间隙的绝缘颗粒，从而提供元件之间的互连。 该方法还包括固化绝缘材料。

公开(公告)号：US20050085019A1

公开(公告)日：2005-04-21

申请号：US10686974

申请日：2003-10-16

申请人： Rakesh Batish ,  Andrew Hmiel ,  Glenn Sandgren ,  Walt VonSeggern ,  C. Kulicke

发明人： Rakesh Batish ,  Andrew Hmiel ,  Glenn Sandgren ,  Walt VonSeggern ,  C. Kulicke

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/603 ,  H01L21/607 ,  H01L23/49 ,  H01L23/495

CPC分类号： H01L23/4952 ,  H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4899 ,  H01L2224/49171 ,  H01L2224/49176 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.