Diffusion plasma-assisted chemical treatment apparatus
    1.
    发明授权
    Diffusion plasma-assisted chemical treatment apparatus 失效
    扩散等离子体辅助化学处理装置

    公开(公告)号:US5105761A

    公开(公告)日:1992-04-21

    申请号:US597812

    申请日:1990-10-15

    CPC分类号: H01J37/3244 H01J37/32357

    摘要: The apparatus comprises a tight treatment enclosure (10), means (20,22) for the axial production of a carrier gas plasma, a solid plate (30) serving as an obstacle to the plasma and located perpendicular to the enclosure axis and downstream of the plasma production means, plasma diffusion means (40) located downstream of the obstacle plate, several non-ionized vector gas supply tubes (50) issuing axially into the enclosure beneath the diffusion means and all located in the same plane around the enclosure axis, a substrate carrier (56) positioned downstream of the vector gas supply tubes and perpendicular to the axis and annular pumping means (66,16) for the gaseous medium contained in the enclosure and positioned downstream of the substrate carrier.

    摘要翻译: 该设备包括紧密处理的外壳(10),用于轴向产生载气等离子体的装置(20,22),用作等离子体的障碍物并且垂直于外壳轴线定位的固体板(30) 等离子体生产装置,位于障碍板下游的等离子体扩散装置(40),几个非离子化的矢量气体供应管(50),其轴向地发射到扩散装置下方的壳体中,并且都围绕围绕轴线位于同一平面中, 位于所述向量气体供应管的下游并且垂直于所述轴线的衬底载体(56)和用于所述封装中并且位于所述衬底载体的下游的气态介质的环形泵送装置(66,16)。

    Process for etching by gas plasma
    2.
    发明授权
    Process for etching by gas plasma 失效
    气体等离子体蚀刻工艺

    公开(公告)号:US5047115A

    公开(公告)日:1991-09-10

    申请号:US439392

    申请日:1989-11-15

    摘要: The invention relates to a process for etching a substrate with the aid of a gas plasma produced either by ultra-high frequency waves, or by ultra-high frequency and radio-frequency waves.In this process, the gaseous medium used for the formation of the plasma comprises at least one non-carbon-containing fluorinating gas such as SF.sub.6, at least one rare gas such as Ar and at least one non-carbon-containing oxidizing gas such as oxygen, as well as optionally another gas such as nitrogen.The invention is more particularly usable in the microelectronics field.

    摘要翻译: PCT No.PCT / FR88 / 00272 Sec。 371日期:一九八九年十一月十五日 102(e)日期1989年11月15日PCT提交1988年5月31日PCT Pub。 第WO88 / 09830号公报 日期:1988年12月15日。本发明涉及借助于由超高频或超高频和高频波产生的气体等离子体蚀刻衬底的方法。 在该方法中,用于形成等离子体的气体介质包括至少一种非碳的氟化气体,例如SF 6,至少一种稀有气体如Ar和至少一种非碳氧化气体,例如 氧,以及任选的另一种气体如氮气。 本发明在微电子领域更具体地使用。