DEVICE STRUCTURES INCLUDING DUAL-DEPTH TRENCH ISOLATION REGIONS AND DESIGN STRUCTURES FOR A STATIC RANDOM ACCESS MEMORY
    1.
    发明申请
    DEVICE STRUCTURES INCLUDING DUAL-DEPTH TRENCH ISOLATION REGIONS AND DESIGN STRUCTURES FOR A STATIC RANDOM ACCESS MEMORY 审中-公开
    设备结构包括双深度分离隔离区域和静态随机访问存储器的设计结构

    公开(公告)号:US20090267156A1

    公开(公告)日:2009-10-29

    申请号:US12111285

    申请日:2008-04-29

    IPC分类号: H01L27/092 G06F17/50

    CPC分类号: H01L21/823481 H01L27/1104

    摘要: Device structures and design structures for a static random access memory. The device structure includes a well of a first conductivity type in a semiconductor layer, first and second deep trench isolation regions in the semiconductor layer that laterally bound a device region in the well, and first and second pluralities of doped regions of a second conductivity type in the first device region. A shallow trench isolation region extends laterally across in the device region to connect the first and second deep trench isolation regions, and is disposed in the device region between the first and second pluralities of doped regions. The shallow trench isolation region extends from the top surface into the semiconductor layer to a first depth such that the well is continuous beneath the shallow trench isolation region. A gate stack controls carrier flow between a pair of the first plurality of doped regions.

    摘要翻译: 静态随机存取存储器的器件结构和设计结构。 器件结构包括在半导体层中的第一导电类型的阱,半导体层中的横向地限定阱中的器件区域的第一和第二深沟槽隔离区以及第二和第二多个第二导电类型的掺杂区 在第一个设备区域。 浅沟槽隔离区域在器件区域中横向延伸以连接第一和第二深沟槽隔离区域,并且设置在第一和第二多个掺杂区域之间的器件区域中。 浅沟槽隔离区域从顶表面延伸到半导体层到第一深度,使得阱在浅沟槽隔离区域下连续。 栅极堆叠控制一对第一多个掺杂区域之间的载流子流动。

    Maskless inter-well deep trench isolation structure and methods of manufacture
    2.
    发明授权
    Maskless inter-well deep trench isolation structure and methods of manufacture 有权
    无掩膜深沟槽隔离结构及制造方法

    公开(公告)号:US08536018B1

    公开(公告)日:2013-09-17

    申请号:US13467314

    申请日:2012-05-09

    IPC分类号: H01L27/108

    摘要: A low power maskless inter-well deep trench isolation structure and methods of manufacture such structure are provided. A method includes depositing a plurality of layers over a substrate, and forming a layer over the plurality of layers. The method also includes forming well structures in the substrate, and forming sidewall spacers at opposing sides of the layer. The method further includes forming a self-aligned deep trench in the substrate to below the well structures, by removing the sidewall spacers and portions of the substrate aligned with an opening formed by the removal of the sidewall spacers. The method also includes forming a shallow trench in alignment with the deep trench. The method further includes forming shallow trench isolation structures and deep trench isolation structures by filling the shallow trench and the deep trench with insulator material.

    摘要翻译: 提供了一种低功率无掩膜深沟槽隔离结构及其制造方法。 一种方法包括在衬底上沉积多个层,并在多个层上形成层。 该方法还包括在衬底中形成阱结构,以及在层的相对侧形成侧壁间隔物。 该方法还包括通过去除侧壁间隔件和与通过去除侧壁间隔件形成的开口对准的衬底的部分,将衬底中的自对准深沟槽形成在阱结构下方。 该方法还包括形成与深沟槽对准的浅沟槽。 该方法还包括通过用绝缘体材料填充浅沟槽和深沟槽来形成浅沟槽隔离结构和深沟槽隔离结构。

    METHODS OF FABRICATING DUAL-DEPTH TRENCH ISOLATION REGIONS FOR A MEMORY CELL
    3.
    发明申请
    METHODS OF FABRICATING DUAL-DEPTH TRENCH ISOLATION REGIONS FOR A MEMORY CELL 审中-公开
    制备记忆细胞的双深度分离分离区的方法

    公开(公告)号:US20090269897A1

    公开(公告)日:2009-10-29

    申请号:US12111266

    申请日:2008-04-29

    IPC分类号: H01L21/8234

    CPC分类号: H01L21/823481 H01L27/1104

    摘要: Methods for fabricating dual-depth trench isolation regions for a memory cell. First and second deep trench isolation regions are formed in the semiconductor layer that laterally bound a device region in a well of a first conductivity type in the semiconductor layer. First and second pluralities of doped regions of a second conductivity type are formed in the device region. A shallow trench isolation region is formed that extends laterally across the device region from the first deep trench isolation region to the second deep trench isolation region. The shallow trench isolation region is disposed in the device region between the first and second pluralities of doped regions. The shallow trench isolation region extends into the semiconductor layer to a depth such that the well is continuous beneath the shallow trench isolation region. A gate stack controls carrier flow between a pair of the first plurality of doped regions.

    摘要翻译: 用于制造用于存储单元的双深度沟槽隔离区域的方法。 在半导体层中形成第一和第二深沟槽隔离区域,该半导体层横向地限定半导体层中的第一导电类型的阱中的器件区域。 在器件区域中形成第二导电类型的第一和第二多个掺杂区域。 形成了浅沟槽隔离区域,其横跨穿过器件区域从第一深沟槽隔离区域延伸到第二深沟槽隔离区域。 浅沟槽隔离区设置在第一和第二多个掺杂区域之间的器件区域中。 浅沟槽隔离区域延伸到半导体层中的深度,使得阱在浅沟槽隔离区域之下是连续的。 栅极堆叠控制一对第一多个掺杂区域之间的载流子流动。

    FinFETs single-sided implant formation
    4.
    发明授权
    FinFETs single-sided implant formation 有权
    FinFET单面植入物形成

    公开(公告)号:US07994612B2

    公开(公告)日:2011-08-09

    申请号:US12106476

    申请日:2008-04-21

    IPC分类号: H01L21/02

    摘要: A method patterns pairs of semiconducting fins on an insulator layer and then patterns a linear gate conductor structure over and perpendicular to the fins. Next, the method patterns a mask on the insulator layer adjacent the fins such that sidewalls of the mask are parallel to the fins and are spaced from the fins a predetermined distance. The method performs an angled impurity implant into regions of the fins not protected by the gate conductor structure and the mask. This process forms impurity concentrations within the fins that are asymmetric and that mirror one another in adjacent pairs of fins.

    摘要翻译: 一种方法在绝缘体层上形成一对半导体翅片,然后在鳍片上并垂直于翅片形成线性栅极导体结构。 接下来,该方法在与鳍片相邻的绝缘体层上形成掩模,使得掩模的侧壁平行于翅片并与翅片间隔预定距离。 该方法对未被栅极导体结构和掩模保护的鳍片的区域进行倾斜的杂质注入。 该方法在翅片内形成不对称的杂质浓度,并且在相邻的翅片对中彼此相互镜像。

    FINFETs SINGLE-SIDED IMPLANT FORMATION
    5.
    发明申请
    FINFETs SINGLE-SIDED IMPLANT FORMATION 有权
    FINFET单面植入物形成

    公开(公告)号:US20090261425A1

    公开(公告)日:2009-10-22

    申请号:US12106476

    申请日:2008-04-21

    摘要: A method patterns pairs of semiconducting fins on an insulator layer and then patterns a linear gate conductor structure over and perpendicular to the fins. Next, the method patterns a mask on the insulator layer adjacent the fins such that sidewalls of the mask are parallel to the fins and are spaced from the fins a predetermined distance. The method performs an angled impurity implant into regions of the fins not protected by the gate conductor structure and the mask. This process forms impurity concentrations within the fins that are asymmetric and that mirror one another in adjacent pairs of fins.

    摘要翻译: 一种方法在绝缘体层上形成一对半导体翅片,然后在鳍片上并垂直于翅片形成线性栅极导体结构。 接下来,该方法在与鳍片相邻的绝缘体层上形成掩模,使得掩模的侧壁平行于翅片并与翅片间隔预定距离。 该方法对未被栅极导体结构和掩模保护的鳍片的区域进行倾斜的杂质注入。 该方法在翅片内形成不对称的杂质浓度,并且在相邻的翅片对中彼此相互镜像。

    Fin Fet device with independent control gate
    7.
    发明授权
    Fin Fet device with independent control gate 有权
    Fin Fet设备具有独立的控制门

    公开(公告)号:US09214529B2

    公开(公告)日:2015-12-15

    申请号:US13047132

    申请日:2011-03-14

    摘要: A FinFET device with an independent control gate, including: a silicon-on-insulator substrate; a non-planar multi-gate transistor disposed on the silicon-on-insulator substrate, the transistor comprising a conducting channel wrapped around a thin silicon fin; a source/drain extension region; an independently addressable control gate that is self-aligned to the fin and does not extend beyond the source/drain extension region, the control gate comprising: a thin layer of silicon nitride; and a plurality of spacers.

    摘要翻译: 一种具有独立控制栅极的FinFET器件,包括:绝缘体上硅衬底; 设置在绝缘体上硅衬底上的非平面多栅极晶体管,所述晶体管包括围绕薄硅片缠绕的导电沟道; 源极/漏极延伸区域; 独立可寻址的控制栅极,其与所述鳍片自对准并且不延伸超过所述源极/漏极延伸区域,所述控制栅极包括:氮化硅薄层; 和多个间隔件。

    Collapsable gate for deposited nanostructures
    8.
    发明授权
    Collapsable gate for deposited nanostructures 失效
    用于沉积的纳米结构的可折叠门

    公开(公告)号:US08492748B2

    公开(公告)日:2013-07-23

    申请号:US13169542

    申请日:2011-06-27

    CPC分类号: H01L29/66045 H01L51/055

    摘要: A disposable material layer is first deposited on a graphene layer or a carbon nanotube (CNT). The disposable material layer includes a material that is less inert than graphene or CNT so that a contiguous dielectric material layer can be deposited at a target dielectric thickness without pinholes therein. A gate stack is formed by patterning the contiguous dielectric material layer and a gate conductor layer deposited thereupon. The disposable material layer shields and protects the graphene layer or the CNT during formation of the gate stack. The disposable material layer is then removed by a selective etch, releasing a free-standing gate structure. The free-standing gate structure is collapsed onto the graphene layer or the CNT below at the end of the selective etch so that the bottom surface of the contiguous dielectric material layer contacts an upper surface of the graphene layer or the CNT.

    摘要翻译: 一次性材料层首先沉积在石墨烯层或碳纳米管(CNT)上。 一次性材料层包括比石墨烯或CNT更不惰性的材料,使得可以以目标电介质厚度沉积连续的电介质材料层而没有针孔。 通过图案化连续的介电材料层和沉积在其上的栅极导体层来形成栅极叠层。 一次性材料层在形成栅极叠层期间屏蔽并保护石墨烯层或CNT。 然后通过选择性蚀刻去除一次性材料层,释放独立的栅极结构。 独立栅极结构在选择性蚀刻结束时在石墨烯层或CNT上折叠,使得连续介电材料层的底表面接触石墨烯层或CNT的上表面。