High mobility transistors in SOI and method for forming
    1.
    发明授权
    High mobility transistors in SOI and method for forming 失效
    SOI中的高迁移率晶体管和形成方法

    公开(公告)号:US06962838B2

    公开(公告)日:2005-11-08

    申请号:US10447579

    申请日:2003-05-29

    IPC分类号: H01L21/84 H01L27/12 H01L21/00

    摘要: The present invention provides a device design and method for forming Field Effect Transistors (FETs) that have improved performance without negative impacts to device density. The present invention forms high-gain p-channel transistors by forming them on silicon islands where hole mobility has been increased. The hole mobility is increased by applying physical straining to the silicon islands. By straining the silicon islands, the hole mobility is increased resulting in increased device gain. This is accomplished without requiring an increase in the size of the devices, or the size of the contacts to the devices.

    摘要翻译: 本发明提供了一种用于形成场效应晶体管(FET)的器件设计和方法,其具有改进的性能而不会对器件密度造成负面影响。 本发明通过在硅岛上形成高增益p沟道晶体管,其中空穴迁移率已经增加。 通过对硅岛施加物理应变来增加空穴迁移率。 通过拉伸硅岛,空穴迁移率增加,导致器件增益增加。 这是在不需要增加设备尺寸或者与设备的触点的尺寸的情况下实现的。

    High mobility transistors in SOI and method for forming
    2.
    发明授权
    High mobility transistors in SOI and method for forming 有权
    SOI中的高迁移率晶体管和形成方法

    公开(公告)号:US06624478B2

    公开(公告)日:2003-09-23

    申请号:US09683656

    申请日:2002-01-30

    IPC分类号: H01L2701

    摘要: The present invention provides a device design and method for forming Field Effect Transistors (FETs) that have improved performance without negative impacts to device density. The present invention forms high-gain p-channel transistors by forming them on silicon islands where hole mobility has been increased. The hole mobility is increased by applying physical straining to the silicon islands. By straining the silicon islands, the hole mobility is increased resulting in increased device gain. This is accomplished without requiring an increase in the size of the devices, or the size of the contacts to the devices.

    摘要翻译: 本发明提供了一种用于形成场效应晶体管(FET)的器件设计和方法,其具有改进的性能而不会对器件密度造成负面影响。 本发明通过在硅岛上形成高增益p沟道晶体管,其中空穴迁移率已经增加。 通过对硅岛施加物理应变来增加空穴迁移率。 通过拉伸硅岛,空穴迁移率增加,导致器件增益增加。 这是在不需要增加设备尺寸或者与设备的触点的尺寸的情况下实现的。

    Buried butted contact and method for fabricating
    5.
    发明授权
    Buried butted contact and method for fabricating 失效
    埋地接头和制造方法

    公开(公告)号:US06335272B1

    公开(公告)日:2002-01-01

    申请号:US09637935

    申请日:2000-08-14

    IPC分类号: H01L214763

    摘要: A buried butted contact and method for its fabrication are provided which includes a substrate having dopants of a first conductivity type and having shallow trench isolation. Dopants of a second conductivity type are located in the bottom of an opening in said substrate. Ohmic contact is provided between the dopants in the substrate and the low diffusivity dopants that is located on a side wall of the opening. The contact is a metal silicide, metal and/or metal alloy.

    摘要翻译: 提供了一种用于其制造的埋地对接接触和方法,其包括具有第一导电类型的掺杂剂并且具有浅沟槽隔离的衬底。 第二导电类型的掺杂剂位于所述衬底中的开口的底部。 在衬底中的掺杂剂和位于开口的侧壁上的低扩散性掺杂剂之间提供欧姆接触。 接触是金属硅化物,金属和/或金属合金。

    Method of forming refractory metal contact in an opening, and resulting structure
    6.
    发明授权
    Method of forming refractory metal contact in an opening, and resulting structure 失效
    在开口中形成难熔金属接触的方法,以及结果

    公开(公告)号:US06900505B2

    公开(公告)日:2005-05-31

    申请号:US10709174

    申请日:2004-04-19

    IPC分类号: C23C28/00 H01L31/119

    CPC分类号: C23C28/00 Y10T428/12

    摘要: A structure which ensures against deterioration of an underlying silicide layer over which a refractory material layer is deposited by physical vapor deposition (PVD) or chemical vapor deposition (CVD) is realized by first providing a continuous polysilicon layer prior to the refractory material deposition. The continuous polysilicon layer, preferably no thicker than 50 Å, serves a sacrificial purpose and prevents damage to an underlying silicide layer by blocking interaction between any fluorine and the underlying silicide that is released when the refractory material is formed.

    摘要翻译: 通过首先在耐火材料沉积之前提供连续的多晶硅层,来实现通过物理气相沉积(PVD)或化学气相沉积(CVD)来确保防止耐火材料层沉积下层硅化物层的劣化的结构。 连续多晶硅层优选不大于50,用于牺牲目的,并且通过阻止在形成耐火材料时释放的任何氟和下面的硅化物之间的相互作用来防止对下面的硅化物层的损伤。

    Mask with linewidth compensation and method of making same
    7.
    发明授权
    Mask with linewidth compensation and method of making same 失效
    具有线宽补偿的掩模及其制作方法

    公开(公告)号:US06338921B1

    公开(公告)日:2002-01-15

    申请号:US09479150

    申请日:2000-01-07

    IPC分类号: G03F102

    CPC分类号: G03F7/0035 G03F1/36

    摘要: A mask (50′) with linewidth compensation and a method of making same. The mask provides for optimized imaging of isolated patterns (64) and nested patterns (70) present on the same mask. The compensated mask is formed from an uncompensated mask (50) and comprises an upper surface (56) upon which the isolated and nested patterns are formed. The isolated pattern comprises a first segment (76) having first sidewalls (76S). The nested pattern comprises second segments (72) proximate each other and having second sidewalls (72S). A partial conformal layer (86) covers the first segment and has feet (90) outwardly extending a distance d from the first sidewalls along the upper surface. The feet are preferably of a thickness that partially transmits exposure light.

    摘要翻译: 具有线宽补偿的掩模(50')及其制造方法。 掩模提供对同一掩模上存在的孤立图案(64)和嵌套图案(70)的优化成像。 补偿掩模由未补偿的掩模(50)形成,并且包括形成隔离和嵌套图案的上表面(56)。 隔离图案包括具有第一侧壁(76S)的第一段(76)。 嵌套图案包括彼此靠近并具有第二侧壁(72S)的第二段(72)。 部分保形层(86)覆盖第一段并且具有沿着上表面向外延伸距离第一侧壁的距离d的脚(90)。 脚部优选地具有部分地透射曝光光的厚度。

    Method of forming refractory metal contact in an opening, and resulting structure
    8.
    发明授权
    Method of forming refractory metal contact in an opening, and resulting structure 失效
    在开口中形成难熔金属接触的方法,以及结果

    公开(公告)号:US06762121B2

    公开(公告)日:2004-07-13

    申请号:US09826036

    申请日:2001-04-04

    IPC分类号: C23C1434

    CPC分类号: C23C28/00 Y10T428/12

    摘要: A method of ensuring against deterioration of an underlying silicide layer over which a refractory material layer is deposited by physical vapor deposition (PVD) or chemical vapor deposition (CVD) is realized by first providing a continuous polysilicon layer prior to the refractory material deposition. The continuous polysilicon layer, preferably no thicker than 50 Å, serves a sacrificial purpose and prevents interaction between any fluorine that is released during the refractory material deposition step from interacting with the underlying silicide.

    摘要翻译: 通过首先在耐火材料沉积之前提供连续的多晶硅层,来实现通过物理气相沉积(PVD)或化学气相沉积(CVD)确保耐蚀材料层沉积在其下的硅化物层的劣化的方法。 连续多晶硅层,优选不大于50,用于牺牲目的,并且防止在耐火材料沉积步骤期间释放的任何氟与下面的硅化物相互作用的相互作用。

    Method of forming resist images by periodic pattern removal
    9.
    发明授权
    Method of forming resist images by periodic pattern removal 失效
    通过周期性图案去除形成抗蚀剂图像的方法

    公开(公告)号:US06387596B2

    公开(公告)日:2002-05-14

    申请号:US09385929

    申请日:1999-08-30

    IPC分类号: G03F720

    摘要: The present invention provides a method of forming nested and isolated images in a photosensitive resist. In the disclosed method, the entire surface of the photosensitive resist or selected regions thereof is exposed to a first mask having a set of nested, i.e. repeating pattern or grid images thereon, and then exposed to a second mask in order to remove unwanted portions of the nested image, so as to provide regions of nested and regions of isolated images in said photosensitive resist. The method may also be used to form regions having images in proximity to one another and regions having isolated images by exposing the entire surface of the photosensitive resist to a first mask having repeating patterns, and then removing entire or portions of the repeating patterns by exposure of the photosensitive resist with a second mask.

    摘要翻译: 本发明提供了一种在光敏抗蚀剂中形成嵌套和分离的图像的方法。 在所公开的方法中,光敏抗蚀剂或其选择的区域的整个表面暴露于具有一套嵌套的即第一掩模,即在其上重复图案或网格图像的第一掩模,然后暴露于第二掩模以便去除不需要的部分 嵌套图像,以便在所述光敏抗蚀剂中提供嵌套区域和孤立图像区域。 该方法还可以用于通过将光敏抗蚀剂的整个表面暴露于具有重复图案的第一掩模,然后通过曝光去除整个或部分重复图案,从而形成具有彼此接近的图像的区域和具有隔离图像的区域 的光敏抗蚀剂。