公开(公告)号：US5214250A

公开(公告)日：1993-05-25

申请号：US762201

申请日：1991-09-19

申请人： Burtran J. Cayson ,  John A. Covert ,  Steven A. Duncan ,  John M. Lauffer ,  Issa S. Mahmoud ,  Richard A. Schumacher

发明人： Burtran J. Cayson ,  John A. Covert ,  Steven A. Duncan ,  John M. Lauffer ,  Issa S. Mahmoud ,  Richard A. Schumacher

IPC分类号： H05K3/22 ,  H01L21/48 ,  H05K3/46

CPC分类号： H01L21/485 ,  H05K3/4664 ,  H05K3/4685 ,  Y10T29/49155

摘要： Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor. The polymeric dielectric bottom layer may include one or more layers atop one another.

公开(公告)号：US5571593A

公开(公告)日：1996-11-05

申请号：US467558

申请日：1995-06-06

申请人： Roy L. Arldt ,  Christina M. Boyko ,  Burtran J. Cayson ,  Richard M. Kozlowski ,  Joseph D. Kulesza ,  John M. Lauffer ,  Philip C. Liu ,  Voya R. Markovich ,  Issa S. Mahmoud ,  James F. Muska ,  Kostas Papathomas ,  Joseph G. Sabia ,  Richard A. Schumacher

发明人： Roy L. Arldt ,  Christina M. Boyko ,  Burtran J. Cayson ,  Richard M. Kozlowski ,  Joseph D. Kulesza ,  John M. Lauffer ,  Philip C. Liu ,  Voya R. Markovich ,  Issa S. Mahmoud ,  James F. Muska ,  Kostas Papathomas ,  Joseph G. Sabia ,  Richard A. Schumacher

IPC分类号： B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40 ,  B32B9/00

CPC分类号： H01B1/24 ,  B32B7/04 ,  H01B1/22 ,  H05K1/095 ,  H05K1/113 ,  H05K1/167 ,  H05K3/4053 ,  H05K3/4069 ,  H01L2224/16235 ,  H05K1/16 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0207 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0763 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0094 ,  Y10S428/901 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25

摘要： The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

摘要翻译： 本发明允许焊接接头直接制成通孔和通孔，而不会通过用环氧树脂或氰酸盐填充组合物填充电镀通孔，焊料不会被弄脏到通孔或通孔中。 当固化和过度镀覆时，填充组合物为焊接接头提供支撑，并为相互连接提供平坦的可焊接表面。 在某些实施方案中，固化的填充组合物提供另外的导电性的优点。 本发明还涉及用这种填充组合物填充通孔的几种新方法，以及位于通孔和通孔中的电阻器。