摘要:
The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.
摘要:
There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.
摘要:
There is described a method and apparatus for measuring temperature of a fluid in a microchannel of the type having spaced walls. An ultrasonic transducer transmits ultrasonic waves transmitted from one wall to the opposite wall. A processor determines the time-of-flight of the ultrasonic waves from the one wall and reflected to the opposite wall to the one wall. The processor converts the time-of-flight to velocity by dividing the distance between walls by the time-of-flight. The processor converts velocity to temperature from the relationship of velocity to temperature in the fluid.
摘要:
A capacitive membrane ultrasonic transducer which includes a membrane supported by a substrate in which ultrasonic bulk waves at the frequency of operation of the transducers are suppressed by configuring the substrate and a method of suppressing the ultrasonic bulk waves.
摘要:
A wafer with through wafer interconnects. The wafer includes spaced through wafer vias which extend between the back side and front side of the wafer. A conductor within each of said vias connects to front and back side pads. Functions associated with said conductor and said pads provide a depletion region in the wafer between the pads and wafer or pads and conductor and the wafer.
摘要:
A wide frequency band micromachined microphone including a plurality of micromachined cells of the type including electrodes carried by a membrane supported above a common electrode with conductive lines interconnecting the electrodes is described. A method of operating a microphone array is also described.
摘要:
A capacitive ultrasonic transducer is described which include one or more cells including a cavity defined by a membrane electrode supported spaced from a support electrode by insulating walls with a patterned isolation layer having isolation posts or areas located in said cavity to prevent the electrodes for coming into contact during operation of the transducer, and to minimize the accumulation of charge as compared to a non-patterned isolation layer for preventing contact of the electrodes during operation of the transducer.
摘要:
A compression post capacitive micromachined ultrasonic transducer (CMUT) is provided. The compression post CMUT includes a first electrode, a top conductive layer having a pattern of post holes, a moveable mass that includes the first electrode. The compression post CMUT further includes an operating gap disposed between the top surface of the top conductive layer and a bottom surface of the moveable mass, a pattern of compression posts, where a proximal end the compression post is connected perpendicularly to a bottom surface of the moveable mass, where the pattern of compression posts span through the pattern of post holes. The top conductive layer includes the second electrode that is electronically insulated from the first electrode, where the pattern of compression posts compress to provide a restoring force in a direction that is normal to the bottom surface of the moveable mass.
摘要:
Surface selective photoacoustic (PA) medical imaging is introduced. Surface selective PA imaging is responsive to surface features and does not image sub-surface features, in contrast to conventional PA imaging. The surface PA signal can be considerably larger than the bulk PA signal, for an air-coupled (or gas-coupled) acoustic transducer. Distinguishing these two signals based on time of arrival at the transducer can further distinguish the two signals. This approach provides numerous advantages.Non-contact imaging simplifies and expedites imaging, and can serve as a replacement for visual inspection by physicians. Applications include skin screening and endoscopy.
摘要:
An invention for coherent array image formation and restoration is taught. The invention is applicable for both 2D and 3D imaging using either 1D or 2D arrays, respectively. A transducer array is subdivided into subarrays, each subarray having a number of adjacent array elements. All elements of each subarray transmit and receive in parallel. The signals received from each subarray are delayed and summed to form scan lines, or beams. The low-beam-rate beams formed from each subarray are upsampled and interpolated prior to forming high-beam-rate images. Depending on the subarray geometry, a subarray-dependent restoration filter is also applied to the subarray beams. The restored beams from each subarray are combined to form the final high-beam-rate image. The invention significantly reduces the front-end hardware complexity compared to conventional methods such as full phased array imaging with comparable image quality.