MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD
    1.
    发明申请
    MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD 有权
    多层芯片电容器,具有电容器的电路板装置和电路板

    公开(公告)号:US20090059469A1

    公开(公告)日:2009-03-05

    申请号:US12198342

    申请日:2008-08-26

    IPC分类号: H01G4/06 H01G4/228 H05K7/00

    摘要: Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.

    摘要翻译: 本发明提供一种多层片状电容器,其包括具有层叠方向配置的第一和第二电容器单元的电容器体; 以及形成在电容器主体外部的多个外部电极。 第一电容器单元包括交替设置在电容器主体的内部的至少一对第一和第二内部电极,第二电容器单元包括交替设置在电容器主体内部的多个第三和第四内部电极, 并且第一至第四内部电极耦合到第一至第四外部电极。 第一电容器单元具有比第二电容器单元更低的等效串联电感(ESL),并且第一电容器单元具有比第二电容器单元更高的等效串联电阻(ESR)。

    CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE
    2.
    发明申请
    CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE 有权
    电路板设备和集成电路设备

    公开(公告)号:US20100149769A1

    公开(公告)日:2010-06-17

    申请号:US12421953

    申请日:2009-04-10

    IPC分类号: H05K1/18

    摘要: A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

    摘要翻译: 一种电路板装置,包括:电路板,包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器(MLCC),其包括电容器本体,多个第一和第二极性 内电极,第一外电极和第二外电极以及第三外电极,其中第一和第二电源线分别设置在安装区域上,连接到第一外电极和第二外电极,并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开
    多层陶瓷电子元件

    公开(公告)号:US20130155574A1

    公开(公告)日:2013-06-20

    申请号:US13541494

    申请日:2012-07-03

    IPC分类号: H01G4/012

    CPC分类号: H01G4/232 H01G4/012 H01G4/30

    摘要: A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability.

    摘要翻译: 提供了通过降低等效串联电阻(ESR)色散而具有高可靠性的多层陶瓷电子元件。 通过将连接到第一和第二端子电极的虚设电极引入第三和第四内部电极层来确保内部电极和外部电极之间的连通性。 降低多层陶瓷电子部件的ESR分散,获得高可靠性。

    MULTILAYER CHIP CAPACITOR
    5.
    发明申请
    MULTILAYER CHIP CAPACITOR 审中-公开
    多层芯片电容器

    公开(公告)号:US20110013341A1

    公开(公告)日:2011-01-20

    申请号:US12651175

    申请日:2009-12-31

    IPC分类号: H01G4/06 H01G4/30

    CPC分类号: H01G4/228 H01G4/005 H01G4/30

    摘要: Disclosed is a multilayer chip capacitor including a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes of opposite polarity disposed on an outer face of the capacitor body, first and second inner electrodes opposing each other inside the capacitor body to interpose the dielectric layer therebetween, the first inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the first outer electrode, and the second inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the second outer electrode. The leads are bent at least once and each have an overlap portion overlapping a lead of an adjacent inner electrode of opposite or like polarity when viewed along a stacked direction in which the plurality of dielectric layers are stacked.

    摘要翻译: 公开了一种多层片状电容器,包括:电容器本体,包括层叠的多个电介质层,设置在电容器主体的外表面上的相反极性的第一外部电极和第二外部电极,电容器主体内部彼此相对的第一和第二内部电极 将电介质层介于其间,第一内电极包括电极板形成电容和从电极板延伸并连接到第一外电极的引线,第二内电极包括电极板形成电容和从 电极板并连接到第二外部电极。 引线弯曲至少一次,并且当沿堆叠多个电介质层的堆叠方向观察时,引线与相邻或相似极性的相邻内部电极的引线重叠,并且每个引线重叠。