摘要:
Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.
摘要:
A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.
摘要:
A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability.
摘要:
A packing unit for a plurality of multi-layered ceramic capacitors including: a plurality of multi-layered ceramic capacitors having a thickness TMLCC equal or similar to a width WMLCC; and a packing sheet including a plurality of storing spaces, the capacitors being stored in the storing spaces and internal electrodes of each capacitor being substantially parallel with a bottom of the storing space. A related method includes: transferring a plurality of multi-layered ceramic capacitors having a thickness TMLCC equal or similar to a width WMLCC through a transferring unit; supplying magnetic field to a side of the capacitor so that the internal electrodes of the capacitor are substantially parallel with a bottom of the transferring unit; and storing the multi-layered ceramic capacitor in a storing space of a packing sheet so that the internal electrodes of the capacitor are substantially parallel with a bottom of the storing space.
摘要:
Disclosed is a multilayer chip capacitor including a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes of opposite polarity disposed on an outer face of the capacitor body, first and second inner electrodes opposing each other inside the capacitor body to interpose the dielectric layer therebetween, the first inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the first outer electrode, and the second inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the second outer electrode. The leads are bent at least once and each have an overlap portion overlapping a lead of an adjacent inner electrode of opposite or like polarity when viewed along a stacked direction in which the plurality of dielectric layers are stacked.