MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD
    1.
    发明申请
    MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD 有权
    多层芯片电容器,具有电容器的电路板装置和电路板

    公开(公告)号:US20090059469A1

    公开(公告)日:2009-03-05

    申请号:US12198342

    申请日:2008-08-26

    IPC分类号: H01G4/06 H01G4/228 H05K7/00

    摘要: Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.

    摘要翻译: 本发明提供一种多层片状电容器,其包括具有层叠方向配置的第一和第二电容器单元的电容器体; 以及形成在电容器主体外部的多个外部电极。 第一电容器单元包括交替设置在电容器主体的内部的至少一对第一和第二内部电极,第二电容器单元包括交替设置在电容器主体内部的多个第三和第四内部电极, 并且第一至第四内部电极耦合到第一至第四外部电极。 第一电容器单元具有比第二电容器单元更低的等效串联电感(ESL),并且第一电容器单元具有比第二电容器单元更高的等效串联电阻(ESR)。

    MULTILAYER CHIP CAPACITOR
    2.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20090244803A1

    公开(公告)日:2009-10-01

    申请号:US12245856

    申请日:2008-10-06

    IPC分类号: H01G4/30

    CPC分类号: H01G4/30 H01G4/012 H01G4/232

    摘要: A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1≧20 mΩ and 0.7(ESR1)≦ESR2≦1.3(ESR1).

    摘要翻译: 多层片状电容器包括电容器本体,其包括第一电容器部分和第二电容器部分,分别形成在电容器主体的第一和第二长侧面上的第一和第二外部电极,以及分别形成在第一和第二电极部分上的第三和第四外部电极 电容器主体的较短侧面。 第一电容器部分包括具有相反极性的第一和第二内部电极,并且第二电容器部分包括具有相反极性的第三和第四内部电极。 第一至第四内部电极各有一个引线。 第一至第四外部电极分别连接到第一至第四内部电极的引线。 第一电容器部分的串联谐振频率与第二电容器部分的串联谐振频率不同。 第一电容器部分的等效串联电阻(ESR1)和第二电容器部分的等效串联电阻(ESR2)满足ERS1> = 20mOmega和0.7(ESR1)<= ESR2 <= 1.3(ESR1)。

    MULTILAYER CHIP CAPACITOR AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    MULTILAYER CHIP CAPACITOR AND METHOD OF FABRICATING THE SAME 有权
    多层芯片电容器及其制造方法

    公开(公告)号:US20100238605A1

    公开(公告)日:2010-09-23

    申请号:US12650134

    申请日:2009-12-30

    IPC分类号: H01G4/228

    摘要: A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m≧3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.

    摘要翻译: 一种多层片状电容器包括:电容器主体; 多个第一和第二内部电极; 和m(m≥3)个数的第一和第二外部电极。 多个第一和第二内部电极与位于两个相对表面上并且具有与第一和第二内部电极相同的极性的两个外部电极连接,并且根据连接的外部电极的位置被分成多个组 到第一和第二内部电极。 与每组的内部电极连接的两个外部电极中的至少一个不同于与具有相同极性的不同组的内部电极连接的外部电极,并且一组的内部电极连接到与至少另一个连接的外部电极 使得属于相同极性的所有内部电极可以电连接。

    MULTILAYER CHIP CAPACITOR
    4.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20090225492A1

    公开(公告)日:2009-09-10

    申请号:US12248476

    申请日:2008-10-09

    IPC分类号: H01G4/005

    CPC分类号: H01G4/012 H01G4/232 H01G4/30

    摘要: A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.

    摘要翻译: 多层片状电容器包括电容器主体,其包括多个电介质层的叠层,并且具有第一和第二侧面以及第一和第二端面,多个相反极性的外部电极在第一和第二侧面中的每一个上交替, 以及多个内部电极,每个内部电极包括延伸到电容器主体的外表面并分别连接到外部电极的一个或两个引线。 在堆叠方向上彼此相邻的内部电极的引线之间的水平距离比在电容器主体的同一侧面上彼此相邻的外部电极之间的间距长。

    MULTILAYER CHIP CAPACITOR
    5.
    发明申请
    MULTILAYER CHIP CAPACITOR 有权
    多层芯片电容器

    公开(公告)号:US20090213525A1

    公开(公告)日:2009-08-27

    申请号:US12245865

    申请日:2008-10-06

    IPC分类号: H01G4/005

    CPC分类号: H01G4/005 H01G4/30

    摘要: A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.

    摘要翻译: 一种多层片状电容器包括:电容器主体,包括彼此面对的第一和第二较长侧表面;以及彼此面对的第一和第二短边表面,分别设置在第一和第二长边侧表面的第一和第二外部电极, 每个电极对包括第一和第二内部电极,以及一个或多个第二内部电极对,每个包括第三和第四内部电极。 第一至第四内部电极各自具有一个引线并且沿堆叠方向依次布置。 第一至第四内部电极具有分别延伸到第一至第四角部或与其相邻的部分的第一至第四引线,并且与第一和第二外部电极交替连接。 第一内部电极对和第二内部电极对使得电流相对于长边方向在相反的方向上斜向流动。

    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE INCLUDING THE SAME
    6.
    发明申请
    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE INCLUDING THE SAME 有权
    多层芯片电容器和电路板装置,包括它们

    公开(公告)号:US20090139757A1

    公开(公告)日:2009-06-04

    申请号:US12195015

    申请日:2008-08-20

    IPC分类号: H01G4/005 H05K1/18

    摘要: A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, the first and third outer electrodes having the same polarity and the second and fourth outer electrodes having the same polarity opposite to that of the first outer electrode; and one or more connection conductor lines formed on an outer surface of the capacitor body and connecting the first outer electrode to the third outer electrode or connecting the second outer electrode to the fourth outer electrode.

    摘要翻译: 一种多层片状电容器,包括:层叠有多个电介质层的叠层结构的电容器体,具有根据层叠方向配置的第一电容器部和第二电容器部; 形成在电容器主体的侧面的第一至第四外部电极,第一和第三外部电极具有相同的极性,第二和第四外部电极具有与第一外部电极的极性相反的极性; 以及一个或多个连接导线,形成在电容器主体的外表面上,并将第一外电极连接到第三外电极或将第二外电极连接到第四外电极。

    MULTILAYERED CHIP CAPACITOR AND CAPACITANCE TUNNING METHOD OF THE SAME
    7.
    发明申请
    MULTILAYERED CHIP CAPACITOR AND CAPACITANCE TUNNING METHOD OF THE SAME 失效
    多层芯片电容器及其电容调谐方法

    公开(公告)号:US20090086405A1

    公开(公告)日:2009-04-02

    申请号:US12238688

    申请日:2008-09-26

    IPC分类号: H01G4/228

    摘要: There is provided a multilayer chip capacitor capable of tuning capacitance, including: a capacitor body where a plurality of dielectric layers are laminated; a plurality of pairs of first and second internal electrodes arranged alternately, while interposing a corresponding one of the dielectric layers; and a plurality of pairs of first and second external electrodes connected to the first and second internal electrodes, wherein the first and second internal electrodes include a plurality of groups each including at least one pair of the first and second internal electrodes, and the first and second internal electrodes of each of the groups are connected to different pairs of the first and second external electrodes, respectively, wherein a corresponding one of the pairs of the first and second external electrodes is selectively connected to power lines so that the multilayer chip capacitor has at least two different capacitances.

    摘要翻译: 提供一种能够调谐电容的多层片状电容器,包括:电容器体,层叠多个电介质层; 多个成对的第一和第二内部电极交替布置,同时插入相应的一个电介质层; 以及连接到所述第一和第二内部电极的多对第一和第二外部电极,其中所述第一和第二内部电极包括多个组,每个组包括至少一对所述第一和第二内部电极,以及所述第一和第二内部电极 每个组的第二内部电极分别连接到第一和第二外部电极的不同对,其中第一和第二外部电极对中的相应一个选择性地连接到电力线,使得多层片状电容器具有 至少两个不同的电容。

    CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE
    8.
    发明申请
    CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE 有权
    电路板设备和集成电路设备

    公开(公告)号:US20100149769A1

    公开(公告)日:2010-06-17

    申请号:US12421953

    申请日:2009-04-10

    IPC分类号: H05K1/18

    摘要: A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

    摘要翻译: 一种电路板装置,包括:电路板,包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器(MLCC),其包括电容器本体,多个第一和第二极性 内电极,第一外电极和第二外电极以及第三外电极,其中第一和第二电源线分别设置在安装区域上,连接到第一外电极和第二外电极,并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

    LAMINATED INDUCTOR
    9.
    发明申请
    LAMINATED INDUCTOR 有权
    层压电感器

    公开(公告)号:US20090051474A1

    公开(公告)日:2009-02-26

    申请号:US12194935

    申请日:2008-08-20

    IPC分类号: H01F27/02

    摘要: There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.

    摘要翻译: 提供一种层叠电感器,包括:层叠有多个磁性层的主体; 形成在所述磁性层上的线圈部分,所述线圈部分包括多个导体图案和多个导电通孔; 第一外部电极和第二外部电极分别形成在主体的外表面上以连接到线圈部分的两端; 以及形成在至少一个磁性层上的非磁性导体,以便缓和由直流电流流过线圈部分的磁饱和。 层叠电感器在制造工艺中使用非磁性导体作为非磁性间隙进行简化,并有效地改善了DC叠加特性。

    ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT
    10.
    发明申请
    ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT 有权
    用于安装电子部件的电极板和用于安装电子部件的结构

    公开(公告)号:US20100032193A1

    公开(公告)日:2010-02-11

    申请号:US12425068

    申请日:2009-04-16

    IPC分类号: H05K1/16 H05K1/11

    摘要: Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.

    摘要翻译: 提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。 电极焊盘包括彼此面对的第一和第二电极部分,以及彼此面对的第三和第四电极部分。 第三和第四电极部分与第一和第二电极部分相邻设置,用于与第一和第二电极部分一起形成电极焊盘的拐角。 第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。 因此,当电极焊盘用于安装电子部件时,能够充分地增加电子部件的外部电极的宽度,能够容易地调整外部电极的形状或尺寸。