公开(公告)号：US20160042928A1

公开(公告)日：2016-02-11

申请号：US14921883

申请日：2015-10-23

Applicant: CANON ANELVA CORPORATION

Inventor： Satoshi YAMADA ,  Ryuji HIGASHISAKA

IPC: H01J37/34

CPC classification number: H01J37/347 ,  C23C14/35 ,  C23C14/568 ,  H01J37/3405 ,  H01J37/3411 ,  H01J37/3435 ,  H01J37/3455 ,  H01J37/3476 ,  H01J2237/20235 ,  H01J2237/24564 ,  H01J2237/24578 ,  H01J2237/3323

Abstract: A sputtering apparatus includes a vacuum chamber, a substrate holder, a target support member, a cathode magnet arranged on a side of the target support member, which is opposite to a side of a substrate held by the substrate holder, a magnet moving unit configured to adjust a distance between the cathode magnet and the target support member, a target moving unit configured to adjust a distance between the target support member and the substrate, and a control unit configured to control the target moving unit and the magnet moving unit.

Abstract translation: 溅射装置包括：真空室，基板保持架，目标支撑部件，配置在目标支撑部件侧的与由基板支架保持的基板侧相对的阴极;磁体移动部， 调整阴极磁体和目标支撑部件之间的距离，被配置为调整目标支撑部件和基板之间的距离的目标移动部件，以及被配置为控制目标移动部件和磁体移动部件的控制部。

公开(公告)号：US20150235822A1

公开(公告)日：2015-08-20

申请号：US14597523

申请日：2015-01-15

Applicant: CANON ANELVA CORPORATION

Inventor： Yoshihiro MUTO ,  Ryuji HIGASHISAKA ,  Satoshi YAMADA

IPC: H01J37/34

CPC classification number: H01J37/3441 ,  B05C13/02 ,  C23C14/042 ,  C23C14/34 ,  C23C14/564 ,  C23C14/568 ,  C23C16/54 ,  H01J37/32651 ,  H01J37/3447

Abstract: The present invention provides a processing apparatus including a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate, a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate, and a moving device configured to move the first shield and the second shield to set one of a close state in which the first shield and the second shield are close to each other and a separate state in which the first shield and the second shield are separate from each other.

Abstract translation: 本发明提供了一种处理装置，其包括：供给源，包括第一供应源和第二供应源，所述第一供应源和第二供应源分别面对基板的第一表面和与所述第一表面相反的一侧上的第二表面，并且被配置为将材料供应到 将过程应用于基板，屏蔽构件，其包括围绕第一电源提供的第一屏蔽件和围绕第二电源设置的第二屏蔽件，第一屏蔽件和第二屏蔽件布置成夹持基板;以及移动装置配置 移动第一屏蔽和第二屏蔽以设置第一屏蔽和第二屏蔽彼此靠近的闭合状态和第一屏蔽和第二屏蔽彼此分开的分离状态之一。

公开(公告)号：US20140183394A1

公开(公告)日：2014-07-03

申请号：US14080329

申请日：2013-11-14

Applicant: CANON ANELVA CORPORATION

Inventor： Satoshi YAMADA ,  Ryuji Higashisaka

IPC: F16K1/16

CPC classification number: F16K3/0254 ,  F16K3/04 ,  F16K3/316 ,  F16K51/02

Abstract: A conductance valve is configured to be able to adjust the conductance by adjusting the opening degree of an opening formed in part of the wall surface a vacuum vessel. The conductance valve includes a swing arm which is pivotally coupled to a driving portion, and a rectangular valve body which is coupled to the swing arm and is pivotal with respect to it. When the swing arm pivots, the rectangular valve body is pivoted by a predetermined angle. The overhang of the valve body at the closed position of the conductance valve can be reduced.

Abstract translation: 电导阀被配置为能够通过调节形成在壁表面的一部分真空容器中的开口的开度来调节电导。 电导阀包括枢转地联接到驱动部分的摆臂和耦合到摆臂并且相对于其枢转的矩形阀体。 当摆臂枢转时，矩形阀体枢转预定角度。 可以减小阀体在电导阀关闭位置处的悬垂。