Multilayer wiring substrate
    4.
    发明授权

    公开(公告)号:US10237973B2

    公开(公告)日:2019-03-19

    申请号:US15944626

    申请日:2018-04-03

    Inventor: Takashi Tokoro

    Abstract: Signal transmission characteristics in a case where a conductive pin is inserted into a through hole to perform connection with an external circuit are improved. A multilayer wiring substrate includes a front layer and a rear layer, and includes a plurality of layers in an inner layer. A conductive portion is provided in each of the layers, and a wiring is disposed on the rear layer. The conductive pin for connection with the external circuit is inserted into the through hole. A land is disposed around the through hole on the rear layer, and the land and the conductive pin are connected to each other through solder.

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