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    SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TEST
    1.
    发明申请
    SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TEST 审中-公开
    用于测试装置的旋转对准的系统和方法

    公开(公告)号：US20140184003A1

    公开(公告)日：2014-07-03

    申请号：US14141749

    申请日：2013-12-27

    Applicant: CASCADE MICROTECH, INC.

    Inventor： Jorg Kiesewetter ,  Karsten Stoll

    IPC: H02K7/08 ,  G01R1/067

    CPC classification number: G01R1/067 ,  G01R31/2887

    Abstract: Systems and methods for rotational alignment of a device under test are disclosed herein. These systems include a chuck that includes a rotational positioning assembly that includes a lower section and an upper section that is configured to selectively rotate relative to the lower section about a rotational axis. The rotational positioning assembly further includes a first bearing that is configured to support a radial load between the upper section and the lower section and a second bearing that is configured to support a thrust load between the upper section and the lower section. The methods include providing a fluid stream to the second bearing to permit rotation of the upper section relative to the lower section, rotating the upper section relative to the lower section, and ceasing the providing the fluid stream to the second bearing to restrict rotation of the upper section relative to the lower section.

    Abstract translation: 本文公开了用于被测设备的旋转对准的系统和方法。 这些系统包括卡盘，其包括旋转定位组件，该旋转定位组件包括下部部分和被配置为围绕旋转轴线相对于下部部分选择性地旋转的上部部件。 旋转定位组件还包括第一轴承，其构造成支撑在上部段和下部分之间的径向载荷;以及第二轴承，其构造成支撑上部和下部之间的推力载荷。 所述方法包括向第二轴承提供流体流以允许上部相对于下部旋转，使上部相对于下部旋转，并停止向第二轴承提供流体流以限制第二轴承的旋转 上部相对于下部。

    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS
    2.
    发明申请
    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS 审中-公开

    公开(公告)号：US20180031608A1

    公开(公告)日：2018-02-01

    申请号：US15725650

    申请日：2017-10-05

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R1/18 ,  G01R1/44 ,  G01R1/067

    CPC classification number: G01R1/18 ,  G01N27/42 ,  G01N31/02 ,  G01R1/06711 ,  G01R1/07378 ,  G01R1/07392 ,  G01R1/44

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS
    3.
    发明申请
    SHIELDED PROBE SYSTEMS WITH CONTROLLED TESTING ENVIRONMENTS 有权

    公开(公告)号：US20170292974A1

    公开(公告)日：2017-10-12

    申请号：US15094716

    申请日：2016-04-08

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R1/18 ,  G01R1/44 ,  G01R1/067

    CPC classification number: G01R1/18 ,  G01N27/42 ,  G01N31/02 ,  G01R1/06711 ,  G01R1/07378 ,  G01R1/07392 ,  G01R1/44

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.

    Shielded probe systems with controlled testing environments
    5.
    发明授权
    Shielded probe systems with controlled testing environments 有权

    公开(公告)号：US10281492B2

    公开(公告)日：2019-05-07

    申请号：US15725650

    申请日：2017-10-05

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R31/10 ,  G01R1/18 ,  G01R1/067 ,  G01R1/44 ,  G01R1/073 ,  G01N27/42 ,  G01N31/02

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER
    7.
    发明申请
    METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER 有权
    在定义的热条件和热调节探头下测试测试基板的方法

    公开(公告)号：US20140028337A1

    公开(公告)日：2014-01-30

    申请号：US13953545

    申请日：2013-07-29

    Applicant: Cascade Microtech, Inc.

    Inventor： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

    IPC: G01R31/28

    CPC classification number: G01R31/2891 ,  G01R31/2874

    Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

    Abstract translation: 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。

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