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公开(公告)号：US20170367183A1
公开(公告)日：2017-12-21
申请号：US15404213
申请日：2017-01-12
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Wen Tsung LI , Kai Chieh HSIEH , I Hsing WENG
CPC classification number: H05K1/162 , H05K1/115 , H05K3/421 , H05K2201/09509
Abstract: A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor.
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公开(公告)号：US20180059140A1
公开(公告)日：2018-03-01
申请号：US15435309
申请日：2017-02-17
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Wen Tsung LI , Kai Chieh HSIEH
CPC classification number: G01R1/07371 , G01N1/00 , G01R1/00 , G01R1/0416 , G01R1/06716 , G01R1/06755 , G01R1/07357 , H01L2221/00
Abstract: A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.
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公开(公告)号：US20180017593A1
公开(公告)日：2018-01-18
申请号：US15427083
申请日：2017-02-08
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Wen Tsung LI , Kai Chieh HSIEH , Chih-Peng HSIEH
CPC classification number: G01R1/06722 , G01R31/2886
Abstract: A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.
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公开(公告)号：US20170315152A1
公开(公告)日：2017-11-02
申请号：US15393327
申请日：2016-12-29
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Cheng-Juei LIN , Wen Tsung LI , Yuan - Chiang TENG , Kai Chieh HSIEH
CPC classification number: G01R1/07378 , G01R1/0491
Abstract: A stack type test interface board assembly is provided herein, which comprises: a space transform board having a narrow pitch transform board and a wide pitch transform board, a plurality of first connection nodes disposed on a side of the narrow pitch transform board to be electrically connected to a finished or semi-finished semiconductor product, a plurality of second connection nodes disposed on a side of the wide pitch transform board, and a printed circuit board where a side thereof is electrically connected to the plurality of the second connection nodes. The narrow pitch transform board and the wide pitch transform board are assembled in perpendicular stack into the space transform board. A pitch between each two of the plurality of the first connection nodes is smaller than a pitch between each two of the plurality of the second connection nodes.
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