公开(公告)号：US20180331155A1

公开(公告)日：2018-11-15

申请号：US15968863

申请日：2018-05-02

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Patrick LEDUC ,  Sebastien CORTIAL ,  Stephane POCAS ,  Jean-Jacques YON

IPC分类号： H01L27/16 ,  H01L37/02 ,  G01J5/12

摘要： A method for producing a bolometric detector comprising: producing a stack, on an interconnect level of a read-out circuit, comprising a sacrificial layer positioned between a carrier layer and an etch stop layer, the sacrificial layer comprising a mineral material; producing a conducting via passing through the stack such that it is in contact with a conducting portion of said interconnect level; depositing a conducting layer onto the carrier layer and the via; etching the conducting layer and the carrier layer, forming a bolometer membrane electrically connected to the via by a remaining portion of the conducting layer that covers an upper part of the via; elimination of the sacrificial layer by selective chemical etching, and such that the membrane is suspended by the via.

公开(公告)号：US20240213148A1

公开(公告)日：2024-06-27

申请号：US18545750

申请日：2023-12-19

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Sébastien BECKER ,  Patrick LEDUC ,  Thomas PERRILLAT-BOTTONET

IPC分类号： H01L23/522 ,  H01L21/84 ,  H01L23/00 ,  H01L25/065 ,  H01L27/12

CPC分类号： H01L23/5226 ,  H01L21/84 ,  H01L24/05 ,  H01L24/08 ,  H01L25/0657 ,  H01L27/12 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/08145

摘要： The invention relates to a device for detecting an electromagnetic radiation, comprising at least one sensitive pixel including a thermal detector (10), and including a readout substrate (20) formed of a stack of a readout structure (23) and an interconnection structure (22). The thermal detector includes a suspended absorbing membrane (11), and anchor pillars (13). The readout structure (23) is located over and in contact with the interconnection structure (22); the first active electronic element (23.1a) is directly connected to the upper metallization level; and the anchor pillars (13) continuously extend in the readout substrate (20) until coming into contact with the upper metallization level.

公开(公告)号：US20180218997A1

公开(公告)日：2018-08-02

申请号：US15746041

申请日：2016-07-26

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Frank FOURNEL ,  Xavier BAILLIN ,  Séverine CHERAMY ,  Patrick LEDUC ,  Loic SANCHEZ

IPC分类号： H01L23/00

CPC分类号： H01L24/80 ,  H01L24/03 ,  H01L24/05 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0381 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/05686 ,  H01L2224/08148 ,  H01L2224/08238 ,  H01L2224/80004 ,  H01L2224/80013 ,  H01L2224/80143 ,  H01L2224/80205 ,  H01L2224/80894 ,  H01L2224/80896 ,  H01L2224/80948 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/05442

摘要： A method for direct bonding an electronic chip onto a substrate or another electronic chip, the method including: carrying out a hydrophilic treatment of a portion of, a surface of the electronic chip and of a portion of a surface of the substrate or of the other electronic chip; depositing an aqueous fluid on the portion of the surface of the substrate or of the second electronic chip; depositing the portion of the surface of the electronic chip on the aqueous fluid; drying the aqueous fluid until the portion of the surface of the electronic chip is rigidly connected to the portion of the surface of the substrate or of the other electronic chip: and during at least part of the drying of the aqueous fluid, emitting ultrasound into the aqueous fluid through the substrate or the other electronic chip.

公开(公告)号：US20170098638A1

公开(公告)日：2017-04-06

申请号：US15283683

申请日：2016-10-03

申请人： Commissariat A L'Energie Atomique et aux Energies Alternatives

发明人： Aurelie THUAIRE ,  Patrick REYNAUD ,  Patrick LEDUC ,  Emmanuel ROLLAND

IPC分类号： H01L25/00 ,  H01L27/28 ,  H01L23/498 ,  H01L25/11 ,  H01L23/538

CPC分类号： H01L25/50 ,  B81B7/007 ,  B81B2207/07 ,  H01L23/49844 ,  H01L23/5389 ,  H01L25/115 ,  H01L27/286 ,  H01L29/0665 ,  H01L51/0098

摘要： Production of a device for connecting a nano-object to an external electrical system (SEE) including: a first chip provided with conducting areas (8a, 8b) and a first nano-object (50) connected to the conducting areas, the first chip being assembled on a support (70) such that the first nano-object is arranged facing an upper face of the support, the device being further provided with first connection elements (80a, 80b) capable of being connected to the external electrical system and arranged on and in contact with the first conducting areas (8a, 8b), the first connection elements being formed on the side of the upper face of the support (70) and being accessible from the side of the upper face of the support.