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公开(公告)号：US20210108077A1
公开(公告)日：2021-04-15
申请号：US17068272
申请日：2020-10-12
Applicant: Corning Incorporated
Inventor： Tara Marie Berleue , Charles Brandenburg , Justin Bernard Bult , Matthew John Dejneka , Sushmit Sunil Kumar Goyal , Timothy Michael Gross , Yungfeng Gu , Yuhui Jin , Jenny Kim , Xinghua Li , Jian Luo , Kevin Robert McCarthy , Weijun Niu , Terri Lee Sines-Melock , Michael Lesley Sorensen , Jonathan Earl Walter , Arline Lee Weikel , Lei Yuan
Abstract: Polymer-based portions comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the polymer-based portion comprises the product of curing 45-75 wt % of a difunctional urethane-acrylate oligomer with 25-55 wt % of a difunctional cross-linking agent and optionally a reactive diluent. In some embodiments, the polymer-based portion comprises the product of curing 75-100 wt % of a reactive diluent and optionally one or more a difunctional urethane-acrylate oligomer and/or a difunctional cross-linking agent. Adhesives comprise an index of refraction ranging from about 1.49 to about 1.55. In some embodiments, the adhesive comprises the product of heating 10-35 wt % of a silane-hydride-terminated siloxane and 65-90 wt % of a vinyl-terminated siloxane. In some embodiments, the adhesive comprises the product of irradiating a thiol-containing siloxane and a photo-initiator with at least one wavelength of light that the photo-initiator is sensitive to. Foldable apparatus can comprise the polymer-based portion and/or adhesive.
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公开(公告)号：US20180297889A1
公开(公告)日：2018-10-18
申请号：US15765406
申请日：2016-09-29
Applicant: Corning Incorporated
Inventor： James Patrick Hamilton , Jenny Kim , James Robert Matthews , Kouta Nakamura , Louis Joseph Stempin, Jr. , Wanda Janina Walczak
Abstract: Disclosed herein are methods for treating a glass substrate, comprising bringing a surface of the glass substrate into contact with at least one surface treatment agent for a time sufficient to form a coating comprising the at least one surface treatment agent on at least a portion of the surface. Also disclosed herein are glass substrates comprising at least one surface and a coating on at least a portion of the surface, wherein the coated portion of the surface has a contact angle ranging from about 20 degrees to about 95 degrees, and/or a contact angle greater than about 20 degrees after contact with water, and/or a contact angle less than about 10 degrees after wet or dry cleaning of the glass substrate.
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公开(公告)号：US20240367420A1
公开(公告)日：2024-11-07
申请号：US18290835
申请日：2022-07-11
Applicant: Corning Incorporated
Inventor： Kiyomi DeLige Fahy , Jenny Kim , Lingke Li , Yang Li , Kevin Robert McCarthy , Hongxiang Wang , Arlin Lee Weikel
Abstract: Laminates can comprise a substrate and a film. The film can comprise a film thickness from about 5 micrometers to about 400 micrometers and a tri-block copolymer comprising a first block positioned between two second blocks. The first block can be grafted with a first functional group. The first block can comprise a first glass transition temperature of about 0° C. or less. The two second blocks can each comprise a glass transition temperature of about 50° C. or more. A combined weight of the two second blocks can be from about 10 wt % to about 50 wt % of the tri-block copolymer. The film can comprise a refractive index from about 1.48 to about 1.55. Methods of forming a laminate can comprise disposing a film over a substrate. Methods can further comprise heating the film and the substrate to a first temperature and then a second temperature.
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公开(公告)号：US11407681B2
公开(公告)日：2022-08-09
申请号：US16498908
申请日：2018-03-23
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Shandon Dee Hart , Jenny Kim , Karl William Koch, III , James Joseph Price , Hannah Shenouda
Abstract: An article that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.
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公开(公告)号：US20210384433A1
公开(公告)日：2021-12-09
申请号：US17283359
申请日：2019-10-07
Applicant: Corning Incorporated
Inventor： Mingqian He , Jenny Kim , Xin Li , Yang Li , Hongxiang Wang
Abstract: A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.
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Patent Agency Ranking
公开(公告)号：US20210341838A1
公开(公告)日：2021-11-04
申请号：US17283418
申请日：2019-10-09
Applicant: Corning Incorporated
Inventor： Huayun Deng , Mingqian He , Jenny Kim , Xin Li , Yang Li , Weijun Niu , Arthur Lawrence Wallace , Hongxiang Wang
Abstract: A polymer blend includes at least one organic semiconductor (OSC) polymer, at least one crosslinker, and at least one photoinitiator, such that the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene being beta-substituted, and such that the crosslinker includes at least one of: acrylates, epoxides, oxetanes, alkenes, alkynes, azides, thiols, allyloxysilanes, phenols, anhydrides, amines, cyanate esters, isocyanate esters, silyl hydrides, cinnamates, coumarins, fluorosulfates, silyl ethers, or a combination thereof.
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公开(公告)号：US12048236B2
公开(公告)日：2024-07-23
申请号：US17283359
申请日：2019-10-07
Applicant: Corning Incorporated
Inventor： Mingqian He , Jenny Kim , Xin Li , Yang Li , Hongxiang Wang
CPC classification number: H10K85/113 , C08L53/02 , G03F7/038 , H10K85/111 , G03F7/2002 , G03F7/30 , H10K10/466 , H10K71/15
Abstract: A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.
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公开(公告)号：US11981598B2
公开(公告)日：2024-05-14
申请号：US17859110
申请日：2022-07-07
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Shandon Dee Hart , Jenny Kim , Karl William Koch, III , James Joseph Price , Hannah Shenouda
CPC classification number: C03C17/42 , C03C17/009 , C03C21/002 , C03C2217/734 , C03C2217/78 , C03C2217/948
Abstract: An article is described herein that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.
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公开(公告)号：US20240099307A1
公开(公告)日：2024-03-28
申请号：US18275739
申请日：2022-02-04
Applicant: CORNING INCORPORATED
Inventor： Bavani Balakrisnan , Charles Brandenburg , Douglas Edmon Goforth , Cassandra Ann Haynes , Insik Jeon , Jenny Kim , Joydeep Lahiri , Jin Liu , Kevin Robert McCarthy , Michael Lesley Sorensen
IPC: A01N59/20 , A01N25/10 , A01P1/00 , C09D5/14 , C09D175/04 , C09D183/04
CPC classification number: A01N59/20 , A01N25/10 , A01P1/00 , C09D5/14 , C09D175/04 , C09D183/04
Abstract: A method for making an antimicrobial composite film can include forming a first coating layer by applying a first coating material on a substrate and forming a second coating layer by applying a second coating material on the first coating layer. The first coating material can comprise a first resin. The second coating material can comprise an antimicrobial material in a second resin or a dispersion. The first coating material can have a lower concentration of the antimicrobial material than the second coating material. The first and second coating layers can cooperatively define a composite film. The antimicrobial material can be asymmetrically dispersed in the composite film such that the antimicrobial material is concentrated closer to the outer surface of the composite film than to the inner surface of the composite film.
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公开(公告)号：US20220340483A1
公开(公告)日：2022-10-27
申请号：US17859110
申请日：2022-07-07
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Shandon Dee Hart , Jenny Kim , Karl William Koch, III , James Joseph Price , Hannah Shenouda
Abstract: An article is described herein that includes: a glass-based substrate comprising opposing major surfaces; a crack mitigating composite over one of the major surfaces, the composite comprising an inorganic element and a polymeric element; and a hard film disposed on the crack mitigating composite comprising an elastic modulus greater than or equal to the elastic modulus of the glass-based substrate. The crack mitigating composite is characterized by an elastic modulus of greater than 30 GPa. Further, the hard film comprises at least one of a metal-containing oxide, a metal-containing oxynitride, a metal-containing nitride, a metal-containing carbide, a silicon-containing polymer, a carbon, a semiconductor, and combinations thereof.
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