DISSIPATING HEAT FROM ELECTRONIC DEVICES
    1.
    发明申请
    DISSIPATING HEAT FROM ELECTRONIC DEVICES 审中-公开
    从电子设备散热

    公开(公告)号:US20160322781A1

    公开(公告)日:2016-11-03

    申请号:US15207684

    申请日:2016-07-12

    IPC分类号: H01S5/024 H05K7/20

    摘要: An electronic apparatus includes first and second electronic devices, and first and second heat sinks for dissipating heat, wherein there is each of electrical conductivity between the first electronic device and the first heat sink, thermal conductivity between the first electronic device and the first heat sink, electrical conductivity between the second electronic device and the second heat sink, and thermal conductivity between the second electronic device and the second heat sink, wherein electrical conductivity is provided between the first and second heat sinks, and wherein thermal resistance is provided between the first and second heat sinks, so that the second heat sink remains cooler than the first heat, such as for protecting the second electrical device from the heat generated by the first electronic device.

    摘要翻译: 电子设备包括第一和第二电子设备以及用于散热的第一和第二散热器,其中在第一电子设备和第一散热器之间存在导电性,第一电子设备和第一散热器之间的导热性 ,第二电子器件和第二散热器之间的导电性以及第二电子器件和第二散热器之间的导热性,其中在第一和第二散热器之间提供导电性,并且其中在第一和第二散热片之间提供热阻 和第二散热器,使得第二散热片比第一热量保持冷却,例如用于保护第二电气设备免受第一电子设备产生的热量的影响。

    FAN MODULE
    7.
    发明申请
    FAN MODULE 审中-公开
    风扇模块

    公开(公告)号:US20170002835A1

    公开(公告)日:2017-01-05

    申请号:US15177627

    申请日:2016-06-09

    CPC分类号: F04D29/601 F04D25/166

    摘要: A fan module is removable from an electronic component by opening a hinged door of the component and removing the fan module from the door. The fan module is removably received within a slot or recess in the door, and is installed or de-installed in a direction non-coincident with the pivotal motion of the door. Removal of the fan module prior to pivotal movement of the door is prevented with a screw mechanism and/or an interlock tab associated with a retractable handle provided in a recess along a top surface of the fan module.

    摘要翻译: 通过打开组件的铰接门并从门去除风扇模块,风扇模块可从电子部件移除。 风扇模块可移除地容纳在门内的槽或凹槽中,并且在与门的枢转运动不一致的方向上安装或拆卸。 在通过沿着风扇模块的顶表面设置在凹槽中的螺旋机构和/或与可伸缩手柄相关联的螺钉机构和/或互锁突片来防止在门的枢转运动之前移除风扇模块。