LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES
    3.
    发明申请
    LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES 有权
    具有弯曲和平面表面的包装的LED包装

    公开(公告)号:US20140027795A1

    公开(公告)日:2014-01-30

    申请号:US13957290

    申请日:2013-08-01

    Applicant: CREE, INC.

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile.

    Abstract translation: 公开了紧凑且有效地发光的LED封装,并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座,并且在具有多个LED的基座中,每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上,至少一些LED上,其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 密封剂还可以具有具有相对较大曲率半径的上曲面,弯曲和平面表面的组合导致具有相对窄的发射轮廓的光的有效发射。

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