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    COMPACT LED PACKAGE WITH REFLECTIVITY LAYER
    5.
    发明申请
    COMPACT LED PACKAGE WITH REFLECTIVITY LAYER 有权
    具有反射层的紧凑型LED封装

    公开(公告)号：US20140291715A1

    公开(公告)日：2014-10-02

    申请号：US14183218

    申请日：2014-02-18

    Applicant: CREE, INC.

    Inventor： JESSE REIHERZER ,  Jeremy Nevins ,  Michael John Bergmann ,  Joseph Gates Clark

    IPC: H01L33/60 ,  H01L33/54

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座，并且在具有多个LED的基座中，每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上，至少一些LED上，其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 封装还可以包括反射层，以最小化由光吸收引起的损耗，这进而可以增加整个封装的发射效率。

    Compact LED package with reflectivity layer
    6.
    发明授权
    Compact LED package with reflectivity layer 有权

    公开(公告)号：US10424702B2

    公开(公告)日：2019-09-24

    申请号：US14183218

    申请日：2014-02-18

    Applicant: CREE, INC.

    Inventor： Jesse Reiherzer ,  Jeremy Nevins ,  Michael John Bergmann ,  Joseph Gates Clark

    IPC: H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L23/00

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

    LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES
    8.
    发明申请
    LED PACKAGE WITH ENCAPSULANT HAVING CURVED AND PLANAR SURFACES 有权
    具有弯曲和平面表面的包装的LED包装

    公开(公告)号：US20140027795A1

    公开(公告)日：2014-01-30

    申请号：US13957290

    申请日：2013-08-01

    Applicant: CREE, INC.

    Inventor： Jesse Reiherzer ,  Andrew Signor ,  Joseph Gates Clark ,  Michael John Bergmann

    IPC: H01L33/50 ,  H01L33/58

    CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/508 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座，并且在具有多个LED的基座中，每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上，至少一些LED上，其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 密封剂还可以具有具有相对较大曲率半径的上曲面，弯曲和平面表面的组合导致具有相对窄的发射轮廓的光的有效发射。

    NON-MAGNIFIED LED FOR HIGH CENTER-BEAM CANDLE POWER
    10.
    发明申请
    NON-MAGNIFIED LED FOR HIGH CENTER-BEAM CANDLE POWER 审中-公开
    用于高中心光束焦距功率的非放大LED

    公开(公告)号：US20160254423A1

    公开(公告)日：2016-09-01

    申请号：US14633734

    申请日：2015-02-27

    Applicant: CREE, INC.

    Inventor： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

    IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

    CPC classification number: H01L33/54 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size. Different embodiments of the present invention can comprise different configurations of emitters within the component, such as monolithic chips. The LEDs can be wire bonded to a surface. This surface can be black, reflective or include a reflective coating. In some embodiments, conversion materials can be applied conformal to the LED.

    Abstract translation: 公开了使用薄的，基本上平坦的或未掺杂的密封剂的发光二极管组件，以便实现所需的发射分布，以增加亮度和/或中心光束烛光功率。 装置的一些实施例包括密封剂，其产生不超过2×源尺寸的明显源图像。 本发明的不同实施例可以包括组件内的发射器的不同配置，例如单片芯片。 LED可以引线键合到表面。 该表面可以是黑色的，反射的或包括反射涂层。 在一些实施例中，转换材料可以适用于LED。

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