公开(公告)号：US20160107289A1

公开(公告)日：2016-04-21

申请号：US14919404

申请日：2015-10-21

Applicant: Cabot Microelectronics Corporation

Inventor： Mary Cavanaugh ,  Steven Kraft ,  Andrew Wolff ,  Phillip W. Carter ,  Elise Sikma ,  Jeffrey Cross

IPC: B24B37/24 ,  C23F11/00 ,  C23F1/14 ,  C09G1/02

CPC classification number: B24B37/24 ,  C09D5/08 ,  C09G1/02 ,  C23F3/04 ,  C23F3/06 ,  C23F11/10 ,  H01L21/3212

Abstract: The invention provides methods of inhibiting corrosion of a substrate containing metal. The substrate can be in any suitable form. In some embodiments, the metal is cobalt. The methods can be used with semiconductor wafers in some embodiments. The invention also provides chemical-mechanical polishing compositions and methods of polishing a substrate. A corrosion inhibitor can be used in the methods and compositions disclosed herein. The inhibitor comprises an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, an amino acid derivative, a phosphate ester, an isethionate, a sulfate, a sulfosuccinate, a sulfocinnimate, or any combination thereof.

Abstract translation: 本发明提供了抑制含金属基材腐蚀的方法。 底物可以是任何合适的形式。 在一些实施方案中，金属是钴。 在一些实施例中，该方法可以与半导体晶片一起使用。 本发明还提供化学机械抛光组合物和抛光基材的方法。 腐蚀抑制剂可用于本文公开的方法和组合物中。 抑制剂包括两性表面活性剂，磺酸盐，膦酸盐，羧酸盐，氨基酸衍生物，磷酸酯，羟乙基磺酸盐，硫酸盐，磺基琥珀酸盐，sulfocinnimate或其任何组合。

公开(公告)号：US10124464B2

公开(公告)日：2018-11-13

申请号：US14919404

申请日：2015-10-21

Applicant: Cabot Microelectronics Corporation

Inventor： Mary Cavanaugh ,  Steven Kraft ,  Andrew Wolff ,  Phillip W. Carter ,  Elise Sikma ,  Jeffrey Cross ,  Benjamin Petro

IPC: H01L21/321 ,  B24B37/24 ,  C09G1/02 ,  C09D5/08 ,  C23F3/04 ,  C23F3/06 ,  C23F11/10

Abstract: The invention provides methods of inhibiting corrosion of a substrate containing metal. The substrate can be in any suitable form. In some embodiments, the metal is cobalt. The methods can be used with semiconductor wafers in some embodiments. The invention also provides chemical-mechanical polishing compositions and methods of polishing a substrate. A corrosion inhibitor can be used in the methods and compositions disclosed herein. The inhibitor comprises an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, an amino acid derivative, a phosphate ester, an isethionate, a sulfate, a sulfosuccinate, a sulfocinnimate, or any combination thereof.

公开(公告)号：US09944828B2

公开(公告)日：2018-04-17

申请号：US14919526

申请日：2015-10-21

Applicant: Cabot Microelectronics Corporation

Inventor： Elise Sikma ,  Witold Paw ,  Benjamin Petro ,  Jeffrey Cross ,  Glenn Whitener

IPC: H01L21/302 ,  H01L21/461 ,  C09G1/02 ,  B24B37/04 ,  C23F3/04 ,  C23F3/06 ,  H01L21/321

CPC classification number: C09G1/02 ,  B24B37/044 ,  C23F3/04 ,  C23F3/06 ,  H01L21/3212

Abstract: The invention provides a chemical-mechanical polishing composition including (a) an abrasive comprising alumina particles, silica particles, or a combination thereof, (b) a rate accelerator comprising a phosphonic acid, an N-heterocyclic compound, or a combination thereof, (c) a corrosion inhibitor comprising an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, a fatty acid amino acid, an amine, an amide, or a combination thereof, (d) an oxidizing agent, and (e) an aqueous carrier. The invention also provides a method of polishing a substrate, especially a substrate comprising a cobalt layer, with the polishing composition.

公开(公告)号：US20160108286A1

公开(公告)日：2016-04-21

申请号：US14919526

申请日：2015-10-21

Applicant: Cabot Microelectronics Corporation

Inventor： Elise Sikma ,  Witold Paw ,  Benjamin Petro ,  Jeffrey Cross ,  Glenn Whitener

IPC: C09G1/02 ,  C23F1/30 ,  B24B37/04 ,  C23F11/04

CPC classification number: C09G1/02 ,  B24B37/044 ,  C23F3/04 ,  C23F3/06 ,  H01L21/3212

Abstract: The invention provides a chemical-mechanical polishing composition including (a) an abrasive comprising alumina particles, silica particles, or a combination thereof, (b) a rate accelerator comprising a phosphonic acid, an N-heterocyclic compound, or a combination thereof, (c) a corrosion inhibitor comprising an amphoteric surfactant, a sulfonate, a phosphonate, a carboxylate, a fatty acid amino acid, an amine, an amide, or a combination thereof, (d) an oxidizing agent, and (e) an aqueous carrier. The invention also provides a method of polishing a substrate, especially a substrate comprising a cobalt layer, with the polishing composition.

Abstract translation: 本发明提供了一种化学机械抛光组合物，其包括（a）包含氧化铝颗粒，二氧化硅颗粒或其组合的研磨剂，（b）包含膦酸，N-杂环化合物或其组合的速率促进剂（ c）包含两性表面活性剂，磺酸盐，膦酸盐，羧酸盐，脂肪酸氨基酸，胺，酰胺或其组合的腐蚀抑制剂，（d）氧化剂，和（e） 。 本发明还提供了一种抛光衬底，特别是包含钴层的衬底与抛光组合物的方法。