Fried Nut Snack Chip
    1.
    发明申请
    Fried Nut Snack Chip 审中-公开
    油炸螺母小吃芯片

    公开(公告)号:US20080145503A1

    公开(公告)日:2008-06-19

    申请号:US11611277

    申请日:2006-12-15

    IPC分类号: A21D10/02 A23L1/10 A23L1/36

    CPC分类号: A23L25/30 A23L25/00

    摘要: The present invention discloses formulations for fried nut-based snack chips that have a hearty, crunchy, blistered texture. Ingredient formula ranges and processing steps are disclosed that provide improved dough sheet integrity during processing, and improved flavor, texture, appearance and structural integrity of the fried snack chip. The dry ingredients are combined with water to make a dough, which is then sheeted and cut into pieces. The pieces are toasted and fried to produce nut-based snack chips.

    摘要翻译: 本发明公开了具有丰盛,脆脆,起泡纹理的油煎的基于坚果的小吃片的制剂。 公开了组分配方范围和加工步骤,其在加工期间提供改进的面团片材完整性,并且改进了油炸小吃片的风味,质地,外观和结构完整性。 将干燥的成分与水混合以制成面团,然后将其切片并切成块。 将这些碎片烤和油炸以生产基于坚果的小吃片。

    Method for making a low carbohydrate dough
    2.
    发明授权
    Method for making a low carbohydrate dough 有权
    制作低碳水化合物面团的方法

    公开(公告)号:US07396555B2

    公开(公告)日:2008-07-08

    申请号:US10887399

    申请日:2004-07-08

    IPC分类号: A23L1/20

    CPC分类号: A23L11/07 A23L7/117 A23L7/13

    摘要: A method for making a low or reduced carbohydrate dough for making snack food products with a reduced carbohydrate content. Legumes such as soybeans are cooked near boiling, drained, and milled. Dry ingredients such as starch, fiber, and/or protein can be added to lower the dough moisture content so the dough can be sheeted and cut into pre-forms. The pre-forms can then be cooked, by frying or baking, and seasoned to make a low carbohydrate tortilla-like snack food.

    摘要翻译: 制备低或降低碳水化合物面团以制备具有降低的碳水化合物含量的小吃食品的方法。 诸如大豆的豆类在沸腾,排水和碾磨附近烹饪。 可以加入干成分如淀粉,纤维和/或蛋白质以降低面团水分含量,从而使面团成片并切成预成型。 然后可以通过油炸或烘烤来烹饪预制件,并经过调味以制成低碳水化合物玉米饼状小吃食品。

    Method for Making Legume-Based Dough and Nutritional Products Therefrom
    5.
    发明申请
    Method for Making Legume-Based Dough and Nutritional Products Therefrom 审中-公开
    制作豆类面团和营养产品的方法

    公开(公告)号:US20110256293A1

    公开(公告)日:2011-10-20

    申请号:US12763278

    申请日:2010-04-20

    IPC分类号: A21D13/00 A23P1/10 A23L1/01

    摘要: Legumes having a raw moisture content of between about 19% to about 45% are pressure cooked to a moisture content of between about 42% to about 49%. The legumes may also be subjected to a low thermal stress dewatering at less than about 160° F. After grinding, additional ingredients such as starches, fibers, protein, and/or vitamin and mineral fortification can be added prior to forming a legume-based dough. Kneaded or shaped dough can be cooked and seasoned to make a nutritious snack food comprising between about 5 and about 6 grams of protein per one ounce serving, or between about 10%-30% protein.

    摘要翻译: 具有约19%至约45%之间的原始水分含量的豆类被加热烹饪至约42%至约49%之间的水分含量。 豆类也可以在低于约160°F的条件下进行低热应力脱水。在研磨之后,可以在形成基于豆类之前添加额外的成分例如淀粉,纤维,蛋白质和/或维生素和矿物质强化 面团。 可以将揉面或成形的面团煮熟并经过调味以制备营养的零食,每盎司服用约5至约6克蛋白质,或约10%-30%的蛋白质。

    Method for making a dual-textured food substrate having large seasoning bits
    8.
    发明授权
    Method for making a dual-textured food substrate having large seasoning bits 失效
    制造具有大调味料的双重纹理食品基材的方法

    公开(公告)号:US07074446B2

    公开(公告)日:2006-07-11

    申请号:US10755577

    申请日:2004-01-12

    IPC分类号: A23P1/08

    摘要: Method for making a dual-textured food substrate having large seasoning bits whereby the bits are substantially adhered to the food substrate, or chip. A first topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip having a first texture. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits. A second topping having a second texture is then placed and melted onto the chip. The food ingredient properties are optimized to provide a shelf-stable dual-textured food product.

    摘要翻译: 用于制造具有大的调味料的双重纹理的食品基材的方法,由此这些比特基本上粘附到食品基材或芯片上。 将包含大调味料和干粘合剂的第一顶料施加到具有第一织构的熟片上。 然后将顶部煮熟的芯片加热到一定温度,使得干燥的粘合剂经历玻璃化转变并沿着钻头向下流动到钻头和食品基底接触点。 然后将顶部熟的芯片进行改变的工艺条件,例如冷却,粘合剂硬化,并且在芯片和调味料之间形成粘合。 然后将具有第二纹理的第二顶部放置并熔化到芯片上。 食品成分性能得到优化,可提供货架稳定的双重纹理食品。