公开(公告)号：US20080230923A1

公开(公告)日：2008-09-25

申请号：US12051619

申请日：2008-03-19

申请人： Cha-Jea JO ,  Myung-Kee CHUNG ,  Nam-Seog KIM ,  In-Young LEE ,  Seok-Ho KIM ,  Ho-Jin LEE ,  Ju-Il CHOI ,  Chang-Woo SHIN

发明人： Cha-Jea JO ,  Myung-Kee CHUNG ,  Nam-Seog KIM ,  In-Young LEE ,  Seok-Ho KIM ,  Ho-Jin LEE ,  Ju-Il CHOI ,  Chang-Woo SHIN

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H01L2224/05599

摘要： A chip stack package includes a substrate, a plurality of chips, a plurality of adhesive layers and a plug. The substrate has a wiring pattern and a seed layer formed on the wiring pattern. Each of the chips has an electrode pad and a first through-hole that penetrates the electrode pad. The chips are stacked such that the first through-holes are aligned on the seed layer of the substrate. The adhesive layers are interposed between the substrate and one of the chips, as well as between the chips. Each of the adhesive layers has a second through-hole connected to the first through-hole. The plug fills up the first through-holes and the second through-holes and electrically connects the electrode pads to the wiring pattern of the substrate. A cross-sectional area of the plug in the second through-holes may be larger than that of the plug in the first through-holes.

摘要翻译： 芯片堆叠封装包括基板，多个芯片，多个粘合剂层和插头。 基板具有形成在布线图案上的布线图案和种子层。 每个芯片具有电极焊盘和穿过电极焊盘的第一通孔。 芯片被堆叠，使得第一通孔在衬底的籽晶层上排列。 粘合层介于基片和芯片之一之间以及芯片之间。 每个粘合层具有连接到第一通孔的第二通孔。 插头填充第一通孔和第二通孔，并将电极焊盘电连接到衬底的布线图案。 第二通孔中的插塞的横截面面积可以大于第一通孔中的插头的横截面面积。

公开(公告)号：US20080092360A1

公开(公告)日：2008-04-24

申请号：US11864452

申请日：2007-09-28

申请人： Teak-Hoon LEE ,  Myung-Kee CHUNG

发明人： Teak-Hoon LEE ,  Myung-Kee CHUNG

IPC分类号： B23P19/00

CPC分类号： H01L21/6838 ,  H01L21/67132 ,  Y10T29/49815 ,  Y10T29/53274

摘要： Provided are a thin semiconductor chip pickup apparatus and method for detaching a die bonding film from a semiconductor chip using the apparatus. The apparatus may include a stage for supporting a die-bonding film to which a semiconductor chip is attached, a plurality of suction members arranged on the center of the stage for extracting the die-bonding film by a vacuum, where the suction members detach the die-bonding film away from the semiconductor chip to form a vacuum region, and a plurality of vacuum suction ports respectively interposed between adjacent suction members to allow the suction members to detach the die-bonding film by the vacuum.

摘要翻译： 提供了一种使用该装置从半导体芯片分离芯片接合薄膜的薄的半导体芯片拾取装置和方法。 该装置可以包括用于支撑安装有半导体芯片的芯片接合膜的载物台，布置在载物台的中心的多个抽吸构件用于通过真空抽出芯片接合薄膜，其中抽吸构件分离 将半导体芯片的芯片接合膜形成真空区域，分别插入相邻的吸引部件之间的多个真空吸引口，使吸引部件通过真空分离芯片接合薄膜。