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    THIN SEMICONDUCTOR CHIP PICKUP APPARATUS AND METHOD
    1.
    发明申请
    THIN SEMICONDUCTOR CHIP PICKUP APPARATUS AND METHOD 审中-公开
    薄半导体芯片撷取器和方法

    公开(公告)号：US20080092360A1

    公开(公告)日：2008-04-24

    申请号：US11864452

    申请日：2007-09-28

    申请人： Teak-Hoon LEE ,  Myung-Kee CHUNG

    发明人： Teak-Hoon LEE ,  Myung-Kee CHUNG

    IPC分类号： B23P19/00

    CPC分类号： H01L21/6838 ,  H01L21/67132 ,  Y10T29/49815 ,  Y10T29/53274

    摘要： Provided are a thin semiconductor chip pickup apparatus and method for detaching a die bonding film from a semiconductor chip using the apparatus. The apparatus may include a stage for supporting a die-bonding film to which a semiconductor chip is attached, a plurality of suction members arranged on the center of the stage for extracting the die-bonding film by a vacuum, where the suction members detach the die-bonding film away from the semiconductor chip to form a vacuum region, and a plurality of vacuum suction ports respectively interposed between adjacent suction members to allow the suction members to detach the die-bonding film by the vacuum.

    摘要翻译： 提供了一种使用该装置从半导体芯片分离芯片接合薄膜的薄的半导体芯片拾取装置和方法。 该装置可以包括用于支撑安装有半导体芯片的芯片接合膜的载物台，布置在载物台的中心的多个抽吸构件用于通过真空抽出芯片接合薄膜，其中抽吸构件分离 将半导体芯片的芯片接合膜形成真空区域，分别插入相邻的吸引部件之间的多个真空吸引口，使吸引部件通过真空分离芯片接合薄膜。

    FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN
    4.
    发明申请
    FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN 审中-公开
    半导体器件的制造方法及其半导体器件的拾取器件

    公开(公告)号：US20130149817A1

    公开(公告)日：2013-06-13

    申请号：US13559141

    申请日：2012-07-26

    申请人： Chang-Seong JEON ,  Sang-Sick PARK ,  Sang-Wook PARK ,  Teak-Hoon LEE ,  Kwang-Chul CHOI

    发明人： Chang-Seong JEON ,  Sang-Sick PARK ,  Sang-Wook PARK ,  Teak-Hoon LEE ,  Kwang-Chul CHOI

    IPC分类号： H01L21/762

    CPC分类号： H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/8117 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2924/00014

    摘要： A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement.

    摘要翻译： 半导体器件的制造方法可以包括在支撑晶片上形成半导体管芯，并且通过将转移单元附接到管芯而从晶片上拾取管芯，所述转移单元包括构造成能够进行扭转运动的头单元，以及执行 扭转运动。 半导体器件的制造方法可以包括在支撑晶片上形成第一半导体器件; 以及从所述晶片拾取所述第一半导体器件，将所述第一半导体器件移动到第二半导体器件上，并且将所述第一半导体器件接合到所述第二半导体器件，同时保持所述第一半导体器件定向成使得表面朝上。 半导体器件的制造方法可以包括在支撑晶片上形成第一半导体器件，附接到第一半导体器件，被配置为能够进行扭转运动并执行扭转运动的转移单元。

    SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME
    6.
    发明申请
    SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING THE SAME 有权
    半导体封装和具有该封装的电子器件

    公开(公告)号：US20090096071A1

    公开(公告)日：2009-04-16

    申请号：US12240036

    申请日：2008-09-29

    申请人： Pyoung-Wan KIM ,  Eun-Chul AHN ,  Teak-Hoon LEE ,  Chul-Yong JANG

    发明人： Pyoung-Wan KIM ,  Eun-Chul AHN ,  Teak-Hoon LEE ,  Chul-Yong JANG

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L23/3114 ,  H01L2224/04105 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor package may include a semiconductor chip, a molding layer which molds the semiconductor chip, and an interconnection which extends crossing an interface between the semiconductor chip and the molding layer and connects the semiconductor chip to an outside, wherein a shape of the interconnection is changed along the extended length thereof. According to the present invention, even if a mechanical stress or a thermal stress is applied to an interconnection, a crack does not occur in the interconnection or the interconnection is not disconnected. Therefore, a reliability of the semiconductor package is improved.

    摘要翻译： 半导体封装可以包括半导体芯片，模制半导体芯片的模制层和跨越半导体芯片和模制层之间的界面延伸并将半导体芯片连接到外部的互连，其中互连的形状是 沿其长度改变。 根据本发明，即使对互连件施加机械应力或热应力，在互连中也不会发生裂纹，也不会断开互连。 因此，提高了半导体封装的可靠性。