SEMICONDUCTOR DEVICE EMPLOYING BURIED INSULATING LAYER AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE EMPLOYING BURIED INSULATING LAYER AND METHOD OF FABRICATING THE SAME 失效
    采用绝缘绝缘层的半导体器件及其制造方法

    公开(公告)号:US20080296649A1

    公开(公告)日:2008-12-04

    申请号:US11944260

    申请日:2007-11-21

    IPC分类号: H01L27/108 H01L21/8242

    摘要: A semiconductor device employs an asymmetrical buried insulating layer, and a method of fabricating the same. The semiconductor device includes a lower semiconductor substrate. An upper silicon pattern is located on the lower semiconductor substrate. The upper silicon pattern includes a channel region, and a source region and a drain region spaced apart from each other by the channel region. A gate electrode is electrically insulated from the upper silicon pattern and intersects over the channel region. A bit line and a cell capacitor are electrically connected to the source region and the drain region, respectively. A buried insulating layer is interposed between the drain region and the lower semiconductor substrate. The buried insulating layer has an extension portion partially interposed between the channel region and the lower semiconductor substrate.

    摘要翻译: 半导体器件采用非对称埋层绝缘层及其制造方法。 半导体器件包括下半导体衬底。 上硅图案位于下半导体衬底上。 上部硅图案包括通道区域以及由沟道区域彼此间隔开的源极区域和漏极区域。 栅电极与上硅图案电绝缘,并且在沟道区域上相交。 位线和单元电容器分别电连接到源极区域和漏极区域。 掩埋绝缘层插入在漏区和下半导体衬底之间。 掩埋绝缘层具有部分插入在沟道区域和下半导体衬底之间的延伸部分。

    SEMICONDUCTOR DEVICES HAVING A FIELD EFFECT TRANSISTOR AND METHODS OF FABRICATING THE SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICES HAVING A FIELD EFFECT TRANSISTOR AND METHODS OF FABRICATING THE SAME 有权
    具有场效应晶体管的半导体器件及其制造方法

    公开(公告)号:US20080032469A1

    公开(公告)日:2008-02-07

    申请号:US11764751

    申请日:2007-06-18

    IPC分类号: H01L21/336

    摘要: A semiconductor device having a field effect transistor and a method of forming the same are provided. The semiconductor device preferably includes a device active pattern disposed on a predetermined region of the substrate. The gate electrode preferably crosses over the device active pattern, interposed by a gate insulation layer. A support pattern is preferably interposed between the device active pattern and the substrate. The support pattern can be disposed under the gate electrode. A filling insulation pattern is preferably disposed between the device active pattern and the filling insulation pattern. The filling insulation pattern may be disposed under the source/drain region. A device active pattern under the gate electrode is preferably formed of a strained silicon having a lattice width wider than a silicon lattice.

    摘要翻译: 提供具有场效应晶体管的半导体器件及其形成方法。 半导体器件优选地包括设置在衬底的预定区域上的器件有源图案。 栅电极优选地跨过器件有源图案,由栅极绝缘层插入。 支撑图案优选地插入在器件活性图案和基底之间。 支撑图案可以设置在栅电极下方。 填充绝缘图案优选地设置在装置活性图案和填充绝缘图案之间。 填充绝缘图案可以设置在源极/漏极区域下方。 栅电极下方的器件有源图案优选由具有比硅晶格宽的晶格宽度的应变硅形成。

    SEMICONDUCTOR DEVICE HAVING PARTIALLY INSULATED FIELD EFFECT TRANSISTOR (PiFET) AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE HAVING PARTIALLY INSULATED FIELD EFFECT TRANSISTOR (PiFET) AND METHOD OF FABRICATING THE SAME 审中-公开
    具有部分绝缘场效应晶体管(PiFET)的半导体器件及其制造方法

    公开(公告)号:US20080145989A1

    公开(公告)日:2008-06-19

    申请号:US12040636

    申请日:2008-02-29

    IPC分类号: H01L29/06

    摘要: Embodiments of the invention include a partially insulated field effect transistor and a method of fabricating the same. According to some embodiments, a semiconductor substrate is formed by sequentially stacking a bottom semiconductor layer, a sacrificial layer, and a top semiconductor layer. The sacrificial layer may be removed to form a buried gap region between the bottom semiconductor layer and the top semiconductor layer. Then, a transistor may be formed on the semiconductor substrate. The sacrificial layer may be a crystalline semiconductor formed by an epitaxial growth technology.

    摘要翻译: 本发明的实施例包括部分绝缘的场效应晶体管及其制造方法。 根据一些实施例,通过顺序堆叠底部半导体层,牺牲层和顶部半导体层来形成半导体衬底。 可以去除牺牲层以在底部半导体层和顶部半导体层之间形成掩埋间隙区域。 然后,可以在半导体衬底上形成晶体管。 牺牲层可以是通过外延生长技术形成的晶体半导体。

    GATE STRUCTURE AND METHOD OF FORMING THE GATE STRUCTURE, SEMICONDUCTOR DEVICE HAVING THE GATE STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
    4.
    发明申请
    GATE STRUCTURE AND METHOD OF FORMING THE GATE STRUCTURE, SEMICONDUCTOR DEVICE HAVING THE GATE STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE 审中-公开
    门结构和形成门结构的方法,具有门结构的半导体器件和制造半导体器件的方法

    公开(公告)号:US20070210368A1

    公开(公告)日:2007-09-13

    申请号:US11683364

    申请日:2007-03-07

    IPC分类号: H01L21/3205 H01L29/76

    摘要: A gate structure in a semiconductor device includes a tunnel insulation layer disposed on a substrate, a first charge trapping layer disposed on the tunnel insulation layer, a second charge trapping layer disposed on the first charge trapping layer, a dielectric layer disposed to cover the second charge trapping layer, and a conductive layer pattern disposed on the dielectric layer. The first charge trapping layer includes charge trapping sites for storing charges therein. The second charge trapping layer includes nanocrystals. The semiconductor device including the gate structure may have a sufficiently wide programming/erasing window and an improved data retention capability.

    摘要翻译: 半导体器件中的栅极结构包括设置在衬底上的隧道绝缘层,设置在隧道绝缘层上的第一电荷俘获层,设置在第一电荷俘获层上的第二电荷俘获层,设置成覆盖第二电荷俘获层的电介质层 电荷捕获层和设置在电介质层上的导电层图案。 第一电荷俘获层包括用于在其中存储电荷的电荷俘获位置。 第二电荷俘获层包括纳米晶体。 包括栅极结构的半导体器件可以具有足够宽的编程/擦除窗口和改进的数据保持能力。