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1.发明申请Novel method to reduce void formation during trapezoidal write pole plating in perpendicular recording 有权在垂直记录中减少梯形写入极电镀期间的空隙形成的新方法公开(公告)号：US20110011744A1
公开(公告)日：2011-01-20
申请号：US12460432
申请日：2009-07-17
申请人： Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
发明人： Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
IPC分类号： C25D7/00
CPC分类号： C25D5/022 , C25D5/18 , C25D7/001 , G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.
摘要翻译： 公开了一种在PMR头中形成写极的方法，其涉及在成型层中形成开口。 在开口内和顶表面上形成保形钌籽晶层。 由CoFeNi制成的辅助层或其合金在种子层上形成为保形层。 通过在由激活时间控制的激活步骤期间施加（ - ）电流或电压，在电镀溶液中去除全部或部分辅助层。 此后，以（+）电流电镀磁性材料以填充开口，并且优选地具有与辅助层相同的CoFeNi组成。 该方法避免了Ru氧化，导致对CoFeNi的粘附不良，以及导致写入极杂质的表面活性剂含量升高。 通过形成具有改善的润湿性的种子层表面，可显着地减少电镀材料中的空隙。
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公开(公告)号：US20060249392A1
公开(公告)日：2006-11-09
申请号：US11122847
申请日：2005-05-05
申请人： Chao-Peng Chen , Jas Chudasama , Situan Lam
发明人： Chao-Peng Chen , Jas Chudasama , Situan Lam
摘要： A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.
摘要翻译： 公开了一种在不含还原剂的酸性铁基镀液中阴极还原不需要的Fe + +离子至所需的Fe 2+ +2 +离子的方法。 在工作电极和参考电极之间施加相对于SCE的0.1至0.3伏特的辅助电位，并且可以降低摩尔比[Fe 2+] / [Fe 2+] +2 ]至1ppm，而不在工作电极上沉积Fe或其他金属或导致析氢。 该方法适用于电镀NiFe，FeCo和CoNiFe等软磁膜，可在电镀过程中或电池空闲期间进行。 该过程通过减少由于常规溶液互换而导致的危险废物和工具停机时间的成本效益。 其他优点是改善了镀膜的组成和厚度的均匀性，因为避免了与分解的还原剂相关的问题。
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3.发明授权Method to reduce void formation during trapezoidal write pole plating in perpendicular recording 有权在垂直记录中梯形写入极电镀期间减少空隙形成的方法公开(公告)号：US08273233B2
公开(公告)日：2012-09-25
申请号：US12460432
申请日：2009-07-17
申请人： Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
发明人： Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
IPC分类号： C25D5/02
CPC分类号： C25D5/022 , C25D5/18 , C25D7/001 , G11B5/1278 , G11B5/3116 , G11B5/3163
摘要： A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.
摘要翻译： 公开了一种在PMR头中形成写极的方法，其涉及在成型层中形成开口。 在开口内和顶表面上形成保形钌籽晶层。 由CoFeNi制成的辅助层或其合金在种子层上形成为保形层。 通过在由激活时间控制的激活步骤期间施加（ - ）电流或电压，在电镀溶液中去除全部或部分辅助层。 此后，以（+）电流电镀磁性材料以填充开口，并且优选地具有与辅助层相同的CoFeNi组成。 该方法避免了Ru氧化，导致对CoFeNi的粘附不良，以及导致写入极杂质的表面活性剂含量升高。 通过形成具有改善的润湿性的种子层表面，可显着地减少电镀材料中的空隙。
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公开(公告)号：US07431815B2
公开(公告)日：2008-10-07
申请号：US11122847
申请日：2005-05-05
申请人： Chao-Peng Chen , Jas Chudasama , Situan Lam
发明人： Chao-Peng Chen , Jas Chudasama , Situan Lam
摘要： A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.
摘要翻译： 公开了一种在不含还原剂的酸性铁基镀液中阴极还原不需要的Fe + +离子至所需的Fe 2+ +2 +离子的方法。 在工作电极和参考电极之间施加相对于SCE的0.1至0.3伏特的辅助电位，并且可以降低摩尔比[Fe 2+] / [Fe 2+] +2 ]至1ppm，而不在工作电极上沉积Fe或其他金属或导致析氢。 该方法适用于电镀NiFe，FeCo和CoNiFe等软磁膜，可在电镀过程中或电池空闲期间进行。 该过程通过减少由于常规溶液互换而导致的危险废物和工具停机时间的成本效益。 其他优点是改善了镀膜的组成和厚度的均匀性，因为避免了与分解的还原剂相关的问题。
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公开(公告)号：US20110094888A1
公开(公告)日：2011-04-28
申请号：US12589599
申请日：2009-10-26
申请人： Chao-Peng Chen , Chien-Li Lin , Jas Chudasama , Situan Lam
发明人： Chao-Peng Chen , Chien-Li Lin , Jas Chudasama , Situan Lam
摘要： A method of rejuvenating a Ru plating seed layer during write pole fabrication in a PMR head is disclosed that involves forming an opening in a mold forming layer. A Ru seed layer is deposited by CVD within the opening and on a top surface of the mold forming layer. The substrate with the Ru seed layer is immersed in an acidic solution and an electric potential is applied for 1 to 2 minutes such that hydrogen is generated to reduce ruthenium oxides to Ru metal on the seed layer surface in an activation step. One or more surfactants are used to improve wettability of the Ru layer. The substrate is transferred directly to an electroplating solution without drying following the activation step to minimize exposure to oxygen that could regenerate oxides on the surface of the Ru layer. As a result, write pole voids and delamination are significantly reduced.
摘要翻译： 公开了一种在PMR头中的写磁极制造期间使Ru电镀种子层再生的方法，其涉及在模具成型层中形成开口。 通过CVD将Ru籽晶层沉积在模具形成层的开口内和顶表面上。 将具有Ru籽晶层的衬底浸入酸性溶液中并施加电位1至2分钟，使得在活化步骤中产生氢以将氧化钌还原为种子层表面上的Ru金属。 使用一种或多种表面活性剂来改善Ru层的润湿性。 在活化步骤之后，将底物直接转移到电镀溶液中，而不会干燥以使暴露于可再生Ru层表面上的氧化物的氧暴露最小化。 结果，写入极空隙和分层显着减少。
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公开(公告)号：US09103012B2
公开(公告)日：2015-08-11
申请号：US12931854
申请日：2011-02-11
申请人： Chao-Peng Chen , Jas Chudasama , Chien-Li Lin , David Wagner
发明人： Chao-Peng Chen , Jas Chudasama , Chien-Li Lin , David Wagner
摘要： A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.
摘要翻译： 公开了一种在镀覆工艺期间激活铜籽晶层的方法，其包括施加由超声波雾化器产生的蒸气。 通电的蒸气滴包括水和弱的有机酸如乙酸，乳酸，柠檬酸，尿酸，草酸或甲酸，其蒸气压接近于水。 弱有机酸优选具有足够高的pKa以避免Cu蚀刻，但是足够的酸性以与高通量制造相容的速率除去氧化铜。 在一个实施方案中，将弱酸/水蒸汽施加到旋转碗中的基底上，然后在同一旋转碗中进行去离子水漂洗步骤。 改进的润湿性导致随后镀覆的铜膜的均匀性提高。 由于化学品消耗减少和产品产量提高，实现了大量的成本节约。
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公开(公告)号：US20120205344A1
公开(公告)日：2012-08-16
申请号：US12931854
申请日：2011-02-11
申请人： Chao-Peng Chen , Jas Chudasama , Chien-Li Lin , David Wagner
发明人： Chao-Peng Chen , Jas Chudasama , Chien-Li Lin , David Wagner
摘要： A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.
摘要翻译： 公开了一种在镀覆工艺期间激活铜籽晶层的方法，其包括施加由超声波雾化器产生的蒸气。 通电的蒸气滴包括水和弱的有机酸如乙酸，乳酸，柠檬酸，尿酸，草酸或甲酸，其蒸气压接近于水。 弱有机酸优选具有足够高的pKa以避免Cu蚀刻，但是足够的酸性以与高通量制造相容的速率除去氧化铜。 在一个实施方案中，将弱酸/水蒸汽施加到旋转碗中的基底上，然后在同一旋转碗中进行去离子水漂洗步骤。 改进的润湿性导致随后镀覆的铜膜的均匀性提高。 由于化学品消耗减少和产品产量提高，实现了大量的成本节约。
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公开(公告)号：US5639422A
公开(公告)日：1997-06-17
申请号：US691476
申请日：1996-08-02
CPC分类号： C01B7/07
摘要： Disclosed is a method of reducing the corrosion of a carbon steel reboiler in which a reboiler fluid containing nitrogen trichloride is heated to decompose the nitrogen trichloride. About 1 to about 100 ppm, based on the reboiler fluid weight, of a source of iodine, is added to the reboiler.
摘要翻译： 公开了一种减少碳钢再沸器的腐蚀的方法，其中加热含有三氯化碳的再沸器流体以分解三氯化氮。 将约1至约100ppm（基于再沸器流体重量）的碘源加入到再沸器中。
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公开(公告)号：US07633712B2
公开(公告)日：2009-12-15
申请号：US12082256
申请日：2008-04-10
申请人： Chao-Peng Chen , Jei-Wei Chang , Xiaohong Yang
发明人： Chao-Peng Chen , Jei-Wei Chang , Xiaohong Yang
CPC分类号： G03F7/40 , G03F7/201 , G03F7/2022 , G03F7/2059 , Y10S430/143
摘要： A write pole for vertical magnetic recording is described. It includes a trapezoidal prism of high magnetic moment material, having inwardly sloping sidewalls. Its parallel surfaces are between about 0.1 and 0.3 microns apart and the sidewalls slope in the range of 15.5 to 60 degrees relative to vertical.
摘要翻译： 描述用于垂直磁记录的写极。 它包括高磁矩材料的梯形棱镜，具有向内倾斜的侧壁。 其平行表面相隔约0.1至0.3微米，侧壁相对于垂直方向倾斜15.5至60度。
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公开(公告)号：US20070042299A1
公开(公告)日：2007-02-22
申请号：US11588574
申请日：2006-10-27
申请人： Chao-Peng Chen , Jei-Wei Chang , Xiaohong Yang
发明人： Chao-Peng Chen , Jei-Wei Chang , Xiaohong Yang
IPC分类号： G03C5/00
CPC分类号： G03F7/40 , G03F7/201 , G03F7/2022 , G03F7/2059 , Y10S430/143
摘要： It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed by flood exposing with electrons. Then, a second development treatment is given. This results in removal of additional material from the sidewalls, said removal being greatest at the substrate and least at the pedestal's top surface, resulting in negatively sloping sidewalls. Application of this method to a process for forming a pole tip for a vertical magnetic writer is also discussed.
摘要翻译： 从负极或正音色化学放大抗蚀剂产生负的壁角是非常困难的，特别是通过电子束光刻。 现在已经通过首先以常规方式形成光致抗蚀剂基座，随后用电子暴露而克服了这个问题。 然后，给出第二次开发处理。 这导致从侧壁去除附加材料，所述去除在基底处至少在基座的顶表面处最大，导致负斜面的侧壁。 还讨论了该方法在用于形成用于垂直磁性写入器的极尖的处理中的应用。
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