Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
    7.
    发明授权
    Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process 有权
    结合后端集成电路制造工艺的通用封装方法和系统

    公开(公告)号:US07105377B1

    公开(公告)日:2006-09-12

    申请号:US10824006

    申请日:2004-04-13

    IPC分类号: H01L25/022 H01L21/677

    摘要: A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently of the die size of the die-strip. A control computer maintains a die-strip map database recording the die size of the die-strip. In-line molding and solder ball attachment processes are then performed and function independently of the die size of the die-strip. Processes that are independent of die size provide a universal packaging manufacturing solution. The present invention then accesses the database to determine the die size for cutting the die-strip based on specifications maintained by the electronic die-strip map database. Sorting, testing and finish assembly processes are then performed.

    摘要翻译: 结合自动化在线后端IC制造工艺的通用包装的方法和系统。 在一个方法实施例中,本发明通过多个独立于模片条的管芯尺寸起作用的多个集成在线工艺处理模片。 控制计算机维护记录模片尺寸的模片图地图数据库。 然后进行在线模制和焊球附着过程,并且独立于模片的模头尺寸起作用。 独立于管芯尺寸的工艺提供了通用的包装制造解决方案。 然后,本发明基于由电子管芯条地图数据库维护的规格,访问数据库以确定用于切割管芯条的管芯尺寸。 然后执行排序,测试和完成组装过程。

    High reliability lead frame and packaging technology containing the same
    8.
    发明授权
    High reliability lead frame and packaging technology containing the same 有权
    高可靠性引线框架和包装技术相同

    公开(公告)号:US06331728B1

    公开(公告)日:2001-12-18

    申请号:US09259482

    申请日:1999-02-26

    IPC分类号: H01L23495

    摘要: A lead frame includes a first side rail, a second side rail spaced apart from the first side rail, a center rail disposed between the first side rail and the second side rail, and a plurality of package locations. Each package location includes a first and a second die attach paddle. The first die attach paddle supports a first side of a semiconductor die and is coupled only to the first side rail or to the second side rail. The second die attach paddle supports a second side of the semiconductor die and is coupled only to the center rail. The first and second die attach paddles are separate and unconnected to each other and may be generally circular in shape. An aggregate surface area of the first and second paddles may be less than about 25 percent of a surface area of the semiconductor die. By limiting the surface area of the interfaces between the lead frame and the silicon die and the surface area of the interfaces between the lead frame and the molding compound, moisture-related problems and problems related to the differing coefficients of thermal expansion (such as delamination and/or cracks, for example) of the constituent materials of the resultant semiconductor device are minimized.

    摘要翻译: 引线框架包括第一侧轨道,与第一侧轨道间隔开的第二侧轨道,设置在第一侧轨道和第二侧轨道之间的中心轨道以及多个封装位置。 每个包装位置包括第一和第二管芯附着桨。 第一管芯附接板支撑半导体管芯的第一侧,并且仅与第一侧轨或第二侧轨相连。 第二管芯附接焊盘支撑半导体管芯的第二侧,并仅与中心导轨相连。 第一和第二管芯附接拨片彼此分离并且不连接,并且可以是大致圆形的形状。 第一和第二桨叶的总表面积可以小于半导体管芯的表面积的约25%。 通过限制引线框架和硅片之间的界面的表面积和引线框架和模塑料之间的界面的表面积,与水分相关的问题和与不同的热膨胀系数有关的问题(如分层 和/或例如裂纹)最小化。

    Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame
    10.
    发明授权
    Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame 有权
    使用这种引线框架生产高可靠性引线框架和封装半导体管芯的方法

    公开(公告)号:US06576491B1

    公开(公告)日:2003-06-10

    申请号:US09964716

    申请日:2001-09-26

    IPC分类号: H01L2150

    摘要: A lead frame includes a first side rail, a second side rail spaced apart from the first side rail, a center rail disposed between the first side rail and the second side rail, and a plurality of package locations. Each package location includes a first and a second die attach paddle. The first die attach paddle supports a first side of a semiconductor die and is coupled only to the first side rail or to the second side rail. The second die attach paddle supports a second side of the semiconductor die and is coupled only to the center rail. The first and second die attach paddles are separate and unconnected to each other and may be generally circular in shape. An aggregate surface area of the first and second paddles may be less than about 25 percent of a surface area of the semiconductor die. By limiting the surface area of the interfaces between the lead frame and the silicon die and the surface area of the interfaces between the lead frame and the molding compound, moisture-related problems and problems related to the differing coefficients of thermal expansion (such as delamination and/or cracks, for example) of the constituent materials of the resultant semiconductor device are minimized.

    摘要翻译: 引线框架包括第一侧轨道,与第一侧轨道间隔开的第二侧轨道,设置在第一侧轨道和第二侧轨道之间的中心轨道以及多个封装位置。 每个包装位置包括第一和第二管芯附着桨。 第一管芯附接板支撑半导体管芯的第一侧,并且仅与第一侧轨或第二侧轨相连。 第二管芯附接焊盘支撑半导体管芯的第二侧,并仅与中心导轨相连。 第一和第二管芯附接拨片彼此分离并且不连接,并且可以是大致圆形的形状。 第一和第二桨叶的总表面积可以小于半导体管芯的表面积的约25%。 通过限制引线框架和硅片之间的界面的表面积和引线框架和模塑料之间的界面的表面积,与水分相关的问题和与不同的热膨胀系数有关的问题(如分层 和/或例如裂纹)最小化。