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公开(公告)号：US07884624B2
公开(公告)日：2011-02-08
申请号：US11956527
申请日：2007-12-14
申请人： Horng-Jou Wang , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
发明人： Horng-Jou Wang , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： G01R27/26
CPC分类号： G01P15/125 , G01C19/5755 , G01C19/5769 , G01P15/18
摘要： A capacitance sensing structure includes a substrate, a sensing electrode layer, at least one stack layer and a conductive body. The sensing electrode layer is formed on or in the substrate. The stack layer is formed on the sensing electrode layer. The conductive body is disposed over and corresponding to the sensing electrode layer and the stack layer.
摘要翻译： 电容感测结构包括衬底，感测电极层，至少一个堆叠层和导电体。 感测电极层形成在衬底上或衬底中。 堆叠层形成在感测电极层上。 导电体设置在感测电极层和堆叠层之上并对应于感测电极层和堆叠层。
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公开(公告)号：US20080217787A1
公开(公告)日：2008-09-11
申请号：US12016889
申请日：2008-01-18
申请人： Cheng-Chang LEE , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
发明人： Cheng-Chang LEE , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
CPC分类号： B81C1/0019
摘要： A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.
摘要翻译： 微机电器件包括衬底，第一图案化导电层，第二图案化导电层和第一图案化阻挡层。 第一图案化导电层设置在基板上。 第二图案化导电层设置在第一图案化导电层上。 第一图案化阻挡层与第一图案化导电层和第二图案化导电层连接。 此外，还公开了一种制造微机电装置的方法。
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公开(公告)号：US07989904B2
公开(公告)日：2011-08-02
申请号：US12016889
申请日：2008-01-18
申请人： Cheng-Chang Lee , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
发明人： Cheng-Chang Lee , Horng-Jou Wang , Zong-Ting Yuan , Chao-Jui Liang , Hsieh-Shen Hsieh , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： H01L27/14
CPC分类号： B81C1/0019
摘要： A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.
摘要翻译： 微机电器件包括衬底，第一图案化导电层，第二图案化导电层和第一图案化阻挡层。 第一图案化导电层设置在基板上。 第二图案化导电层设置在第一图案化导电层上。 第一图案化阻挡层与第一图案化导电层和第二图案化导电层连接。 此外，还公开了一种制造微机电装置的方法。
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公开(公告)号：US20080150554A1
公开(公告)日：2008-06-26
申请号：US11956527
申请日：2007-12-14
申请人： Horng-Jou WANG , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
发明人： Horng-Jou WANG , Hsieh-Shen Hsieh , Chao-Jui Liang , Cheng-Chang Lee , Chao-Qing Wang , Zong-Ting Yuan , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： G01R27/26
CPC分类号： G01P15/125 , G01C19/5755 , G01C19/5769 , G01P15/18
摘要： A capacitance sensing structure includes a substrate, a sensing electrode layer, at least one stack layer and a conductive body. The sensing electrode layer is formed on or in the substrate. The stack layer is formed on the sensing electrode layer. The conductive body is disposed over and corresponding to the sensing electrode layer and the stack layer.
摘要翻译： 电容感测结构包括衬底，感测电极层，至少一个堆叠层和导电体。 感测电极层形成在衬底上或衬底中。 堆叠层形成在感测电极层上。 导电体设置在感测电极层和堆叠层之上并对应于感测电极层和堆叠层。
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公开(公告)号：US20070148788A1
公开(公告)日：2007-06-28
申请号：US11643661
申请日：2006-12-22
申请人： Hsieh-Shen Hsieh , Heng-Chung Chang , Cheng-Chang Lee , Chao-Jui Liang , Huang-Kun Chen , Tai-Kang Shing
发明人： Hsieh-Shen Hsieh , Heng-Chung Chang , Cheng-Chang Lee , Chao-Jui Liang , Huang-Kun Chen , Tai-Kang Shing
CPC分类号： G01L9/0054
摘要： A semiconductor piezoresistive sensor, which is electrically connected with a circuit, includes a semiconductor base, at least one piezoresistive element and a conductive layer. The semiconductor base includes a diaphragm and a base. The base is disposed adjacent to and around the diaphragm. The piezoresistive element is formed in the diaphragm and is electrically connected with the circuit. The conductive layer is electrically connected with the diaphragm.
摘要翻译： 与电路电连接的半导体压阻传感器包括半导体基底，至少一个压阻元件和导电层。 半导体基座包括隔膜和基座。 底座设置在隔膜周围和周围。 压电元件形成在隔膜中并与电路电连接。 导电层与隔膜电连接。
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公开(公告)号：US07448278B2
公开(公告)日：2008-11-11
申请号：US11643661
申请日：2006-12-22
申请人： Hsieh-Shen Hsieh , Heng-Chung Chang , Cheng-Chang Lee , Chao-Jui Liang , Huang-Kun Chen , Tai-Kang Shing
发明人： Hsieh-Shen Hsieh , Heng-Chung Chang , Cheng-Chang Lee , Chao-Jui Liang , Huang-Kun Chen , Tai-Kang Shing
IPC分类号： G01L9/00
CPC分类号： G01L9/0054
摘要： A semiconductor piezoresistive sensor, which is electrically connected with a circuit, includes a semiconductor base, at least one piezoresistive element and a conductive layer. The semiconductor base includes a diaphragm and a base. The base is disposed adjacent to and around the diaphragm. The piezoresistive element is formed in the diaphragm and is electrically connected with the circuit. The conductive layer is electrically connected with the diaphragm.
摘要翻译： 与电路电连接的半导体压阻传感器包括半导体基底，至少一个压阻元件和导电层。 半导体基座包括隔膜和基座。 底座设置在隔膜周围和周围。 压电元件形成在隔膜中并与电路电连接。 导电层与隔膜电连接。
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公开(公告)号：US07412888B2
公开(公告)日：2008-08-19
申请号：US11591617
申请日：2006-11-02
申请人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
发明人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.
摘要翻译： 加速度计包括固定单元和可移动单元。 固定单元具有多个第一电极部分和多个第二电极部分。 可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。 第三电极部分分别相对于第一电极部分设置在主体的外侧。 第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。
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公开(公告)号：US20070144258A1
公开(公告)日：2007-06-28
申请号：US11591617
申请日：2006-11-02
申请人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
发明人： Chia-Yi Chu , Heng-Chung Chang , Chuan-Wei Wang , Chih-Ming Sun , Wei-Leun Fang , Shiang-Cheng Lu , Hsieh-Shen Hsieh , Horng-Jou Wang , Tai-Kang Shing , Huang-Kun Chen
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.
摘要翻译： 加速度计包括固定单元和可移动单元。 固定单元具有多个第一电极部分和多个第二电极部分。 可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。 第三电极部分分别相对于第一电极部分设置在主体的外侧。 第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。
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公开(公告)号：US20090029185A1
公开(公告)日：2009-01-29
申请号：US12022040
申请日：2008-01-29
申请人： Cheng-Chang Lee , Ming-Hsien Lin , Yu-Ru Chang , Zong-Ting Yuan , Heng-Chung Chang , Huang-Kun Chen , Tai-Kang Shing
发明人： Cheng-Chang Lee , Ming-Hsien Lin , Yu-Ru Chang , Zong-Ting Yuan , Heng-Chung Chang , Huang-Kun Chen , Tai-Kang Shing
CPC分类号： H01F17/0006 , H01F1/26 , H01F1/37 , H01F5/003 , H01F17/04 , H01F41/046 , H01F2017/0066 , Y10T428/12201
摘要： A manufacturing method of a magnetic device includes the steps of forming a magnetic substrate having a plurality of recesses, and forming at least one coil in the recess. In addition, a magnetic device is also disclosed. The magnetic device includes a magnetic substrate and at least one coil. The magnetic substrate has a plurality of recesses and the coil is disposed in the recess.
摘要翻译： 磁性装置的制造方法包括以下步骤：形成具有多个凹部的磁性基板，并在凹部中形成至少一个线圈。 此外，还公开了磁性装置。 磁性装置包括磁性基板和至少一个线圈。 磁性基板具有多个凹部，线圈设置在凹部内。
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公开(公告)号：US20070283563A1
公开(公告)日：2007-12-13
申请号：US11889946
申请日：2007-08-17
申请人： Cheng-Chang Lee , Zong-Ting Yuan , Heng-Chung Chang , Huang-Kun Chen , Tai-Kang Shing , Wen-Shi Huang
发明人： Cheng-Chang Lee , Zong-Ting Yuan , Heng-Chung Chang , Huang-Kun Chen , Tai-Kang Shing , Wen-Shi Huang
IPC分类号： B21K1/10
CPC分类号： C25D11/04 , C23F1/02 , C23F1/14 , C25D5/022 , C25D7/10 , F16C3/02 , F16C17/02 , F16C17/026 , F16C33/107 , F16C33/14 , F16C2220/20 , F16C2220/62 , F16C2220/82 , F16C2223/40 , F16C2223/42 , F16C2223/44 , F16C2223/60 , F16C2223/70 , G03F7/24 , Y10T29/49639
摘要： The invention provides a method for manufacturing bearing assembly. The method comprises: coating a photoresist on an inner wall of a through hole of a bearing; inserting an ultraviolet lamp having a transparent groove pattern thereon into through hole and performing exposure process so as to photosensitize the photoresist corresponding to the groove pattern; removing the ultraviolet lamp and cleaning the photosensitized portion of the photoresist by developer; etching the inner wall not covered with the photoresist by an etchant or forming a deposited layer on the inner wall not covered with the photoresist; removing the photoresist reminding on the inner wall by a stripping agent so as to complete the method for manufacturing a dynamic bearing. The method is also proved to a surface of a shaft to manufacture the dynamic bearing.
摘要翻译： 本发明提供一种制造轴承组件的方法。 该方法包括：在轴承的通孔的内壁上涂覆光致抗蚀剂; 将其上具有透明凹槽图案的紫外线灯插入通孔并进行曝光处理，以使对应于凹槽图案的光致抗蚀剂光敏化; 去除紫外线灯并用显影剂清洗光致抗蚀剂的光敏部分; 通过蚀刻剂蚀刻未被光致抗蚀剂覆盖的内壁，或者在未被光致抗蚀剂覆盖的内壁上形成沉积层; 通过剥离剂除去内壁上的光致抗蚀剂，从而完成动态轴承的制造方法。 该方法也被证明是用于制造动态轴承的轴的表面。
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