公开(公告)号：US08017962B2

公开(公告)日：2011-09-13

申请号：US12193271

申请日：2008-08-18

申请人： Shih-Peng Chen ,  Chia-Hua Chan ,  Horng-Jou Wang ,  Ching-Liang Lin ,  Chii-Chang Chen ,  Cheng-Yi Liu ,  Huang-Kun Chen

发明人： Shih-Peng Chen ,  Chia-Hua Chan ,  Horng-Jou Wang ,  Ching-Liang Lin ,  Chii-Chang Chen ,  Cheng-Yi Liu ,  Huang-Kun Chen

IPC分类号： H01L33/60

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/405 ,  H01L2933/0091

摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

摘要翻译： 发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩散层和微型或纳米粗糙结构。 导热粘合剂层设置在导热基板上。 外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。 电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。 微结构或纳米粗糙结构设置在外延层的第一半导体层上。 此外，还公开了一种LED装置的制造方法。

公开(公告)号：US20080179614A1

公开(公告)日：2008-07-31

申请号：US11945902

申请日：2007-11-27

申请人： Horng-Jou Wang ,  Chi-Hung Kao ,  Huang-Kun Chen

发明人： Horng-Jou Wang ,  Chi-Hung Kao ,  Huang-Kun Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L33/44 ,  H01L33/64 ,  H01L2933/0091

摘要： A light-emitting diode (LED) package includes a thermal-conducting substrate, a LED element, a package body, and an optical modulation device. The LED element is formed on the thermal-conducting substrate. The package body is formed on the LED element and the thermal-conducting substrate, and the optical modulation device is disposed on a light outputting surface of the package body and has a plurality of stepped protrusions for adjusting a shape of an optical field of the light beam. The optical modulation device and the package body can be two separate components and be connected together, or the optical modulation device and the package body can be integrally formed as a single piece when they are made. In addition, a manufacturing method of the LED package is also disclosed.

摘要翻译： 发光二极管（LED）封装包括导热基板，LED元件，封装体和光调制装置。 LED元件形成在导热基板上。 封装体形成在LED元件和导热基板上，光调制装置设置在封装体的光输出面上，并且具有多个阶梯状突起，用于调整光的光场的形状 光束。 光调制装置和封装体可以是两个分离的部件并连接在一起，或者当制造光调制装置和封装主体时可以一体地形成为单件。 此外，还公开了LED封装的制造方法。

公开(公告)号：US20070056712A1

公开(公告)日：2007-03-15

申请号：US11491896

申请日：2006-07-25

申请人： Min-Hui Yu ,  Horng-Jou Wang ,  Chi-Feng Lin ,  Chin-Ming Chen

发明人： Min-Hui Yu ,  Horng-Jou Wang ,  Chi-Feng Lin ,  Chin-Ming Chen

IPC分类号： F28D15/00

CPC分类号： F28D15/0233 ,  F28D15/046 ,  F28F3/048 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The bottom portion has an uneven surface facing the accommodating space. The wick is disposed over the uneven surface of the bottom portion and the working fluid is filled within the casing.

摘要翻译： 散热模块包括热管和至少一个翅片，其连接并设置在热管的外表面上。 热管包括壳体，芯和工作流体。 壳体具有容纳空间和底部。 底部具有面向容纳空间的不平坦表面。 芯体设置在底部的不平坦表面上，并且工作流体填充在壳体内。

公开(公告)号：US20060144565A1

公开(公告)日：2006-07-06

申请号：US11315244

申请日：2005-12-23

申请人： Hsin-Chang Tsai ,  Horng-Jou Wang ,  Darren Chen ,  Tai-Kang Shing

发明人： Hsin-Chang Tsai ,  Horng-Jou Wang ,  Darren Chen ,  Tai-Kang Shing

IPC分类号： H05K7/20 ,  F28D15/02

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/0266 ,  F28F2210/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.

摘要翻译： 本发明涉及一种散热装置，其特征在于，具有：具有散热路径的壳体，回流路径，第一连结路径，以及工作流体在其中循环的第二连杆路径。 散热路径和回流路径分别位于不同的高度水平。 工作液不会更容易产生紊流。 降低散热效率将得到改善。 并且工作流体不需要限制覆盖液体状态和气态两者。

公开(公告)号：US20060081360A1

公开(公告)日：2006-04-20

申请号：US11065438

申请日：2005-02-25

申请人： Yency Chen ,  Chi-Feng Lin ,  Chin-Ming Chen ,  Hsin-Chang Tsai ,  Horng-Jou Wang

发明人： Yency Chen ,  Chi-Feng Lin ,  Chin-Ming Chen ,  Hsin-Chang Tsai ,  Horng-Jou Wang

IPC分类号： F28D15/00

CPC分类号： F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.

摘要翻译： 散热装置。 散热装置包括室，工作流体，蒸发部和冷凝部。 该腔室具有内壁，工作流体密封在腔室中。 蒸发部分和冷凝部分位于内壁。 第一凹槽设置在内壁上并连接到蒸发部分和冷凝部分。 当从热源吸收热量时，工作流体在蒸发部分被蒸发并冷凝成液相并释放在冷凝部分处的热量，并且第一凹槽提供毛细管力以将工作流体从冷凝部分驱回到 蒸发段。

公开(公告)号：US20110300650A1

公开(公告)日：2011-12-08

申请号：US13207889

申请日：2011-08-11

申请人： Shih-Peng Chen ,  Chia-Hua Chan ,  Horng-Jou Wang ,  Ching-Liang Lin ,  Chii-Chang Chen ,  Cheng-Yi Liu ,  Huang-Kun Chen

发明人： Shih-Peng Chen ,  Chia-Hua Chan ,  Horng-Jou Wang ,  Ching-Liang Lin ,  Chii-Chang Chen ,  Cheng-Yi Liu ,  Huang-Kun Chen

IPC分类号： H01L33/60

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/405 ,  H01L2933/0091

摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

摘要翻译： 发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩散层和微型或纳米粗糙结构。 导热粘合剂层设置在导热基板上。 外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。 电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。 微结构或纳米粗糙结构设置在外延层的第一半导体层上。 此外，还公开了一种LED装置的制造方法。

公开(公告)号：US07989904B2

公开(公告)日：2011-08-02

申请号：US12016889

申请日：2008-01-18

申请人： Cheng-Chang Lee ,  Horng-Jou Wang ,  Zong-Ting Yuan ,  Chao-Jui Liang ,  Hsieh-Shen Hsieh ,  Huang-Kun Chen ,  Tai-Kang Shing

发明人： Cheng-Chang Lee ,  Horng-Jou Wang ,  Zong-Ting Yuan ,  Chao-Jui Liang ,  Hsieh-Shen Hsieh ,  Huang-Kun Chen ,  Tai-Kang Shing

IPC分类号： H01L27/14

CPC分类号： B81C1/0019

摘要： A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.

摘要翻译： 微机电器件包括衬底，第一图案化导电层，第二图案化导电层和第一图案化阻挡层。 第一图案化导电层设置在基板上。 第二图案化导电层设置在第一图案化导电层上。 第一图案化阻挡层与第一图案化导电层和第二图案化导电层连接。 此外，还公开了一种制造微机电装置的方法。

公开(公告)号：US20080296598A1

公开(公告)日：2008-12-04

申请号：US12029985

申请日：2008-02-12

申请人： Horng-Jou WANG ,  Ching-Chuan Shiue ,  Shih-Peng Chen ,  Chao-Min Chen ,  Huang-Kun Chen

发明人： Horng-Jou WANG ,  Ching-Chuan Shiue ,  Shih-Peng Chen ,  Chao-Min Chen ,  Huang-Kun Chen

IPC分类号： H01L33/00

CPC分类号： H01L33/44 ,  H01L33/22 ,  H01L33/42 ,  H01L33/64 ,  H01L2933/0091

摘要： A light-emitting diode (LED) apparatus includes an epitaxial layer and a current spreading layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed on the first semiconductor layer of the epitaxial layer and has a micro/nano roughing structure layer and a transparent conductive layer. The micro/nano roughing structure layer has a plurality of hollow parts, and the transparent conductive layer covers a surface of the micro/nano roughing structure layer and is filled within the hollow parts. In addition, a manufacturing method of the LED apparatus and a current spreading layer with a micro/nano structure are also disclosed.

摘要翻译： 发光二极管（LED）装置包括外延层和电流扩展层。 外延层具有第一半导体层，有源层和第二半导体层。 电流扩散层设置在外延层的第一半导体层上，并具有微/纳粗粗化结构层和透明导电层。 微/纳米粗加工结构层具有多个中空部分，透明导电层覆盖微/纳粗粗化结构层的表面，并填充在中空部分内。 此外，还公开了LED装置的制造方法和具有微/纳米结构的电流扩展层。

公开(公告)号：US20070144258A1

公开(公告)日：2007-06-28

申请号：US11591617

申请日：2006-11-02

申请人： Chia-Yi Chu ,  Heng-Chung Chang ,  Chuan-Wei Wang ,  Chih-Ming Sun ,  Wei-Leun Fang ,  Shiang-Cheng Lu ,  Hsieh-Shen Hsieh ,  Horng-Jou Wang ,  Tai-Kang Shing ,  Huang-Kun Chen

发明人： Chia-Yi Chu ,  Heng-Chung Chang ,  Chuan-Wei Wang ,  Chih-Ming Sun ,  Wei-Leun Fang ,  Shiang-Cheng Lu ,  Hsieh-Shen Hsieh ,  Horng-Jou Wang ,  Tai-Kang Shing ,  Huang-Kun Chen

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P2015/0814

摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

摘要翻译： 加速度计包括固定单元和可移动单元。 固定单元具有多个第一电极部分和多个第二电极部分。 可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。 第三电极部分分别相对于第一电极部分设置在主体的外侧。 第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。

公开(公告)号：US20130285087A1

公开(公告)日：2013-10-31

申请号：US13530859

申请日：2012-06-22

申请人： Horng-Jou WANG ,  Shao-Yu Chen ,  Chia-Hua Liu

发明人： Horng-Jou WANG ,  Shao-Yu Chen ,  Chia-Hua Liu

IPC分类号： H01L33/50 ,  H01L33/60

CPC分类号： H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0041

摘要： A light emitting device and manufacturing method thereof are disclosed. The light emitting device includes a substrate, a LED die, a first transparent layer, an optical wavelength conversion layer and a second transparent layer. The substrate has a die glue part. The LED die is disposed on the die glue part and has a base which is made of a transparent material. The first transparent layer is disposed on the side surface of the LED die. The optical wavelength conversion layer is evenly formed on the first transparent layer and the LED die. The second transparent layer is formed on the optical wavelength conversion layer.

摘要翻译： 公开了一种发光器件及其制造方法。 发光器件包括基板，LED管芯，第一透明层，光波长转换层和第二透明层。 基板具有模具胶部分。 LED模具设置在模具胶部分上，并且具有由透明材料制成的基部。 第一透明层设置在LED管芯的侧表面上。 光波长转换层均匀地形成在第一透明层和LED管芯上。 第二透明层形成在光波长转换层上。