公开(公告)号：US08729586B2

公开(公告)日：2014-05-20

申请号：US13558557

申请日：2012-07-26

Applicant: Chia-Hao Wu ,  Chen-Hsiu Lin ,  Ming-Kun Weng ,  Yi-Chien Chang

Inventor： Chia-Hao Wu ,  Chen-Hsiu Lin ,  Ming-Kun Weng ,  Yi-Chien Chang

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.

Abstract translation: 发光二极管装置包括：基板; 上金属膜，其设置在所述基板的上表面上，并且包括芯片安装区域和多个导电焊盘区域; 两个第一发光芯片和设置在芯片安装区域上的两个第二发光芯片，第一和第二发光芯片交替布置，第一和第二发光芯片中的两个彼此相对; 涂覆在第一发光芯片上的荧光层; 以及设置在基板上以覆盖第一和第二发光芯片和荧光层的透镜。

公开(公告)号：US08256930B2

公开(公告)日：2012-09-04

申请号：US12689399

申请日：2010-01-19

Applicant: Shun-Chung Cheng ,  Hsiu-Tsu Wang ,  Chih-Lung Liang ,  Chia-Hao Wu

Inventor： Shun-Chung Cheng ,  Hsiu-Tsu Wang ,  Chih-Lung Liang ,  Chia-Hao Wu

IPC: F21V9/00

CPC classification number: G02B6/0091 ,  G02B6/0031 ,  G02B6/009 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips.

Abstract translation: 发光二极管模块包括透明基座，支架和多个发光芯片。 底座具有彼此分开预定距离的多个空腔，以便分别接收发光芯片以形成光出射区域。 底座具有与空腔相对的反射部分。 反射部分是至少一个倾斜平面，用于将具有突出的空腔外壁的光反射到发光区域的周边区域，以便增加光源的均匀性。 此外，通过调整空腔和发光芯片的数量，发光芯片被布置成形成任何尺寸的线或面光源。

公开(公告)号：US08063411B2

公开(公告)日：2011-11-22

申请号：US12849491

申请日：2010-08-03

Applicant: Chia-Hao Wu ,  Hung-Yuan Su

Inventor： Chia-Hao Wu ,  Hung-Yuan Su

IPC: H01L29/74

CPC classification number: H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0091

Abstract: A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency.

Abstract translation: 在LED芯片上覆盖透明层和荧光体层，以提高LED的发光效率和均匀性。 基于LED芯片的角度依赖性发射强度，荧光体层设计成不同的厚度或不同部分含有不同的荧光粉浓度。 从LED芯片的不同角度发出的不同强度的光在通过具有不同厚度或荧光粉浓度的荧光体层后，转变为均匀的复合光。 在荧光体层的内表面和外表面上进一步配置能够破坏入射光全反射的微结构，以提高发光效率。

公开(公告)号：US07888698B2

公开(公告)日：2011-02-15

申请号：US12401620

申请日：2009-03-11

Applicant: Chia-Hao Wu ,  Hung-Yuan Su

Inventor： Chia-Hao Wu ,  Hung-Yuan Su

IPC: H01L29/74

CPC classification number: H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0091

Abstract: A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency.

公开(公告)号：US20100237360A1

公开(公告)日：2010-09-23

申请号：US12503852

申请日：2009-07-16

Applicant: Chih-Chiang Kao ,  Meng-Sung Chou ,  Hsu-Tsu Wang ,  Chen-Hsiu Lin ,  Chia-Hao Wu

Inventor： Chih-Chiang Kao ,  Meng-Sung Chou ,  Hsu-Tsu Wang ,  Chen-Hsiu Lin ,  Chia-Hao Wu

IPC: H01L33/00

CPC classification number: H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B27/0955 ,  G02F1/133603 ,  H01L33/483 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode (LED) includes an LED chip, a substrate structure, a fluorescence layer, and a lens. The substrate structure includes a cavity. The fluorescence layer covers on the LED chip and is configured in the cavity and covering the LED chip. The lens is installed on the substrate structure. The lens includes a curved lateral wall, a plane at the top, and a conical concave portion at the top center.

Abstract translation: 发光二极管（LED）包括LED芯片，衬底结构，荧光层和透镜。 衬底结构包括空腔。 荧光层覆盖在LED芯片上，并配置在空腔中并覆盖LED芯片。 透镜安装在基板结构上。 透镜包括弯曲的侧壁，顶部的平面和顶部中心的锥形凹部。

公开(公告)号：US5960509A

公开(公告)日：1999-10-05

申请号：US25573

申请日：1998-02-18

Applicant: Chia-Hao Wu

Inventor： Chia-Hao Wu

IPC: A45D34/04 ,  A46B17/02 ,  A47K7/02 ,  A61H15/00

CPC classification number: A45D34/04 ,  A46B17/02 ,  A45D2200/1018 ,  A45D2200/1081 ,  Y10T403/32319 ,  Y10T403/32336

Abstract: A multi-functional back brush includes a brush head having an upper portion provided with a strap, a front end formed with a first opening, a rear end formed with a second opening, an adjustable shaft having a first end engageable with the first and second openings of the brush head, an axle fitted through the center through hole of the adjustable shaft and having an end provided with a disk formed with a plurality of teeth engaged with a circular toothed recess of the adjustable shaft, a handle having a circular end engaged with the second end of the adjustable shaft, a toothed rack mounted on a bottom of the handle, an adjusting block movably engaged with the toothed rack, a T-shaped member fixedly mounted on the circular end of the handle and having a resilient blade engaged with radial partitions of adjustable shaft, a spring fitted within the circular end of the handle, an actuator arranged within the circular end of the handle, a cap threadedly engaged with the circular end of the handle, and a pushbutton fitted within the cap, whereby the brush head can be conveniently adjusted in angular position as desired.

Abstract translation: 一种多功能后刷，包括具有设置有带的上部的刷头，具有第一开口的前端，形成有第二开口的后端，具有可与第一和第二开口接合的第一端的可调节轴 刷头的开口，通过可调节轴的中心通孔安装的轴，并且具有端部，该端部设置有与可调节轴的圆形齿形凹部啮合的多个齿形成的盘，具有圆形端部接合的手柄 可调节轴的第二端，安装在手柄的底部上的齿条，与齿条可移动地接合的调节块，固定地安装在手柄的圆形端上并具有接合的弹性叶片的T形构件 具有可调节轴的径向隔板，安装在手柄的圆形端部内的弹簧，布置在手柄的圆形端部内的致动器，与螺旋形的端部螺纹接合的帽 e手柄和安装在盖内的按钮，由此可以根据需要方便地在角位置调节刷头。

公开(公告)号：US08216864B2

公开(公告)日：2012-07-10

申请号：US12649585

申请日：2009-12-30

Applicant: Chia-Hao Wu ,  Tien-Yu Lee

Inventor： Chia-Hao Wu ,  Tien-Yu Lee

IPC: H01L21/00

CPC classification number: H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A LED device includes a base structure having a receiving space, a light-emitting chip, an encapsulating structure, and a phosphor layer. The receiving space is defined by an inner bottom surface of the base structure and an inner side wall surrounding the inner bottom surface. The light-emitting chip is mounted on the bottom of the receiving space. The encapsulating structure is filled into the receiving space to cover the light-emitting chip. The phosphor layer is formed on the encapsulating structure. The dimension of the phosphor layer is more than the dimension of the receiving space and less than 1.5 times that of the receiving space, so as to mount on the top surface of the base structure.

Abstract translation: LED器件包括具有接收空间的基底结构，发光芯片，封装结构和荧光体层。 接收空间由基底结构的内底表面和围绕内底表面的内侧壁限定。 发光芯片安装在接收空间的底部。 将封装结构填充到容纳空间中以覆盖发光芯片。 磷光体层形成在封装结构上。 荧光体层的尺寸大于接收空间的尺寸，小于接收空间的1.5倍，以便安装在基底结构的顶表面上。

公开(公告)号：US20100308346A1

公开(公告)日：2010-12-09

申请号：US12689399

申请日：2010-01-19

Applicant: Shun-Chung CHENG ,  Hsiu-Tsu Wang ,  Chih-Lung Liang ,  Chia-Hao Wu

Inventor： Shun-Chung CHENG ,  Hsiu-Tsu Wang ,  Chih-Lung Liang ,  Chia-Hao Wu

IPC: H01L33/00

CPC classification number: G02B6/0091 ,  G02B6/0031 ,  G02B6/009 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode module includes a transparent base, a support and a plurality of light-emitting chips. The base has a plurality of cavities separated from each other by a predetermined distance in order to respectively receive the light-emitting chips to form light-exiting areas. The base has a reflecting portion opposite to the cavities. The reflecting portion is at least one inclined plane for reflecting light that have projected outside walls of the cavities to the peripheral area of the light-emitting areas in order to increase the uniformity of the light source. In addition, the light-emitting chips are arranged to form a line or surface light source of any sizes by adjusting the numbers of the cavity and the light-emitting chips.

Abstract translation: 发光二极管模块包括透明基座，支架和多个发光芯片。 底座具有彼此分开预定距离的多个空腔，以便分别接收发光芯片以形成光出射区域。 底座具有与空腔相对的反射部分。 反射部分是至少一个倾斜平面，用于将具有突出的空腔外壁的光反射到发光区域的周边区域，以便增加光源的均匀性。 此外，通过调整空腔和发光芯片的数量，发光芯片被布置成形成任何尺寸的线或面光源。

公开(公告)号：US20100301370A1

公开(公告)日：2010-12-02

申请号：US12849491

申请日：2010-08-03

Applicant: Chia-Hao Wu ,  Hung-Yuan Su

Inventor： Chia-Hao Wu ,  Hung-Yuan Su

IPC: H01L33/50

CPC classification number: H01L33/508 ,  H01L33/507 ,  H01L33/54 ,  H01L2933/0091

Abstract: A transparent layer and a phosphor layer are covered on the LED chip for increasing light emission efficiency and evenness of the LED. Based on angle-dependent emission strength of the LED chip, the phosphor layer is designed with different thickness or contains different phosphor powder concentration in different section. The lights emitted with different strength from different angle of the LED chip are transformed into uniform compound lights after passing through the phosphor layer that has different thickness or phosphor powder concentration. Micro structures capable of destroying the full reflection occurred on the incident lights are further configured on both the inner and outer surfaces of the phosphor layer to increase the light emission efficiency.

Abstract translation: 在LED芯片上覆盖透明层和荧光体层，以提高LED的发光效率和均匀性。 基于LED芯片的角度依赖性发射强度，荧光体层设计成不同的厚度或不同部分含有不同的荧光粉浓度。 从LED芯片的不同角度发出的不同强度的光在通过具有不同厚度或荧光粉浓度的荧光体层后，转变为均匀的复合光。 在荧光体层的内表面和外表面上进一步配置能够破坏入射光全反射的微结构，以提高发光效率。

公开(公告)号：USD619110S1

公开(公告)日：2010-07-06

申请号：US29350629

申请日：2009-11-20

Applicant: Chen-Hsiu Lin ,  Tai-Wen Tsai ,  Chia-Hao Wu

Designer： Chen-Hsiu Lin ,  Tai-Wen Tsai ,  Chia-Hao Wu