公开(公告)号：US09768223B2

公开(公告)日：2017-09-19

申请号：US13333899

申请日：2011-12-21

申请人： Chia-Sheng Lin ,  Yu-Ting Huang

发明人： Chia-Sheng Lin ,  Yu-Ting Huang

IPC分类号： H01L31/18 ,  H01L27/146 ,  H01L23/00

CPC分类号： H01L27/14683 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13101 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/014

摘要： Embodiments provide a chip device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick. A bonding wire is electrically connected to the bonding pad.

公开(公告)号：US20130161778A1

公开(公告)日：2013-06-27

申请号：US13333899

申请日：2011-12-21

申请人： Chia-Sheng Lin ,  Yu-Ting Huang

发明人： Chia-Sheng Lin ,  Yu-Ting Huang

IPC分类号： H01L31/02 ,  H01L31/18

CPC分类号： H01L27/14683 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13101 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/014

摘要： Embodiments provide a chip device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick. A bonding wire is electrically connected to the bonding pad.

摘要翻译： 实施例提供一种芯片器件封装及其制造方法。 半导体芯片具有基板。 支撑砖与衬底分离一定距离。 具有表面的焊盘横跨衬底和支撑砖设置。 接合线电连接到接合焊盘。

公开(公告)号：US08097929B2

公开(公告)日：2012-01-17

申请号：US12398946

申请日：2009-03-05

申请人： Chia-Sheng Lin ,  Yu-Ting Huang ,  Chih-Lung Lai

发明人： Chia-Sheng Lin ,  Yu-Ting Huang ,  Chih-Lung Lai

IPC分类号： H01L23/52

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05548 ,  H01L2224/11

摘要： Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.

摘要翻译： 实施例提供一种电子器件封装及其制造方法。 半导体芯片具有基板。 支撑砖与衬底分离一定距离。 具有表面的焊盘横跨衬底和支撑砖设置。

公开(公告)号：US20090289318A1

公开(公告)日：2009-11-26

申请号：US12398946

申请日：2009-03-05

申请人： Chia-Sheng Lin ,  Yu-Ting Huang ,  Chih-Lung Lai

发明人： Chia-Sheng Lin ,  Yu-Ting Huang ,  Chih-Lung Lai

IPC分类号： H01L23/52 ,  H01L21/00 ,  H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05548 ,  H01L2224/11

摘要： Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.

摘要翻译： 实施例提供一种电子器件封装及其制造方法。 半导体芯片具有基板。 支撑砖与衬底分离一定距离。 具有表面的焊盘横跨衬底和支撑砖设置。

公开(公告)号：USD895870S1

公开(公告)日：2020-09-08

申请号：US29683216

申请日：2019-03-12

申请人： Yu-Ting Huang

设计人： Yu-Ting Huang

公开(公告)号：US08993342B2

公开(公告)日：2015-03-31

申请号：US13159361

申请日：2011-06-13

申请人： Mean-Jue Tung ,  Yu-Ting Huang ,  Li-Kou Chen ,  Yi-Shan Lin ,  Hsiang-Ming Huang ,  Shinn-Zong Lin ,  Woei-Cherng Shyu ,  Hsiao-Jung Wang

发明人： Mean-Jue Tung ,  Yu-Ting Huang ,  Li-Kou Chen ,  Yi-Shan Lin ,  Hsiang-Ming Huang ,  Shinn-Zong Lin ,  Woei-Cherng Shyu ,  Hsiao-Jung Wang

IPC分类号： B03C1/00 ,  G01N1/34 ,  B03C1/28 ,  B03C1/033 ,  G01N33/00

CPC分类号： B03C1/288 ,  B03C1/0332 ,  B03C2201/18 ,  B03C2201/26 ,  G01N33/0098 ,  Y10T436/25 ,  Y10T436/25375 ,  Y10T436/255

摘要： A magnetic separation unit is provided, including a first member made of non-magnetic materials comprising a trench extending within the first member and a second member made of magnetic materials including a protrusion portion protruding over a surface of the second member, wherein the first member connects the second member such that the trench functions as a fluid channel formed between the first and second members, and the protrusion portion of the second member is contained by the trench of the first member.

摘要翻译： 提供一种磁分离单元，包括由非磁性材料制成的第一构件，该第一构件包括在第一构件内延伸的沟槽和由包括突出部分在第二构件的表面上突出的磁性材料制成的第二构件，其中第一构件 连接第二构件，使得沟槽用作形成在第一和第二构件之间的流体通道，并且第二构件的突出部分被第一构件的沟槽包围。

公开(公告)号：US08716844B2

公开(公告)日：2014-05-06

申请号：US13416504

申请日：2012-03-09

申请人： Yu-Ting Huang

发明人： Yu-Ting Huang

IPC分类号： H01L23/552

CPC分类号： H01L21/78 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/482 ,  H01L23/552 ,  H01L23/60 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2924/0001 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer.

摘要翻译： 芯片封装包括：基板; 信号焊盘和设置在所述基板上的接地焊盘; 第一导电层和第二导电层，其分别设置在所述基板上并电连接到所述信号焊盘和所述接地焊盘，其中所述第一和第二导电层沿着所述第一和第二导电层从所述基板的上表面延伸到所述基板的下表面 第一和第二侧面分别与第一和第二导电层从下表面突出; 以及设置在所述基板上的保护层，其中所述保护层完全覆盖位于所述基板的所述第一侧表面上的所述第一导电层的整个部分，并且所述第二导电层的位于所述基板的第二侧表面上的整个部分 衬底不被保护层覆盖。

公开(公告)号：USD647495S1

公开(公告)日：2011-10-25

申请号：US29385937

申请日：2011-02-23

申请人： Hsiang-Szu Chang ,  Nien-Tze Yeh ,  Kuen-Pu Lu ,  Chia-Hsun Chen ,  Yu-Ting Huang

设计人： Hsiang-Szu Chang ,  Nien-Tze Yeh ,  Kuen-Pu Lu ,  Chia-Hsun Chen ,  Yu-Ting Huang

公开(公告)号：US06384705B1

公开(公告)日：2002-05-07

申请号：US09476432

申请日：1999-12-30

申请人： Yu-Ting Huang ,  Wen-Song Ko ,  Mean-Jue Tung ,  Hong-Ching Lin ,  Li-Jiun Wang

发明人： Yu-Ting Huang ,  Wen-Song Ko ,  Mean-Jue Tung ,  Hong-Ching Lin ,  Li-Jiun Wang

IPC分类号： H01F500

CPC分类号： H01F17/0013 ,  H01F2017/0026 ,  H01F2017/0093 ,  H03H7/427 ,  H03H2001/0085

摘要： A miniaturized common mode EMI filter with a greatly simplified design so that it can be manufactured very economically. The common mode filter includes: (a) a magnetic main body; (b) a pair of substantially identical electrically conductive planar coils embedded in the magnetic main body; and (c) an insulative planar coil sandwiched between the pair of electrically conductive planar coils, wherein the insulative planar coil has a pattern that is substantially identical to and inclusive of the pattern of the electrically conductive planar coils so as to insulate the pair of electrically conductive planar coil from each other. The common mode filter retains low normal mode impedance and high common mode impedance, with a substantially reduced physical size, so that it can cost-effectively maintain a high fidelity of the normal mode waveform of signals for electronic devices that utilize differential transmission technology and keep the common mode EMI noise to a minimum.

摘要翻译： 一种小型化的共模EMI滤波器，其设计大大简化，可以非常经济地制造。 共模滤波器包括：（a）磁性主体; （b）嵌入在磁性主体中的一对基本相同的导电平面线圈; 和（c）夹在所述一对导电平面线圈之间的绝缘平面线圈，其中所述绝缘平面线圈具有与所述导电平面线圈的图案基本相同并且包括所述导电平面线圈的图案的图案，以使所述一对电气 导电平面线圈彼此。 共模滤波器保持低正常模式阻抗和高共模阻抗，物理尺寸大大降低，从而可以以低成本的方式保持利用差分传输技术的电子设备信号的正常模式波形的高保真度并保持 将共模EMI噪声降至最低。

公开(公告)号：USD858834S1

公开(公告)日：2019-09-03

申请号：US29594774

申请日：2017-02-22

申请人： Yu-Ting Huang

设计人： Yu-Ting Huang