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公开(公告)号：US20070164386A1
公开(公告)日：2007-07-19
申请号：US11648045
申请日：2006-12-28
IPC分类号： H01L31/0203 , H01L21/56
CPC分类号： H01L27/14687 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.
摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。
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公开(公告)号：US20060267125A1
公开(公告)日：2006-11-30
申请号：US11162135
申请日：2005-08-30
IPC分类号： H01L29/84
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/24226
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。
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公开(公告)号：US07271024B2
公开(公告)日：2007-09-18
申请号：US11163310
申请日：2005-10-13
IPC分类号： H01L21/00 , H01L31/113
CPC分类号： H01L27/14683 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14634 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/14 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 多个金属凸块和传感器芯片安装在基板上。 在基板上形成电介质层和电路层，其中电路层电连接到金属凸块和传感器芯片。 因此，传感器芯片经由电路层和金属凸块电连接到基板。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 多个焊球安装在基板的表面上，无需安装传感器芯片，用于将传感器芯片电连接到外部设备。
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4.发明授权Sensor semiconductor device and fabrication method of the sensor semiconductor device 有权传感器半导体器件及传感器半导体器件的制造方法公开(公告)号：US07446307B2
公开(公告)日：2008-11-04
申请号：US11373723
申请日：2006-03-10
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14632 , H01L27/14687 , H01L2224/24225 , H01L2224/97 , H01L2224/82
摘要： A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.
摘要翻译： 提供了一种传感器半导体器件及其制造方法。 制造方法包括将传感器芯片安装在基板的表面上; 在传感器芯片上形成透明盖; 在基板上形成电介质层和电路层，其中传感器芯片通过电路层与基板电连接，透明盖从电介质层露出，使得光可透过透明盖到达传感器区域 的传感器芯片，并允许传感器芯片工作; 以及在所述基板的另一表面上植入多个焊球，以将所述传感器芯片电连接到外部设备。 可以成本有效地制造传感器半导体器件，并且可以避免现有技术的电路破裂和已知的良好裸片（KGD）问题。
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5.发明申请公开(公告)号：US20080166831A1
公开(公告)日：2008-07-10
申请号：US12048079
申请日：2008-03-13
IPC分类号： H01L31/18
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/24226
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。
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公开(公告)号：US20070272994A1
公开(公告)日：2007-11-29
申请号：US11838723
申请日：2007-08-14
IPC分类号： H01L31/0203
CPC分类号： H01L27/14683 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14634 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/14 , H01L2924/00
摘要： A sensor semiconductor device is proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.
摘要翻译： 提出了一种传感器半导体器件。 多个金属凸块和传感器芯片安装在基板上。 在基板上形成电介质层和电路层，其中电路层电连接到金属凸块和传感器芯片。 因此，传感器芯片经由电路层和金属凸块电连接到基板。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 多个焊球安装在基板的表面上，无需安装传感器芯片，用于将传感器芯片电连接到外部设备。
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公开(公告)号：US20060223216A1
公开(公告)日：2006-10-05
申请号：US11208269
申请日：2005-08-18
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L27/14618 , H01L24/97 , H01L25/167 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
摘要翻译： 提出了一种传感器模块结构及其制造方法。 提供了包括多个芯片载体的芯片载体模块板，每个芯片载体具有第一表面和第二表面。 至少一个半导体芯片安装在每个芯片载体的第一表面上并电连接到每个芯片载体的第一表面。 形成用于完全封装半导体芯片和芯片载体的第一表面的封装体。 执行单个处理以形成与半导体芯片集成的单个封装单元。 传感器芯片，相应的透镜套件和柔性印刷电路板（FPC）板安装在每个芯片载体的第二表面上，其中传感器芯片和FPC基板电连接到芯片载体。 这提供了以简单的工艺制造的传感器模块结构，低成本和高产量。
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公开(公告)号：US20060270089A1
公开(公告)日：2006-11-30
申请号：US11163310
申请日：2005-10-13
IPC分类号： H01L21/00
CPC分类号： H01L27/14683 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L24/81 , H01L24/82 , H01L24/97 , H01L27/14618 , H01L27/14634 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/14 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 多个金属凸块和传感器芯片安装在基板上。 在基板上形成电介质层和电路层，其中电路层电连接到金属凸块和传感器芯片。 因此，传感器芯片经由电路层和金属凸块电连接到基板。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 多个焊球安装在基板的表面上，无需安装传感器芯片，用于将传感器芯片电连接到外部设备。
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公开(公告)号：US07365364B2
公开(公告)日：2008-04-29
申请号：US11162135
申请日：2005-08-30
IPC分类号： H01L29/267 , H01L29/22
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/24226
摘要： A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.
摘要翻译： 提出了一种传感器半导体器件及其制造方法。 传感器芯片安装在基板上，并且在基板上形成电介质层和电路层，其中电路层电连接到基板和传感器芯片。 电介质层形成有用于暴露传感器芯片的传感器区域的开口。 透光盖子覆盖电介质层的开口，使得光线能够穿透透光盖子到达传感器区域并激活传感器芯片。 传感器芯片可以通过植入在基板的表面上的多个焊球电连接到外部设备，而不用于安装传感器芯片。 因此，传感器半导体器件以成本有效的方式制造，并且防止了电路破裂和知道的裸芯片（KGD）问题。
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公开(公告)号：US20070278701A1
公开(公告)日：2007-12-06
申请号：US11591800
申请日：2006-11-01
IPC分类号： H01L23/28
CPC分类号： H01L21/561 , H01L21/481 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.
摘要翻译： 公开了一种半导体封装及其制造方法。 该方法包括在芯片载体模块的多个芯片载体上安装多个导电组件，将导电组件电连接到相邻芯片载体的电连接点，将半导体芯片安装并电连接到每个芯片载体， 形成用于包封半导体芯片和导电部件的密封剂，切割芯片载体以分离安装在其上的导电组件，将一部分导电组分暴露于密封剂外，在导电组件的暴露部分上形成电镀层 镍/金，并且将芯片载体彼此分离。 从密封剂露出的导电组件提供额外的电连接点，从而促进电子产品的功能。
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