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120 条记录 (耗时 0.034 秒)

    Semiconductor device and fabrication method thereof
    1.
    发明申请
    Semiconductor device and fabrication method thereof 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20070164386A1

    公开(公告)日：2007-07-19

    申请号：US11648045

    申请日：2006-12-28

    申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/56

    CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

    摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

    摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

    Heat dissipation unit and a semiconductor package that has the heat dissipation unit
    7.
    发明申请
    Heat dissipation unit and a semiconductor package that has the heat dissipation unit 审中-公开
    散热单元和具有散热单元的半导体封装

    公开(公告)号：US20080246142A1

    公开(公告)日：2008-10-09

    申请号：US12080798

    申请日：2008-04-04

    申请人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    发明人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/367

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.

    摘要翻译： 公开了一种散热单元和具有该散热单元的半导体封装。 半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起 从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。

    Sensor module structure and method for fabricating the same
    9.
    发明申请
    Sensor module structure and method for fabricating the same 审中-公开
    传感器模块结构及其制造方法

    公开(公告)号：US20060223216A1

    公开(公告)日：2006-10-05

    申请号：US11208269

    申请日：2005-08-18

    申请人： Chin-Huang Chang ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang ,  Cheng-Hsu Hsiao

    发明人： Chin-Huang Chang ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Cheng-Yi Chang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/00 ,  H01L23/495

    CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L25/167 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.

    摘要翻译： 提出了一种传感器模块结构及其制造方法。 提供了包括多个芯片载体的芯片载体模块板，每个芯片载体具有第一表面和第二表面。 至少一个半导体芯片安装在每个芯片载体的第一表面上并电连接到每个芯片载体的第一表面。 形成用于完全封装半导体芯片和芯片载体的第一表面的封装体。 执行单个处理以形成与半导体芯片集成的单个封装单元。 传感器芯片，相应的透镜套件和柔性印刷电路板（FPC）板安装在每个芯片载体的第二表面上，其中传感器芯片和FPC基板电连接到芯片载体。 这提供了以简单的工艺制造的传感器模块结构，低成本和高产量。