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公开(公告)号：US20060223216A1
公开(公告)日：2006-10-05
申请号：US11208269
申请日：2005-08-18
IPC分类号： H01L21/00 , H01L23/495
CPC分类号： H01L27/14618 , H01L24/97 , H01L25/167 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.
摘要翻译： 提出了一种传感器模块结构及其制造方法。 提供了包括多个芯片载体的芯片载体模块板，每个芯片载体具有第一表面和第二表面。 至少一个半导体芯片安装在每个芯片载体的第一表面上并电连接到每个芯片载体的第一表面。 形成用于完全封装半导体芯片和芯片载体的第一表面的封装体。 执行单个处理以形成与半导体芯片集成的单个封装单元。 传感器芯片，相应的透镜套件和柔性印刷电路板（FPC）板安装在每个芯片载体的第二表面上，其中传感器芯片和FPC基板电连接到芯片载体。 这提供了以简单的工艺制造的传感器模块结构，低成本和高产量。
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公开(公告)号：US20090057799A1
公开(公告)日：2009-03-05
申请号：US12229651
申请日：2008-08-26
CPC分类号： H01L31/0203 , H01L31/02164 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.
摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。
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公开(公告)号：US20090261476A1
公开(公告)日：2009-10-22
申请号：US12148319
申请日：2008-04-18
IPC分类号： H01L23/482 , H01L21/60
CPC分类号： H01L24/19 , H01L21/6835 , H01L23/3114 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68345 , H01L2224/24226 , H01L2224/82001 , H01L2225/1035 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311
摘要： A semiconductor device and a manufacturing method thereof are disclosed. The method includes the steps of providing a carrier board having conductive circuits disposed thereon and a plurality of chips with active surfaces having solder pads disposed thereon, wherein conductive bumps are disposed on the solder pads; mounting chips on the carrier board; filling the spacing between the chips with a dielectric layer and forming openings in the dielectric layer at periphery of each chip to expose the conductive circuits; forming a metal layer in the openings of the dielectric layer and at periphery of the active surface of the chips for electrically connecting the conductive bumps and the conductive circuits; and cutting along the dielectric layer between the chips and removing the carrier board to separate each chip and exposing the conductive circuits from the non-active surface.
摘要翻译： 公开了一种半导体器件及其制造方法。 该方法包括以下步骤：提供具有布置在其上的导电电路的载体板和具有设置在其上的焊料焊盘的有源表面的多个芯片，其中导电凸块设置在焊盘上; 将芯片安装在载板上; 用电介质层填充芯片之间的间隔，并在每个芯片周边的电介质层中形成开口以露出导电电路; 在所述电介质层的开口部和所述芯片的有源面的外围形成金属层，用于电连接所述导电凸块和所述导电电路; 并沿着芯片之间的电介质层切割并去除载体板以分离每个芯片并使导电电路与非活性表面相接触。
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公开(公告)号：US20060145362A1
公开(公告)日：2006-07-06
申请号：US11207472
申请日：2005-08-18
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/13 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package and a fabrication method of the same are proposed. A chip formed with a plurality of electrode pads on an active surface thereof, and a substrate having a first surface, a corresponding second surface and at least one opening penetrating therethrough are provided. A part of the electrode pads of the chip are electrically connected to the second surface of the substrate by bonding wires passing through the opening of the substrate, and the rest of the electrode pads of the chip are electrically connected to the first surface of the substrate by conductive bumps. A molding process is performed to form a first encapsulant on the first surface of the substrate for encapsulating the chip and form a second encapsulant on the second surface of the substrate for encapsulating the bonding wires. A plurality of solder balls are implanted on the second surface of the substrate.
摘要翻译： 提出了一种半导体封装及其制造方法。 提供了在其有效表面上形成有多个电极焊盘的芯片，以及具有第一表面，相应的第二表面和穿过其中的至少一个开口的基板。 芯片的电极焊盘的一部分通过接合通过基板的开口的线电连接到基板的第二表面，并且芯片的其余电极焊盘与基板的第一表面电连接 通过导电凸块。 进行成型工艺以在衬底的第一表面上形成第一密封剂，用于封装芯片，并在衬底的第二表面上形成用于封装接合线的第二密封剂。 在基板的第二表面上注入多个焊球。
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公开(公告)号：US20080258306A1
公开(公告)日：2008-10-23
申请号：US12105538
申请日：2008-04-18
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L23/3114 , H01L21/6835 , H01L23/3135 , H01L23/3185 , H01L24/24 , H01L24/48 , H01L24/82 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/02371 , H01L2224/04105 , H01L2224/05001 , H01L2224/05008 , H01L2224/05023 , H01L2224/05026 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/12105 , H01L2224/16145 , H01L2224/48091 , H01L2224/82001 , H01L2224/97 , H01L2225/06562 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2224/82 , H01L2924/01028 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a semiconductor device and a method for fabricating the same. The semiconductor device includes a chip having an active surface and an opposing non-active surface, wherein a plurality of bond pads are formed on the active surface, and first metal layers are formed on the bond pads and to edges of the non-active surface; conductive traces disposed on the non-active surface of the chip; a dielectric layer covering sides of the chip and formed with a plurality of openings therein to expose a portion of the conductive traces; and a plurality of second metal layers formed in the openings of the dielectric layer and on the first metal layers, such that the bond pads are electrically connected to the conductive traces via the first and second metal layers.
摘要翻译： 本发明提供一种半导体器件及其制造方法。 半导体器件包括具有活性表面和相对的非活性表面的芯片，其中在有源表面上形成多个接合焊盘，并且第一金属层形成在接合焊盘和非活性表面的边缘上 ; 布置在芯片的非有源表面上的导电迹线; 介电层，其覆盖所述芯片的侧面并在其中形成有多个开口以暴露所述导电迹线的一部分; 以及多个第二金属层，形成在电介质层的开口中和第一金属层上，使得接合焊盘经由第一和第二金属层电连接到导电迹线。
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公开(公告)号：US20080251937A1
公开(公告)日：2008-10-16
申请号：US12082724
申请日：2008-04-11
CPC分类号： H01L21/76898 , H01L25/0657 , H01L2224/48091 , H01L2225/06513 , H01L2225/06551 , H01L2225/06562 , H01L2924/00014
摘要： A stackable semiconductor device and a manufacturing method thereof are disclosed. The method includes providing a wafer comprised of a plurality of chips, wherein a plurality of solder pads are formed on the active surface of each chip, and a plurality of grooves are formed between the solder pads of any two adjacent ones of the chips; forming a dielectric layer on regions between the solder pads of any two adjacent ones of the chips ; forming a metal layer on the dielectric layer electrically connected to the solder pads and forming a connective layer on the metal layer, wherein the width of the connective layer is smaller than that of the metal layer; cutting along the grooves to break off the electrical connection between adjacent chips; thinning the non-active surface of the wafer to the extent that the metal layer is exposed from the wafer; and separating the chips to form a plurality of stackable semiconductor devices. Accordingly, a multi-chip stack structure can be obtained by stacking and electrically connecting a plurality of semiconductor devices through the electrical connection between the connective layer of a semiconductor device and the metal layer of another semiconductor device, thereby effectively integrating more chips without having to increase the stacking area, and further the problems of poor electrical connection, complicated manufacturing processes and high costs known in the prior art can be avoided.
摘要翻译： 公开了一种可堆叠半导体器件及其制造方法。 该方法包括提供由多个芯片组成的晶片，其中在每个芯片的有源表面上形成多个焊盘，并且在任何两个相邻芯片的焊盘之间形成多个沟槽; 在任何两个相邻芯片的焊盘之间的区域上形成电介质层; 在与所述焊料焊盘电连接的所述电介质层上形成金属层，并在所述金属层上形成连接层，其中所述连接层的宽度小于所述金属层的宽度; 沿着凹槽切割以破坏相邻芯片之间的电连接; 使晶片的非活性表面变薄至金属层从晶片露出的程度; 并分离所述芯片以形成多个可堆叠半导体器件。 因此，通过半导体器件的连接层与另一半导体器件的金属层之间的电连接层叠并电连接多个半导体器件，可以获得多芯片堆叠结构，从而有效地集成更多的芯片，而不必 增加堆积面积，进一步避免了现有技术中已知的电连接不良，制造工艺复杂，成本高的问题。
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公开(公告)号：US20070164386A1
公开(公告)日：2007-07-19
申请号：US11648045
申请日：2006-12-28
IPC分类号： H01L31/0203 , H01L21/56
CPC分类号： H01L27/14687 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.
摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。
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公开(公告)号：US20070278701A1
公开(公告)日：2007-12-06
申请号：US11591800
申请日：2006-11-01
IPC分类号： H01L23/28
CPC分类号： H01L21/561 , H01L21/481 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L24/48 , H01L24/97 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.
摘要翻译： 公开了一种半导体封装及其制造方法。 该方法包括在芯片载体模块的多个芯片载体上安装多个导电组件，将导电组件电连接到相邻芯片载体的电连接点，将半导体芯片安装并电连接到每个芯片载体， 形成用于包封半导体芯片和导电部件的密封剂，切割芯片载体以分离安装在其上的导电组件，将一部分导电组分暴露于密封剂外，在导电组件的暴露部分上形成电镀层 镍/金，并且将芯片载体彼此分离。 从密封剂露出的导电组件提供额外的电连接点，从而促进电子产品的功能。
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公开(公告)号：US20070138632A1
公开(公告)日：2007-06-21
申请号：US11642439
申请日：2006-12-19
IPC分类号： H01L23/34
CPC分类号： H05K3/3452 , H05K3/284 , H05K3/303 , H05K2201/0989 , H05K2201/10636 , H05K2201/10727 , H05K2201/2036 , Y02P70/611 , Y02P70/613
摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. An opening is formed in the protective layer to expose at least three sides of each of the paired bond pads. The protective layer includes at least one independent residual portion located in the opening and between the paired bond pads, such that an electronic component is mounted on the independent residual portion and electrically connected to the bond pads. A groove without a dead space is formed between the electronic component and the carrier, such that a molding compound for encapsulating the electronic component can flow through the groove to fill the opening and a space under the electronic component and encapsulate the at least three sides of each of the bond pads.
摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 在保护层中形成开口以暴露每个配对接合焊盘的至少三个侧面。 保护层包括至少一个独立的残留部分，位于开口内和成对的接合焊盘之间，使得电子部件安装在独立的残留部分上并电连接到接合焊盘。 在电子部件和载体之间形成没有死空间的凹槽，使得用于封装电子部件的模制化合物可以流过凹槽以填充开口和电子部件下方的空间，并将至少三个侧面 每个接合垫。
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10.发明申请公开(公告)号：US20080088011A1
公开(公告)日：2008-04-17
申请号：US11974441
申请日：2007-10-12
申请人： Han-Ping Hu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
发明人： Han-Ping Hu , Chien-Ping Huang , Chih-Ming Huang , Yu-Po Wang , Cheng-Hsu Hsiao
CPC分类号： H01L21/568 , H01L23/3128 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01079 , H01L2924/15192 , H01L2924/15311 , H01L2924/16151 , H01L2924/16195 , H01L2924/18161 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package on which a semiconductor device can be stacked and fabrication method thereof are provided. The fabrication method includes the steps of mounting and electrically connecting at least one semiconductor chip on the substrate, mounting an electrical connecting structure consisting of an upper layer circuit board and a lower layer circuit board on the substrate and electrically connecting the electrical connecting structure to the substrate, where the semiconductor chip is received in a receiving space formed in the electrical connecting structure; forming an encapsulant on the substrate encapsulating the semiconductor chip and the electrical connecting structure, and after the encapsulant is formed, exposing top surface of the upper layer circuit board with a plurality of solder pads from the encapsulant to allow at least one semiconductor device to electrically connect the upper layer circuit board so as to form a stack structure.
摘要翻译： 提供半导体器件可堆叠的半导体封装件及其制造方法。 该制造方法包括以下步骤：在基板上安装和电连接至少一个半导体芯片，将由上层电路板和下层电路板组成的电连接结构安装在基板上，并将电连接结构电连接到 衬底，其中所述半导体芯片被容纳在形成在所述电连接结构中的接收空间中; 在封装半导体芯片和电连接结构的基板上形成密封剂，并且在形成密封剂之后，用来自密封剂的多个焊盘将上层电路板的顶表面曝光，以允许至少一个半导体器件电 连接上层电路板，形成堆叠结构。
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