LDMOS HAVING SINGLE-STRIP SOURCE CONTACT AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    LDMOS HAVING SINGLE-STRIP SOURCE CONTACT AND METHOD FOR MANUFACTURING SAME 审中-公开
    具有单条线源的LDMOS接触器及其制造方法

    公开(公告)号:US20120037989A1

    公开(公告)日:2012-02-16

    申请号:US12857288

    申请日:2010-08-16

    IPC分类号: H01L29/78 H01L21/336

    摘要: LDMOS devices having a single-strip contact pad in the source region, and related methods of manufacturing are disclosed. The LDMOS may comprise a first well lightly doped with a first dopant and formed into a portion of a substrate, the first well having a drain region at its surface heavily doped with the first dopant, and a second well lightly doped with a second dopant formed in another portion of the substrate, the second well having a source region at its surface comprising first portions heavily doped with the first dopant directly adjacent second portions heavily doped with the second dopant. Also, the LDMOS device may comprise a field oxide at the upper surface of the substrate between the source and drain regions, and contacting the first well but separated from the second well, and a gate formed partially over the field oxide and partially over the source region. The LDMOS may also comprise contact pads in contact with the gate, and source and drain regions, wherein the contact pad in contact with the source regions comprises a single-strip of conductive material extending across the source region.

    摘要翻译: 公开了在源区域中具有单条接触焊盘的LDMOS器件以及相关的制造方法。 LDMOS可以包括轻掺杂有第一掺杂剂并形成衬底的一部分的第一阱,第一阱在其表面上重掺杂有第一掺杂剂的漏极区,以及轻掺杂有第二掺杂剂的第二阱 在衬底的另一部分中,第二阱在其表面处具有源极区,其包括重掺杂有第一掺杂物的第一部分,其与第二掺杂剂重掺杂的第二部分直接相邻。 此外,LDMOS器件可以在源极和漏极区域之间的衬底的上表面处包括场氧化物,并且与第一阱接触但与第二阱分离,并且部分地形成在场氧化物上并部分地在源极上形成的栅极 地区。 LDMOS还可以包括与栅极接触的接触焊盘以及源极和漏极区域,其中与源极区域接触的接触焊盘包括跨越源极区域延伸的单条导电材料。

    Hermetically sealed electrical switch assembly
    6.
    发明授权
    Hermetically sealed electrical switch assembly 有权
    密封式电气开关总成

    公开(公告)号:US06762662B2

    公开(公告)日:2004-07-13

    申请号:US09987422

    申请日:2001-11-14

    IPC分类号: H01H3514

    CPC分类号: H01H36/0073 H01H9/04

    摘要: A hermetically sealed electrical switch assembly comprises a casing having an opening end. A cover is sealingly attached to said opening end of said casing for forming a primary volume hermetically sealed from external environment. Received in said primary volume are a switch means and a magnetic responsive means. A magnetic activating means is fitted at the upper surface of said cover for effecting the movement of said magnetic responsive means. The switch means comprises electrical contacts to change the conducting state of a power circuit with which said switch means is connected, a switching lever which can change its positions according to the conducting state of the power circuit. The magnetic responsive means couples with said switching lever for moving with it.

    摘要翻译: 气密密封的电气开关组件包括具有开口端的壳体。 密封地附接到所述壳体的所述开口端的盖,用于形成从外部环境密封密封的主体积。 在所述主体积中接收的是开关装置和磁响应装置。 磁性激活装置安装在所述盖的上表面上,以实现所述磁响应装置的运动。 开关装置包括电触头,以改变与所述开关装置连接的电源电路的导通状态,切换杆可根据电源电路的导通状态改变其位置。 磁响应装置与所述切换杆耦合以与其一起移动。

    Semiconductor bio-sensors and methods of manufacturing the same
    7.
    发明授权
    Semiconductor bio-sensors and methods of manufacturing the same 有权
    半导体生物传感器及其制造方法相同

    公开(公告)号:US08357547B2

    公开(公告)日:2013-01-22

    申请号:US13538455

    申请日:2012-06-29

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method of manufacturing a semiconductor bio-sensor comprises providing a substrate, forming a first dielectric layer on the substrate, forming a patterned first conductive layer on the first dielectric layer, the patterned first conductive layer including a first portion and a pair of second portions, forming a second dielectric layer, a third dielectric layer and a fourth dielectric layer in sequence over the patterned first conductive layer, forming cavities into the fourth dielectric layer, forming vias through the cavities, exposing the second portions of the patterned first conductive layer, forming a patterned second conductive layer on the fourth dielectric layer, forming a passivation layer on the patterned second conductive layer, forming an opening to expose a portion of the third dielectric layer over the first portion of the patterned first conductive layer, and forming a chamber through the opening.

    摘要翻译: 制造半导体生物传感器的方法包括:提供衬底,在衬底上形成第一介电层,在第一电介质层上形成图案化的第一导电层,图案化的第一导电层包括第一部分和一对第二部分 在所述图案化的第一导电层上依次形成第二电介质层,第三电介质层和第四电介质层,在所述第四电介质层中形成空腔,形成通过所述空腔的通孔,暴露所述图案化的第一导电层的第二部分, 在所述第四电介质层上形成图案化的第二导电层,在所述图案化的第二导电层上形成钝化层,形成开口,以暴露所述图案化的第一导电层的所述第一部分上的所述第三电介质层的一部分, 通过开放。

    SEMICONDUCTOR BIO-SENSORS AND METHODS OF MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR BIO-SENSORS AND METHODS OF MANUFACTURING THE SAME 有权
    半导体生物传感器及其制造方法

    公开(公告)号:US20120270350A1

    公开(公告)日:2012-10-25

    申请号:US13538455

    申请日:2012-06-29

    IPC分类号: H01L21/02

    摘要: A method of manufacturing a semiconductor bio-sensor comprises providing a substrate, forming a first dielectric layer on the substrate, forming a patterned first conductive layer on the first dielectric layer, the patterned first conductive layer including a first portion and a pair of second portions, forming a second dielectric layer, a third dielectric layer and a fourth dielectric layer in sequence over the patterned first conductive layer, forming cavities into the fourth dielectric layer, forming vias through the cavities, exposing the second portions of the patterned first conductive layer, forming a patterned second conductive layer on the fourth dielectric layer, forming a passivation layer on the patterned second conductive layer, forming an opening to expose a portion of the third dielectric layer over the first portion of the patterned first conductive layer, and forming a chamber through the opening.

    摘要翻译: 制造半导体生物传感器的方法包括:提供衬底,在衬底上形成第一介电层,在第一电介质层上形成图案化的第一导电层,图案化的第一导电层包括第一部分和一对第二部分 在所述图案化的第一导电层上依次形成第二电介质层,第三电介质层和第四电介质层,在所述第四电介质层中形成空腔,通过所述空腔形成通孔,暴露所述图案化的第一导电层的第二部分, 在所述第四电介质层上形成图案化的第二导电层,在所述图案化的第二导电层上形成钝化层,形成开口,以暴露所述图案化的第一导电层的所述第一部分上的所述第三电介质层的一部分, 通过开放。

    Semiconductor bio-sensors and methods of manufacturing the same
    9.
    发明授权
    Semiconductor bio-sensors and methods of manufacturing the same 有权
    半导体生物传感器及其制造方法相同

    公开(公告)号:US08227877B2

    公开(公告)日:2012-07-24

    申请号:US12835909

    申请日:2010-07-14

    IPC分类号: H01L27/14 H01L23/58

    摘要: A method of manufacturing a semiconductor bio-sensor comprises providing a substrate, forming a first dielectric layer on the substrate, forming a patterned first conductive layer on the first dielectric layer, the patterned first conductive layer including a first portion and a pair of second portions, forming a second dielectric layer, a third dielectric layer and a fourth dielectric layer in sequence over the patterned first conductive layer, forming cavities into the fourth dielectric layer, forming vias through the cavities, exposing the second portions of the patterned first conductive layer, forming a patterned second conductive layer on the fourth dielectric layer, forming a passivation layer on the patterned second conductive layer, forming an opening to expose a portion of the third dielectric layer over the first portion of the patterned first conductive layer, and forming a chamber through the opening.

    摘要翻译: 制造半导体生物传感器的方法包括:提供衬底,在衬底上形成第一介电层,在第一电介质层上形成图案化的第一导电层,图案化的第一导电层包括第一部分和一对第二部分 在所述图案化的第一导电层上依次形成第二电介质层,第三电介质层和第四电介质层,在所述第四电介质层中形成空腔,形成通过所述空腔的通孔,暴露所述图案化的第一导电层的第二部分, 在所述第四电介质层上形成图案化的第二导电层,在所述图案化的第二导电层上形成钝化层,形成开口,以暴露所述图案化的第一导电层的所述第一部分上的所述第三电介质层的一部分, 通过开放。