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公开(公告)号:US20110049730A1
公开(公告)日:2011-03-03
申请号:US12865646
申请日:2009-01-29
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L23/28
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A device in accordance with one embodiment comprises a component (1) and an encapsulation arrangement (2) for the encapsulation of the component (1) with respect to moisture and/or oxygen, wherein the encapsulation arrangement (2) has a first layer (21) and thereabove a second layer (22) on at least one surface (19) of the component (1), the first layer (21) and the second layer (22) each comprise an inorganic material, and the second layer (22) is arranged directly on the first layer (21).
摘要翻译: 根据一个实施例的装置包括用于组件(1)相对于水分和/或氧气的封装的部件(1)和封装装置(2),其中封装装置(2)具有第一层 21),并且在组件(1)的至少一个表面(19)上方的第二层(22)上,第一层(21)和第二层(22)各自包括无机材料,并且第二层(22) )直接布置在第一层(21)上。
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公开(公告)号:US10026625B2
公开(公告)日:2018-07-17
申请号:US14150291
申请日:2014-01-08
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L23/29 , H01L21/56 , H01L23/00 , H01L23/31 , C23C16/02 , C23C16/455 , C23C16/50 , C23C16/54 , H01L31/0216 , H01L31/18 , H01L51/56 , H01L51/52 , H01L21/02 , H01L51/00
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.
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3.
公开(公告)号:US20140141549A1
公开(公告)日:2014-05-22
申请号:US14163240
申请日:2014-01-24
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L21/56 , H01L31/18 , H01L31/0216 , H01L51/56
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C.
摘要翻译: 一种用于制造包含用于封装组件的阻挡层的电子部件的方法,特别地包括以下步骤:向衬底提供至少一个功能层,通过等离子体增强原子在功能层上施加至少一个第一阻挡层 层沉积(PEALD),以及通过等离子体增强化学气相沉积(PECVD)在功能层上施加至少一个第二阻挡层,其中至少一个第一阻挡层在小于100℃的温度下被施加 。
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4.
公开(公告)号:US20150072451A1
公开(公告)日:2015-03-12
申请号:US14540670
申请日:2014-11-13
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).
摘要翻译: 一种电子部件和电子部件的制造方法,具有用于封装部件的阻挡层。 该方法包括向基板(1)提供至少一个功能层(22)和电子部件,通过无质原子层沉积(PLALD)在功能层(22)上施加至少一个第一阻挡层(3) ),以及通过等离子体增强化学蒸气沉积(PECVD)在功能层(22)上施加至少一个第二阻挡层(4)。
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5.
公开(公告)号:US08916397B2
公开(公告)日:2014-12-23
申请号:US12865346
申请日:2009-01-29
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L33/52 , H01L31/18 , H01L31/0216 , H01L23/31 , H01L51/56 , H01L21/56 , C23C16/54 , C23C16/02 , H01L51/52 , C23C16/455 , C23C16/50
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).
摘要翻译: 一种用于制造包括用于封装组件的阻挡层的电子部件的方法,特别地包括以下步骤:向衬底(1)提供至少一个功能层(22),施加至少一个第一阻挡层(3) )通过无等离子体原子层沉积(PLALD)在功能层(22)上,以及通过等离子体增强化学气相沉积(PECVD)在功能层(22)上施加至少一个第二阻挡层(4)。
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6.
公开(公告)号:US08658442B2
公开(公告)日:2014-02-25
申请号:US12865358
申请日:2009-01-29
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L21/00
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasma-enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical vapor deposition (PECVD).
摘要翻译: 一种用于制造包括用于封装组件的阻挡层的电子部件的方法,特别地包括以下步骤:向衬底(1)提供至少一个功能层(22),施加至少一个第一阻挡层(3) )通过等离子体增强原子层沉积(PEALD)在功能层(22)上,并且通过等离子体增强化学气相沉积(PECVD)在功能层(22)上施加至少一个第二阻挡层(4) )。
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7.
公开(公告)号:US20110114992A1
公开(公告)日:2011-05-19
申请号:US12865346
申请日:2009-01-29
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate (1) with at least one functional layer (22), applying at least one first barrier layer (3) on the functional layer (22) by means of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by means of plasma-enhanced chemical v0apor deposition (PECVD).
摘要翻译: 一种用于制造包括用于封装组件的阻挡层的电子部件的方法,特别地包括以下步骤:向衬底(1)提供至少一个功能层(22),施加至少一个第一阻挡层(3) )通过无等离子体原子层沉积(PLALD)在功能层(22)上,并且通过等离子体增强化学蒸气沉积(PECVD)在功能层(22)上施加至少一个第二阻挡层(4)。
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公开(公告)号:US10297469B2
公开(公告)日:2019-05-21
申请号:US14540670
申请日:2014-11-13
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L21/56 , H01L21/02 , H01L31/18 , H01L51/00 , H01L51/56 , H01L23/29 , H01L23/00 , H01L23/31 , C23C16/02 , C23C16/455 , C23C16/50 , C23C16/54 , H01L31/0216 , H01L51/52 , H01L33/62 , H01L33/48 , H01L33/54
摘要: A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).
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公开(公告)号:US09647186B2
公开(公告)日:2017-05-09
申请号:US14163240
申请日:2014-01-24
申请人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian Schmid , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C.
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公开(公告)号:US20140117569A1
公开(公告)日:2014-05-01
申请号:US14150291
申请日:2014-01-08
申请人: Christian SCHMID , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
发明人: Christian SCHMID , Tilman Schlenker , Heribert Zull , Ralph Paetzold , Markus Klein , Karsten Heuser
IPC分类号: H01L23/31
CPC分类号: H01L21/56 , C23C16/0272 , C23C16/45525 , C23C16/50 , C23C16/54 , H01L21/02274 , H01L21/02282 , H01L23/293 , H01L23/31 , H01L23/3135 , H01L23/564 , H01L31/0216 , H01L31/18 , H01L33/486 , H01L33/54 , H01L33/62 , H01L51/0001 , H01L51/5237 , H01L51/5256 , H01L51/56 , H01L2924/0002 , H01L2924/01078 , H01L2924/01079 , H01L2924/00
摘要: A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.
摘要翻译: 一种装置,其包括用于相对于水分和/或氧气封装组件的组件和封装装置,其中所述封装装置具有第一层,并且在所述组件的至少一个表面上方具有第二层,所述第一层 并且第二层各自包含无机材料,并且第二层直接布置在第一层上。
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