摘要:
An earth-boring bit has a bit body that includes head sections, each having depending bit legs with a circumferentially extending outer surface, a leading side, and a trailing side. A bearing shaft depends inwardly from each of the bit legs for mounting a cutter. The bit includes a beveled surface formed at a junction of the leading side and the outer surface of each bit leg. The beveled surface is angled relative to a radial plane emenating from the axis of the bit. The angle of the beveled surface is at least 20 degrees, and extends to an inner surface of the bit leg. The bit can also have a layer of hardfacing on the leading, trailing and shirttail surfaces of the bit leg. A diversion finger of hardfacing extends circumferentially to direct cuttings.
摘要:
An earth-boring bit has a bit body that includes head sections, each having depending bit legs with a circumferentially extending outer surface, a leading side, and a trailing side. A bearing shaft depends inwardly from each of the bit legs for mounting a cutter. The bit includes a beveled surface formed at a junction of the leading side and the outer surface of each bit leg. The beveled surface is angled relative to a radial plane emenating from the axis of the bit. The angle of the beveled surface is at least 20 degrees, and extends to an inner surface of the bit leg. The bit can also have a layer of hardfacing on the leading, trailing and shirttail surfaces of the bit leg. A diversion finger of hardfacing extends circumferentially to direct cuttings.
摘要:
A gage scraper cleans mud from the gage surface of a rotary cone of a drill bit. The bit has a body having at least one leg depending therefrom, a bearing pin secured to each leg, and a rotary cutting cone mounted to the bearing pin. The cone has a conical gage surface. The gage scraper mounts on the inside of each leg and protrudes from the leg toward the cone into close proximity with the gage surface.
摘要:
An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.
摘要:
A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.
摘要:
To program a CMOS memory, an auxiliary bipolar transistor is formed in a P-well adjacent to the P-well of an NMOS device of the CMOS memory, the auxiliary transistor being capable of forcing a large magnitude current through a fusible link, so as to program the electronic state of the CMOS memory cell into a prescribed binary (1/0) condition. A separate implant mask for the emitter region of the auxiliary transistor allows the geometry and impurity concentration profile of the emitter region to be tailored by a deep dual implant, so that the impurity concentration of the emitter region is not decreased, and yields a reduced base width for the auxiliary transistor to provide a relatively large current gain to blow the fuse, while allowing the doping parameters of the source/drain regions of the CMOS structure to be separately established to prevent thyristor latch-up.
摘要:
An integrated circuit with circuits under a bond pad. In one embodiment, the integrated circuit comprises a substrate, a top conductive layer, one or more intermediate conductive layers, layers of insulating material and devices. The top conductive layer has a at least one bonding pad and a sub-layer of relatively stiff material. The one or more intermediate conductive layers are formed between the top conductive layer and the substrate. The layers of insulating material separate the conductive layers. Moreover, one layer of the layers of insulating material is relatively hard and is located between the top conductive layer and an intermediate conductive layer closest to the top conductive layer. The devices are formed in the integrated circuit. In addition, at least the intermediate conductive layer closest to the top conductive layer is adapted for functional interconnections of select devices under the bond pad.
摘要:
A semiconductor structure is provided. In one embodiment, the structure comprises at least one active device located in a substrate and directly under a bond pad. A conductor is located between the bond pad and the substrate. The conductor has a plurality of gaps filled with insulating material. The insulating material is harder than the conductor.
摘要:
The contact for N channel devices in a CMOS process is formed by ion implanting N-type impurities through contact apertures in the dielectric layer to a depth less than the source and drain regions and a layer of conductive material is applied without intermediate etching and delineated.